James Mckell Edwin Harper

James Mckell Edwin Harper publication distribution in Materials Science in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Materials Science in 2026. The highlighted bar marks where James Mckell Edwin Harper sits on this spectrum.

James Mckell Edwin Harper D-index placement in Materials Science in 2026

The chart shows the D-index (discipline H-index) distribution of Materials Science scientists ranked by Research.com in 2026. The highlighted bar marks where James Mckell Edwin Harper sits on this spectrum.

Overview

Best Publications

• Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions

  Karen Holloway;Peter M. Fryer;Cyril Cabral;J. M. E. Harper

  649
  Citations

• Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

  J. M. E. Harper;C. Cabral;P. C. Andricacos;L. Gignac

  464
  Citations

• Copper interconnections and reliability

  C.-K. Hu;J.M.E. Harper

  404
  Citations

• Note on the origin of intrinsic stresses in films deposited via evaporation and sputtering

  F.M. D'Heurle;F.M. D'Heurle;J.M.E. Harper

  390
  Citations

• Method of electrochemical mechanical planarization

  Cyprian Emeka Uzoh;James Mckell Edwin Harper

  366
  Citations

• Technology and applications of broad-beam ion sources used in sputtering. Part I. Ion source technology

  H. R. Kaufman;J. J. Cuomo;J. M. E. Harper

  343
  Citations

• Method and apparatus for planarizing workpiece

  Mackail Edwin Harper James;Emeka Uzoo Saipryan;サイプライアン・エメカ・ウゾー;ジェイムス・マッケル・エドウィン・ハーパー

  293
  Citations

• Technology and applications of broad-beam ion sources used in sputtering. Part II. Applications

  J. M. E. Harper;J. J. Cuomo;H. R. Kaufman

  280
  Citations

• The relationship between deposition conditions, the beta to alpha phase transformation, and stress relaxation in tantalum thin films

  L. A. Clevenger;A. Mutscheller;J. M. E. Harper;C. Cabral

  243
  Citations

• Modification of niobium film stress by low‐energy ion bombardment during deposition

  J. J. Cuomo;J. M. E. Harper;C. R. Guarnieri;D. S. Yee

  212
  Citations

• Thermal properties of layered transition-metal dichalcogenides at charge-density-wave transitions

  J. M. E. Harper;T. H. Geballe;F. J. DiSalvo

  180
  Citations

• Copper alloys for chip and package interconnections

  Panayotis Constantinou Andricacos;Hariklia Deligianni;James Mckell Edwin Harper;Chao-Kun Hu

  173
  Citations

• Control of thin film orientation by glancing angle ion bombardment during growth

  Lock See Yu;James M. E. Harper;Jerome J. Cuomo;David A. Smith

  172
  Citations

• Reflective spatial light modulator array

  Evan George Colgan;James Mckell Edwin Harper;Frank Benjamin Kaufman;Margaret Paggi Manny

  164
  Citations

• Alignment of thin films by glancing angle ion bombardment during deposition

  Lock See Yu;James M. E. Harper;Jerome J. Cuomo;David A. Smith

  162
  Citations

• Quantitative ion beam process for the deposition of compound thin films

  J. M. E. Harper;J. J. Cuomo;H. T. G. Hentzell

  161
  Citations

• Effects of additive elements on the phase formation and morphological stability of nickel monosilicide films

  C. Lavoie;C. Detavernier;C. Cabral;F. M. d'Heurle

  159
  Citations

• Reduction of the C54–TiSi2 phase transformation temperature using refractory metal ion implantation

  R. W. Mann;G. L. Miles;T. A. Knotts;D. W. Rakowski

  151
  Citations

• On the use of alloying elements for Cu interconnect applications

  K. Barmak;C. Cabral;K. P. Rodbell;J. M. E. Harper

  144
  Citations

• Copper alloy metallurgies for VLSI interconnection structures

  James Mckell Edwin Harper;Karen Lynne Holloway;Thomas Yu-Kiu Kwok

  142
  Citations

• Higher nitrides of hafnium, zirconium, and titanium synthesized by dual ion beam deposition

  B. O. Johansson;H. T. G. Hentzell;J. M. E. Harper;J. J. Cuomo

  141
  Citations