World's Best Scientists 2026 revealed!

D-Index & Metrics

Mechanical and Aerospace Engineering

D-Index
60
Citations
13956
World Ranking
694
National Ranking
304

Research.com Recognitions

  • 2013 - Heat Transfer Memorial Award, The American Society of Mechanical Engineers
  • 2003 - Fellow of the American Association for the Advancement of Science (AAAS)
  • 2000 - Fellow of the American Society of Mechanical Engineers

Overview

Yogendra Joshi is affiliated with the Georgia Institute of Technology in the United States and has contributed extensively to the field of engineering, with a focus on mechanical and electrical engineering subfields. Their research spans multiple areas including mechanical engineering, electrical and electronic engineering, computational mechanics, environmental engineering, and biomedical engineering.

The scientist has focused primarily on topics related to heat transfer and optimization, heat transfer and boiling studies, heat and mass transfer in porous media, fluid dynamics and thin films, nanofluid flow and heat transfer, building energy and comfort optimization, and electric motor design and analysis.

Recent publications by Yogendra Joshi include the following:

  • Comparison of electro-thermal performance of advanced cooling techniques for electric vehicle motors, 2020, Applied Thermal Engineering
  • The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics, 2021, IEEE Transactions on Components Packaging and Manufacturing Technology
  • Thermal management of power electronics with liquid cooled metal foam heat sink, 2021, International Journal of Thermal Sciences
  • Enhancing the performance of aluminum foam heat sinks through integrated pin fins, 2020, International Journal of Heat and Mass Transfer
  • A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling, 2020, Journal of Electronic Packaging

Yogendra Joshi has collaborated frequently with several co-authors, including:

  • Jaya Benjamin
  • Guresh Kumar
  • Shiv Kumar Sarin
  • Amitav Tikadar
  • Satish Kumar

Their work is regularly published in the following venues:

  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • Journal of Electronic Packaging
  • ASME Journal of Heat and Mass Transfer
  • Applied Thermal Engineering
  • Journal of Heat Transfer

In addition to journal articles, Yogendra Joshi has contributed to book publications, notably under the Springer Nature publisher, including the book titled Recent Advances in Hybrid and Electric Automotive Technologies published in 2022.

Throughout their career, Yogendra Joshi has received several awards, including the Heat Transfer Memorial Award from The American Society of Mechanical Engineers in 2013, the distinction of Fellow of the American Association for the Advancement of Science (AAAS) in 2003, and Fellow of the American Society of Mechanical Engineers in 2000.

Best Publications

  • Thermal Challenges in Next-Generation Electronic Systems

    S.V. Garimella;A.S. Fleischer;J.Y. Murthy;A. Keshavarzi

  • Visualization of droplet departure on a superhydrophobic surface and implications to heat transfer enhancement during dropwise condensation

    C. Dietz;K. Rykaczewski;A. G. Fedorov;Y. Joshi

  • Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices

    Xiaojin Wei;Yogendra Joshi;Michael K. Patterson

  • PARAMETRIC NUMERICAL STUDY OF FLOW AND HEAT TRANSFER IN MICROCHANNELS WITH WAVY WALLS

    Liang Gong;Krishna Kota;Wenquan Tao;Yogendra Joshi

  • Experimental Heat Transfer, Fluid Mechanics, and Thermodynamics 1993.

    M. D. Kelleher;R. K. Shah;K. R. Sreenivasan;Y. Joshi

  • Single-phase liquid cooled microchannel heat sink for electronic packages

    H.Y. Zhang;D. Pinjala;T.N. Wong;K.C. Toh

  • Characterization of nanostructured thermal interface materials – A review

    Andrew J. McNamara;Yogendra Joshi;Zhuomin M. Zhang

  • Hybrid micro-nano structured thermal interfaces for pool boiling heat transfer enhancement

    S. Launay;A. G. Fedorov;Y. Joshi;A. Cao

  • Optimization study of stacked micro-channel heat sinks for micro-electronic cooling

    Xiaojin Wei;Y. Joshi

  • Thermal issues in next-generation integrated circuits

    S.P. Gurrum;S.K. Suman;Y.K. Joshi;A.G. Fedorov

  • Melting in a side heated tall enclosure by a uniformly dissipating heat source

    Debabrata Pal;Yogendra K Joshi

  • Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components

    Xiaojin Wei;Yogendra Joshi

  • Energy efficient thermal management of data centers

    Yogendra Joshi;Pramod Kumar

  • Modeling of data center airflow and heat transfer: State of the art and future trends

    Jeffrey Rambo;Yogendra Joshi

  • Thermodynamic analysis of an absorption refrigeration system with ionic-liquid/refrigerant mixture as a working fluid

    Yoon Jo Kim;Sarah Kim;Yogendra K. Joshi;Andrei G. Fedorov

  • VPM tokens: virtual machine-aware power budgeting in datacenters

    Ripal Nathuji;Karsten Schwan;Ankit Somani;Yogendra Joshi

  • High-speed visualization of boiling from an enhanced structure

    C. Ramaswamy;Y. Joshi;W. Nakayama;W.B. Johnson

  • Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux

    Yoon Jo Kim;Yogendra K. Joshi;Andrei G. Fedorov;Young-Joon Lee

  • Design and performance evaluation of a compact thermosyphon

    A. Pal;Y.K. Joshi;M.H. Beitelmal;C.D. Patel

  • Effect of Tip Clearance on the Thermal and Hydrodynamic Performance of a Shrouded Pin Fin Array

    Kevin A. Moores;Yogendra K. Joshi

Frequent Co-Authors

Andrei G. Fedorov
Andrei G. Fedorov Georgia Institute of Technology
Muhannad S. Bakir
Muhannad S. Bakir Georgia Institute of Technology
Bahgat Sammakia
Bahgat Sammakia Binghamton University
William P. King
William P. King University of Illinois at Urbana-Champaign
Avram Bar-Cohen
Avram Bar-Cohen University of Maryland, College Park
Zhuomin M. Zhang
Zhuomin M. Zhang Georgia Institute of Technology
Cyrus K. Aidun
Cyrus K. Aidun Georgia Institute of Technology
Rao Tummala
Rao Tummala Georgia Institute of Technology
Wen-Quan Tao
Wen-Quan Tao Xi'an Jiaotong University
Paul A. Kohl
Paul A. Kohl Georgia Institute of Technology

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