D-Index & Metrics Best Publications

D-Index & Metrics D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines.

Discipline name D-index D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines. Citations Publications World Ranking National Ranking
Mechanical and Aerospace Engineering D-index 56 Citations 10,770 479 World Ranking 477 National Ranking 241

Research.com Recognitions

Awards & Achievements

2013 - Heat Transfer Memorial Award, The American Society of Mechanical Engineers

2003 - Fellow of the American Association for the Advancement of Science (AAAS)

2000 - Fellow of the American Society of Mechanical Engineers

Overview

What is he best known for?

The fields of study he is best known for:

  • Thermodynamics
  • Mechanical engineering
  • Electrical engineering

Yogendra Joshi mostly deals with Heat transfer, Mechanics, Thermodynamics, Pressure drop and Heat sink. His Heat transfer research includes elements of Microchannel, Computational fluid dynamics and Computer cooling. Yogendra Joshi has included themes like Evaporation and Thermal in his Mechanics study.

His Pressure drop research is multidisciplinary, incorporating perspectives in Electronics cooling, Optoelectronics, Raised floor, Reynolds number and Tip clearance. His Heat sink research incorporates elements of Nuclear engineering, Volumetric flow rate, Thermal resistance and Composite material, Honeycomb structure. His study in Composite material is interdisciplinary in nature, drawing from both Boiling and Electronic engineering.

His most cited work include:

  • Thermal Challenges in Next-Generation Electronic Systems (278 citations)
  • Visualization of droplet departure on a superhydrophobic surface and implications to heat transfer enhancement during dropwise condensation (193 citations)
  • Optimization study of stacked micro-channel heat sinks for micro-electronic cooling (140 citations)

What are the main themes of his work throughout his whole career to date?

His primary areas of investigation include Heat transfer, Mechanics, Mechanical engineering, Thermodynamics and Thermal. His Heat transfer research includes themes of Pressure drop and Heat sink. The concepts of his Heat sink study are interwoven with issues in Coolant, Microchannel, Thermal resistance, Composite material and Computer cooling.

His Thermal conduction research extends to Mechanics, which is thematically connected. His Mechanical engineering study incorporates themes from Passive cooling and Electronics. His research integrates issues of Optoelectronics, Thermal conductivity and Electronic engineering in his study of Thermal.

He most often published in these fields:

  • Heat transfer (35.50%)
  • Mechanics (23.59%)
  • Mechanical engineering (21.00%)

What were the highlights of his more recent work (between 2016-2021)?

  • Heat transfer (35.50%)
  • Thermal (18.61%)
  • Pressure drop (11.90%)

In recent papers he was focusing on the following fields of study:

Heat transfer, Thermal, Pressure drop, Data center and Mechanics are his primary areas of study. The study incorporates disciplines such as Fin, Composite material, Flow and Heat sink in addition to Heat transfer. His Heat sink research is multidisciplinary, incorporating perspectives in Nusselt number and Thermal resistance.

As part of the same scientific family, Yogendra Joshi usually focuses on Thermal, concentrating on Mechanical engineering and intersecting with Finite element method. His Pressure drop study combines topics from a wide range of disciplines, such as Boiling, Coolant, Refrigerant, Integrated circuit and Computer cooling. His Mechanics research includes elements of Transient and Fin.

Between 2016 and 2021, his most popular works were:

  • Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes (24 citations)
  • Pressure drop and heat transfer characteristics of pin fin enhanced microgaps in single phase microfluidic cooling (21 citations)
  • Integrated Circuit Cooling Using Heterogeneous Micropin-Fin Arrays for Nonuniform Power Maps (21 citations)

In his most recent research, the most cited papers focused on:

  • Electrical engineering
  • Thermodynamics
  • Mechanical engineering

His primary areas of study are Heat transfer, Pressure drop, Thermal, Data center and Mechanics. His Heat transfer research is multidisciplinary, relying on both Convection, Heat sink, Flow, Fin and Composite material. His research in Pressure drop intersects with topics in Boiling, Fin and Heat flux.

His Thermal research is multidisciplinary, incorporating elements of Thermal conductivity, Petroleum engineering, Traction, Automotive engineering and Electronics. His Data center research also works with subjects such as

  • Simulation which is related to area like Airflow, Raised floor and Server,
  • Computational fluid dynamics together with Air conditioning,
  • Energy consumption together with Reuse, Mechanical engineering, Evaporative cooler, Process engineering and Exergy. His Mechanics research focuses on Refrigerant and how it connects with Heat transfer coefficient and Inlet.

This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.

Best Publications

Thermal Challenges in Next-Generation Electronic Systems

S.V. Garimella;A.S. Fleischer;J.Y. Murthy;A. Keshavarzi.
IEEE Transactions on Components and Packaging Technologies (2008)

440 Citations

Visualization of droplet departure on a superhydrophobic surface and implications to heat transfer enhancement during dropwise condensation

C. Dietz;K. Rykaczewski;A. G. Fedorov;Y. Joshi.
Applied Physics Letters (2010)

336 Citations

Experimental Heat Transfer, Fluid Mechanics, and Thermodynamics 1993.

M. D. Kelleher;R. K. Shah;K. R. Sreenivasan;Y. Joshi.
Experimental Heat Transfer, Fluid Mechanics, and Thermodynamics 1993 (1993)

247 Citations

Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices

Xiaojin Wei;Yogendra Joshi;Michael K. Patterson.
Journal of Heat Transfer-transactions of The Asme (2007)

215 Citations

Single-phase liquid cooled microchannel heat sink for electronic packages

H.Y. Zhang;D. Pinjala;T.N. Wong;K.C. Toh.
Applied Thermal Engineering (2005)

215 Citations

Hybrid micro-nano structured thermal interfaces for pool boiling heat transfer enhancement

S. Launay;A. G. Fedorov;Y. Joshi;A. Cao.
Microelectronics Journal (2006)

213 Citations

Characterization of nanostructured thermal interface materials – A review

Andrew J. McNamara;Yogendra Joshi;Zhuomin M. Zhang.
International Journal of Thermal Sciences (2012)

212 Citations

Optimization study of stacked micro-channel heat sinks for micro-electronic cooling

Xiaojin Wei;Y. Joshi.
IEEE Transactions on Components and Packaging Technologies (2003)

203 Citations

PARAMETRIC NUMERICAL STUDY OF FLOW AND HEAT TRANSFER IN MICROCHANNELS WITH WAVY WALLS

Liang Gong;Krishna Kota;Wenquan Tao;Yogendra Joshi.
Journal of Heat Transfer-transactions of The Asme (2011)

198 Citations

Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components

Xiaojin Wei;Yogendra Joshi.
Journal of Electronic Packaging (2004)

185 Citations

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