2013 - Heat Transfer Memorial Award, The American Society of Mechanical Engineers
2003 - Fellow of the American Association for the Advancement of Science (AAAS)
2000 - Fellow of the American Society of Mechanical Engineers
Yogendra Joshi mostly deals with Heat transfer, Mechanics, Thermodynamics, Pressure drop and Heat sink. His Heat transfer research includes elements of Microchannel, Computational fluid dynamics and Computer cooling. Yogendra Joshi has included themes like Evaporation and Thermal in his Mechanics study.
His Pressure drop research is multidisciplinary, incorporating perspectives in Electronics cooling, Optoelectronics, Raised floor, Reynolds number and Tip clearance. His Heat sink research incorporates elements of Nuclear engineering, Volumetric flow rate, Thermal resistance and Composite material, Honeycomb structure. His study in Composite material is interdisciplinary in nature, drawing from both Boiling and Electronic engineering.
His primary areas of investigation include Heat transfer, Mechanics, Mechanical engineering, Thermodynamics and Thermal. His Heat transfer research includes themes of Pressure drop and Heat sink. The concepts of his Heat sink study are interwoven with issues in Coolant, Microchannel, Thermal resistance, Composite material and Computer cooling.
His Thermal conduction research extends to Mechanics, which is thematically connected. His Mechanical engineering study incorporates themes from Passive cooling and Electronics. His research integrates issues of Optoelectronics, Thermal conductivity and Electronic engineering in his study of Thermal.
Heat transfer, Thermal, Pressure drop, Data center and Mechanics are his primary areas of study. The study incorporates disciplines such as Fin, Composite material, Flow and Heat sink in addition to Heat transfer. His Heat sink research is multidisciplinary, incorporating perspectives in Nusselt number and Thermal resistance.
As part of the same scientific family, Yogendra Joshi usually focuses on Thermal, concentrating on Mechanical engineering and intersecting with Finite element method. His Pressure drop study combines topics from a wide range of disciplines, such as Boiling, Coolant, Refrigerant, Integrated circuit and Computer cooling. His Mechanics research includes elements of Transient and Fin.
His primary areas of study are Heat transfer, Pressure drop, Thermal, Data center and Mechanics. His Heat transfer research is multidisciplinary, relying on both Convection, Heat sink, Flow, Fin and Composite material. His research in Pressure drop intersects with topics in Boiling, Fin and Heat flux.
His Thermal research is multidisciplinary, incorporating elements of Thermal conductivity, Petroleum engineering, Traction, Automotive engineering and Electronics. His Data center research also works with subjects such as
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Thermal Challenges in Next-Generation Electronic Systems
S.V. Garimella;A.S. Fleischer;J.Y. Murthy;A. Keshavarzi.
IEEE Transactions on Components and Packaging Technologies (2008)
Visualization of droplet departure on a superhydrophobic surface and implications to heat transfer enhancement during dropwise condensation
C. Dietz;K. Rykaczewski;A. G. Fedorov;Y. Joshi.
Applied Physics Letters (2010)
Experimental Heat Transfer, Fluid Mechanics, and Thermodynamics 1993.
M. D. Kelleher;R. K. Shah;K. R. Sreenivasan;Y. Joshi.
Experimental Heat Transfer, Fluid Mechanics, and Thermodynamics 1993 (1993)
Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices
Xiaojin Wei;Yogendra Joshi;Michael K. Patterson.
Journal of Heat Transfer-transactions of The Asme (2007)
Single-phase liquid cooled microchannel heat sink for electronic packages
H.Y. Zhang;D. Pinjala;T.N. Wong;K.C. Toh.
Applied Thermal Engineering (2005)
Hybrid micro-nano structured thermal interfaces for pool boiling heat transfer enhancement
S. Launay;A. G. Fedorov;Y. Joshi;A. Cao.
Microelectronics Journal (2006)
Characterization of nanostructured thermal interface materials – A review
Andrew J. McNamara;Yogendra Joshi;Zhuomin M. Zhang.
International Journal of Thermal Sciences (2012)
Optimization study of stacked micro-channel heat sinks for micro-electronic cooling
Xiaojin Wei;Y. Joshi.
IEEE Transactions on Components and Packaging Technologies (2003)
PARAMETRIC NUMERICAL STUDY OF FLOW AND HEAT TRANSFER IN MICROCHANNELS WITH WAVY WALLS
Liang Gong;Krishna Kota;Wenquan Tao;Yogendra Joshi.
Journal of Heat Transfer-transactions of The Asme (2011)
Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components
Xiaojin Wei;Yogendra Joshi.
Journal of Electronic Packaging (2004)
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