World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
51
Citations
11466
World Ranking
2634
National Ranking
75

Joungho Kim publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Joungho Kim sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 656 publications — 93rd percentile

93% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Joungho Kim D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Joungho Kim sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 51 D-Index — 63rd percentile

63% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

Joungho Kim is affiliated with the Korea Advanced Institute of Science and Technology in South Korea. Their research is primarily situated within the field of Engineering, with a strong emphasis on Electrical and Electronic Engineering. Additional subfields addressed in their work include Hardware and Architecture, Biomedical Engineering, Artificial Intelligence, and Atomic and Molecular Physics, and Optics.

The scientist has contributed extensively to various specialized topics, notably:

  • 3D IC and TSV technologies
  • Electromagnetic Compatibility and Noise Suppression
  • Electronic Packaging and Soldering Technologies
  • VLSI and FPGA Design Techniques
  • Wireless Power Transfer Systems
  • Energy Harvesting in Wireless Networks
  • VLSI and Analog Circuit Testing

Publication venues where Joungho Kim frequently appears include:

  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • IEEE Transactions on Electromagnetic Compatibility
  • arXiv (Cornell University)
  • IEEE Transactions on Microwave Theory and Techniques
  • Journal of Advanced Joining Processes

The following recent papers reflect some of the scientist's current research interests:

  • "Deep Reinforcement Learning-Based Optimal Decoupling Capacitor Design Method for Silicon Interposer-Based 2.5-D/3-D ICs," 2020, IEEE Transactions on Components Packaging and Manufacturing Technology
  • "Learning Collaborative Policies to Solve NP-hard Routing Problems," 2021, arXiv (Cornell University)
  • "Transformer Network-Based Reinforcement Learning Method for Power Distribution Network (PDN) Optimization of High Bandwidth Memory (HBM)," 2022, IEEE Transactions on Microwave Theory and Techniques
  • "A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System," 2020, IEEE Transactions on Electromagnetic Compatibility
  • "Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme," 2021, IEEE Transactions on Components Packaging and Manufacturing Technology

Joungho Kim collaborates with several researchers in their field. Frequent coauthors include:

  • Hyunwook Park
  • Youngwoo Kim
  • Seongguk Kim
  • Boogyo Sim
  • Taein Shin

Best Publications

  • Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System

    Jiseong Kim;Jonghoon Kim;Sunkyu Kong;Hongseok Kim

  • High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

    Joohee Kim;Jun So Pak;Jonghyun Cho;Eakhwan Song

  • Power distribution networks for system-on-package: status and challenges

    M. Swaminathan;Joungho Kim;I. Novak;J.P. Libous

  • Design and Analysis of a Resonant Reactive Shield for a Wireless Power Electric Vehicle

    Seonghwan Kim;Hyun-Ho Park;Jonghoon Kim;Jingook Kim

  • Development and Evaluation of 3-D SiP with Vertically Interconnected Through Silicon Vias (TSV)

    Dong Min Jang;Chunghyun Ryu;Kwang Yong Lee;Byeong Hoon Cho

  • Coil Design and Measurements of Automotive Magnetic Resonant Wireless Charging System for High-Efficiency and Low Magnetic Field Leakage

    Hongseok Kim;Chiuk Song;Dong-Hyun Kim;Daniel H. Jung

  • 3D-MAPS: 3D Massively parallel processor with stacked memory

    Dae Hyun Kim;Krit Athikulwongse;Michael Healy;Mohammad Hossain

  • Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

    Er-Ping Li;Xing-Chang Wei;Andreas C Cangellaris;En-Xiao Liu

  • Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

    Jonghyun Cho;Eakhwan Song;Kihyun Yoon;Jun So Pak

  • Magnetic field design for high efficient and low EMF wireless power transfer in on-line electric vehicle

    Seungyoung Ahn;Joungho Kim

  • PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

    Jun So Pak;Joohee Kim;Jonghyun Cho;Kiyeong Kim

  • EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger Using Tightly Coupled Three-Phase Resonant Magnetic Field

    Chiuk Song;Hongseok Kim;Youngwoo Kim;Donghyun Kim

  • Low frequency electromagnetic field reduction techniques for the On-Line Electric Vehicle (OLEV)

    Seungyoung Ahn;Junso Pak;Taigon Song;Heejae Lee

  • Circuital Modeling and Measurement of Shielding Effectiveness Against Oblique Incident Plane Wave on Apertures in Multiple Sides of Rectangular Enclosure

    Jongjoo Shim;Dong Gun Kam;Jong Hwa Kwon;Joungho Kim

  • Electrical characterization of trough silicon via (TSV) depending on structural and material parameters based on 3D full wave simulation

    Jun So Pak;Chunghyun Ryu;Joungho Kim

  • Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method

    Jaemin Kim;Woojin Lee;Yujeong Shim;Jongjoo Shim

  • Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC

    Chang Liu;Taigon Song;Jonghyun Cho;Joohee Kim

  • Thin Hybrid Metamaterial Slab With Negative and Zero Permeability for High Efficiency and Low Electromagnetic Field in Wireless Power Transfer Systems

    Yeonje Cho;Seongsoo Lee;Dong-Hyun Kim;Hongseok Kim

  • High Frequency Electrical Model of Through Wafer Via for 3-D Stacked Chip Packaging

    Chunghyun Ryu;Jiwang Lee;Hyein Lee;Kwangyong Lee

  • Controlled generation of submicron emulsion droplets via highly stable tip-streaming mode in microfluidic devices

    Woong-Chan Jeong;Jong-Min Lim;Jae-Hoon Choi;Jong-Hoon Kim

  • Modeling and measurement of simultaneous switching noise coupling through signal via transition

    Jongbae Park;Hyungsoo Kim;Youchul Jeong;Jingook Kim

Frequent Co-Authors

Seungyoung Ahn
Seungyoung Ahn Korea Advanced Institute of Science and Technology
Dong-Hyun Kim
Dong-Hyun Kim Kyung Hee University
HyunWook Park
HyunWook Park Korea Advanced Institute of Science and Technology
Rao Tummala
Rao Tummala Georgia Institute of Technology
Jun Fan
Jun Fan Missouri University of Science and Technology
Antonio Orlandi
Antonio Orlandi University of L'Aquila
Dong-Ho Cho
Dong-Ho Cho Korea Advanced Institute of Science and Technology
Madhavan Swaminathan
Madhavan Swaminathan Pennsylvania State University
Hoi-Jun Yoo
Hoi-Jun Yoo Korea Advanced Institute of Science and Technology
James L. Drewniak
James L. Drewniak Missouri University of Science and Technology

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