D-Index & Metrics Best Publications
James Mckell Edwin Harper

James Mckell Edwin Harper

D-Index & Metrics D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines.

Discipline name D-index D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines. Citations Publications World Ranking National Ranking
Materials Science D-index 43 Citations 6,877 150 World Ranking 9164 National Ranking 2357

Overview

What is he best known for?

The fields of study he is best known for:

  • Semiconductor
  • Composite material
  • Aluminium

James Mckell Edwin Harper mainly investigates Sputtering, Thin film, Analytical chemistry, Layer and Composite material. James Mckell Edwin Harper interconnects Etching, Secondary ion mass spectrometry, Ion beam and Atomic physics in the investigation of issues within Sputtering. His Ion beam research includes themes of Optoelectronics and Sputter deposition.

His Thin film study integrates concerns from other disciplines, such as Substrate and Surface coating. James Mckell Edwin Harper has included themes like Silicon, Nanostructure, Transmission electron microscopy, Electrical resistivity and conductivity and Titanium in his Analytical chemistry study. His Composite material research integrates issues from Amorphous solid and Electronic engineering.

His most cited work include:

  • Mechanisms for microstructure evolution in electroplated copper thin films near room temperature (304 citations)
  • Method of electrochemical mechanical planarization (240 citations)
  • Note on the origin of intrinsic stresses in films deposited via evaporation and sputtering (236 citations)

What are the main themes of his work throughout his whole career to date?

His primary areas of study are Analytical chemistry, Thin film, Metallurgy, Sputtering and Ion beam. His research in Analytical chemistry intersects with topics in Silicon, Sheet resistance, Transmission electron microscopy, Electrical resistivity and conductivity and Titanium. His work carried out in the field of Thin film brings together such families of science as Crystallography, Texture, Microstructure and Mineralogy.

He combines subjects such as Secondary ion mass spectrometry, Surface coating, Atomic physics, Etching and Substrate with his study of Sputtering. His research in Ion beam intersects with topics in Ion source, Optoelectronics and Focused ion beam. In his work, Electronic engineering and Wafer is strongly intertwined with Layer, which is a subfield of Optoelectronics.

He most often published in these fields:

  • Analytical chemistry (31.76%)
  • Thin film (26.47%)
  • Metallurgy (25.88%)

What were the highlights of his more recent work (between 2001-2004)?

  • Alloy (17.65%)
  • Metallurgy (25.88%)
  • Thin film (26.47%)

In recent papers he was focusing on the following fields of study:

Alloy, Metallurgy, Thin film, Analytical chemistry and Annealing are his primary areas of study. His Alloy research is multidisciplinary, relying on both Surface finish, Cobalt, Semiconductor device and Phase stability. His Metallurgy research incorporates themes from Economies of agglomeration and Phase diagram.

His work carried out in the field of Thin film brings together such families of science as Texture, Grain size, Grain growth and Copper. His study in Analytical chemistry is interdisciplinary in nature, drawing from both Excitation and Pulse. His research integrates issues of X-ray crystallography, Diffraction, Titanium alloy, Electrical resistivity and conductivity and Low resistance in his study of Annealing.

Between 2001 and 2004, his most popular works were:

  • Picosecond ultrasonics study of the vibrational modes of a nanostructure (80 citations)
  • Effects of alloying elements on cobalt silicide formation (51 citations)
  • Method and structure for controlling the interface roughness of cobalt disilicide (33 citations)

In his most recent research, the most cited papers focused on:

  • Semiconductor
  • Composite material
  • Aluminium

James Mckell Edwin Harper mostly deals with Metallurgy, Alloy, Surface finish, Cobalt and Annealing. His Thin film research extends to the thematically linked field of Metallurgy. His Thin film research includes elements of Crystal growth and Texture.

Surface finish is a subfield of Composite material that James Mckell Edwin Harper studies. James Mckell Edwin Harper has researched Cobalt in several fields, including Layer, Substrate, Etching and Chemical engineering. His biological study spans a wide range of topics, including Grain growth and Phase diagram.

This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.

Best Publications

Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

J. M. E. Harper;C. Cabral;P. C. Andricacos;L. Gignac.
Journal of Applied Physics (1999)

446 Citations

Copper interconnections and reliability

C.-K. Hu;J.M.E. Harper.
Materials Chemistry and Physics (1998)

379 Citations

Note on the origin of intrinsic stresses in films deposited via evaporation and sputtering

F.M. D'Heurle;F.M. D'Heurle;J.M.E. Harper.
Thin Solid Films (1989)

368 Citations

Method of electrochemical mechanical planarization

Cyprian Emeka Uzoh;James Mckell Edwin Harper.
(1997)

366 Citations

Technology and applications of broad-beam ion sources used in sputtering. Part I. Ion source technology

H. R. Kaufman;J. J. Cuomo;J. M. E. Harper.
Journal of Vacuum Science and Technology (1982)

332 Citations

Apparatus for electrochemical mechanical planarization

Mackail Edwin Harper James;Emeka Uzoo Saipryan;サイプライアン・エメカ・ウゾー;ジェイムス・マッケル・エドウィン・ハーパー.
(1997)

286 Citations

Technology and applications of broad-beam ion sources used in sputtering. Part II. Applications

J. M. E. Harper;J. J. Cuomo;H. R. Kaufman.
Journal of Vacuum Science and Technology (1982)

273 Citations

Copper interconnection structure incorporating a metal seed layer

에델스테인다니엘챨스;하퍼제임스맥켈에드윈;쿠차오-쿤;시몬앤드류에이치.
(1999)

226 Citations

The relationship between deposition conditions, the beta to alpha phase transformation, and stress relaxation in tantalum thin films

L. A. Clevenger;A. Mutscheller;J. M. E. Harper;C. Cabral.
Journal of Applied Physics (1992)

223 Citations

Modification of niobium film stress by low‐energy ion bombardment during deposition

J. J. Cuomo;J. M. E. Harper;C. R. Guarnieri;D. S. Yee.
Journal of Vacuum Science and Technology (1982)

211 Citations

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