James Mckell Edwin Harper mainly investigates Sputtering, Thin film, Analytical chemistry, Layer and Composite material. James Mckell Edwin Harper interconnects Etching, Secondary ion mass spectrometry, Ion beam and Atomic physics in the investigation of issues within Sputtering. His Ion beam research includes themes of Optoelectronics and Sputter deposition.
His Thin film study integrates concerns from other disciplines, such as Substrate and Surface coating. James Mckell Edwin Harper has included themes like Silicon, Nanostructure, Transmission electron microscopy, Electrical resistivity and conductivity and Titanium in his Analytical chemistry study. His Composite material research integrates issues from Amorphous solid and Electronic engineering.
His primary areas of study are Analytical chemistry, Thin film, Metallurgy, Sputtering and Ion beam. His research in Analytical chemistry intersects with topics in Silicon, Sheet resistance, Transmission electron microscopy, Electrical resistivity and conductivity and Titanium. His work carried out in the field of Thin film brings together such families of science as Crystallography, Texture, Microstructure and Mineralogy.
He combines subjects such as Secondary ion mass spectrometry, Surface coating, Atomic physics, Etching and Substrate with his study of Sputtering. His research in Ion beam intersects with topics in Ion source, Optoelectronics and Focused ion beam. In his work, Electronic engineering and Wafer is strongly intertwined with Layer, which is a subfield of Optoelectronics.
Alloy, Metallurgy, Thin film, Analytical chemistry and Annealing are his primary areas of study. His Alloy research is multidisciplinary, relying on both Surface finish, Cobalt, Semiconductor device and Phase stability. His Metallurgy research incorporates themes from Economies of agglomeration and Phase diagram.
His work carried out in the field of Thin film brings together such families of science as Texture, Grain size, Grain growth and Copper. His study in Analytical chemistry is interdisciplinary in nature, drawing from both Excitation and Pulse. His research integrates issues of X-ray crystallography, Diffraction, Titanium alloy, Electrical resistivity and conductivity and Low resistance in his study of Annealing.
James Mckell Edwin Harper mostly deals with Metallurgy, Alloy, Surface finish, Cobalt and Annealing. His Thin film research extends to the thematically linked field of Metallurgy. His Thin film research includes elements of Crystal growth and Texture.
Surface finish is a subfield of Composite material that James Mckell Edwin Harper studies. James Mckell Edwin Harper has researched Cobalt in several fields, including Layer, Substrate, Etching and Chemical engineering. His biological study spans a wide range of topics, including Grain growth and Phase diagram.
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Mechanisms for microstructure evolution in electroplated copper thin films near room temperature
J. M. E. Harper;C. Cabral;P. C. Andricacos;L. Gignac.
Journal of Applied Physics (1999)
Copper interconnections and reliability
C.-K. Hu;J.M.E. Harper.
Materials Chemistry and Physics (1998)
Note on the origin of intrinsic stresses in films deposited via evaporation and sputtering
F.M. D'Heurle;F.M. D'Heurle;J.M.E. Harper.
Thin Solid Films (1989)
Method of electrochemical mechanical planarization
Cyprian Emeka Uzoh;James Mckell Edwin Harper.
(1997)
Technology and applications of broad-beam ion sources used in sputtering. Part I. Ion source technology
H. R. Kaufman;J. J. Cuomo;J. M. E. Harper.
Journal of Vacuum Science and Technology (1982)
Apparatus for electrochemical mechanical planarization
Mackail Edwin Harper James;Emeka Uzoo Saipryan;サイプライアン・エメカ・ウゾー;ジェイムス・マッケル・エドウィン・ハーパー.
(1997)
Technology and applications of broad-beam ion sources used in sputtering. Part II. Applications
J. M. E. Harper;J. J. Cuomo;H. R. Kaufman.
Journal of Vacuum Science and Technology (1982)
Copper interconnection structure incorporating a metal seed layer
에델스테인다니엘챨스;하퍼제임스맥켈에드윈;쿠차오-쿤;시몬앤드류에이치.
(1999)
The relationship between deposition conditions, the beta to alpha phase transformation, and stress relaxation in tantalum thin films
L. A. Clevenger;A. Mutscheller;J. M. E. Harper;C. Cabral.
Journal of Applied Physics (1992)
Modification of niobium film stress by low‐energy ion bombardment during deposition
J. J. Cuomo;J. M. E. Harper;C. R. Guarnieri;D. S. Yee.
Journal of Vacuum Science and Technology (1982)
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