James Mckell Edwin Harper

Overview

Best Publications

• Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions

  Karen Holloway;Peter M. Fryer;Cyril Cabral;J. M. E. Harper

  649
  Citations

• Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

  J. M. E. Harper;C. Cabral;P. C. Andricacos;L. Gignac

  464
  Citations

• Copper interconnections and reliability

  C.-K. Hu;J.M.E. Harper

  404
  Citations

• Note on the origin of intrinsic stresses in films deposited via evaporation and sputtering

  F.M. D'Heurle;F.M. D'Heurle;J.M.E. Harper

  390
  Citations

• Method of electrochemical mechanical planarization

  Cyprian Emeka Uzoh;James Mckell Edwin Harper

  366
  Citations

• Technology and applications of broad-beam ion sources used in sputtering. Part I. Ion source technology

  H. R. Kaufman;J. J. Cuomo;J. M. E. Harper

  343
  Citations

• Method and apparatus for planarizing workpiece

  Mackail Edwin Harper James;Emeka Uzoo Saipryan;サイプライアン・エメカ・ウゾー;ジェイムス・マッケル・エドウィン・ハーパー

  293
  Citations

• Technology and applications of broad-beam ion sources used in sputtering. Part II. Applications

  J. M. E. Harper;J. J. Cuomo;H. R. Kaufman

  280
  Citations

• The relationship between deposition conditions, the beta to alpha phase transformation, and stress relaxation in tantalum thin films

  L. A. Clevenger;A. Mutscheller;J. M. E. Harper;C. Cabral

  243
  Citations

• Modification of niobium film stress by low‐energy ion bombardment during deposition

  J. J. Cuomo;J. M. E. Harper;C. R. Guarnieri;D. S. Yee

  212
  Citations

• Thermal properties of layered transition-metal dichalcogenides at charge-density-wave transitions

  J. M. E. Harper;T. H. Geballe;F. J. DiSalvo

  180
  Citations

• Copper alloys for chip and package interconnections

  Panayotis Constantinou Andricacos;Hariklia Deligianni;James Mckell Edwin Harper;Chao-Kun Hu

  173
  Citations

• Control of thin film orientation by glancing angle ion bombardment during growth

  Lock See Yu;James M. E. Harper;Jerome J. Cuomo;David A. Smith

  172
  Citations

• Reflective spatial light modulator array

  Evan George Colgan;James Mckell Edwin Harper;Frank Benjamin Kaufman;Margaret Paggi Manny

  164
  Citations

• Alignment of thin films by glancing angle ion bombardment during deposition

  Lock See Yu;James M. E. Harper;Jerome J. Cuomo;David A. Smith

  162
  Citations

• Quantitative ion beam process for the deposition of compound thin films

  J. M. E. Harper;J. J. Cuomo;H. T. G. Hentzell

  161
  Citations

• Effects of additive elements on the phase formation and morphological stability of nickel monosilicide films

  C. Lavoie;C. Detavernier;C. Cabral;F. M. d'Heurle

  159
  Citations

• Reduction of the C54–TiSi2 phase transformation temperature using refractory metal ion implantation

  R. W. Mann;G. L. Miles;T. A. Knotts;D. W. Rakowski

  151
  Citations

• On the use of alloying elements for Cu interconnect applications

  K. Barmak;C. Cabral;K. P. Rodbell;J. M. E. Harper

  144
  Citations

• Copper alloy metallurgies for VLSI interconnection structures

  James Mckell Edwin Harper;Karen Lynne Holloway;Thomas Yu-Kiu Kwok

  142
  Citations

• Higher nitrides of hafnium, zirconium, and titanium synthesized by dual ion beam deposition

  B. O. Johansson;H. T. G. Hentzell;J. M. E. Harper;J. J. Cuomo

  141
  Citations