World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
51
Citations
11466
World Ranking
2634
National Ranking
75

Overview

Joungho Kim is affiliated with the Korea Advanced Institute of Science and Technology in South Korea. Their research is primarily situated within the field of Engineering, with a strong emphasis on Electrical and Electronic Engineering. Additional subfields addressed in their work include Hardware and Architecture, Biomedical Engineering, Artificial Intelligence, and Atomic and Molecular Physics, and Optics.

The scientist has contributed extensively to various specialized topics, notably:

  • 3D IC and TSV technologies
  • Electromagnetic Compatibility and Noise Suppression
  • Electronic Packaging and Soldering Technologies
  • VLSI and FPGA Design Techniques
  • Wireless Power Transfer Systems
  • Energy Harvesting in Wireless Networks
  • VLSI and Analog Circuit Testing

Publication venues where Joungho Kim frequently appears include:

  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • IEEE Transactions on Electromagnetic Compatibility
  • arXiv (Cornell University)
  • IEEE Transactions on Microwave Theory and Techniques
  • Journal of Advanced Joining Processes

The following recent papers reflect some of the scientist's current research interests:

  • "Deep Reinforcement Learning-Based Optimal Decoupling Capacitor Design Method for Silicon Interposer-Based 2.5-D/3-D ICs," 2020, IEEE Transactions on Components Packaging and Manufacturing Technology
  • "Learning Collaborative Policies to Solve NP-hard Routing Problems," 2021, arXiv (Cornell University)
  • "Transformer Network-Based Reinforcement Learning Method for Power Distribution Network (PDN) Optimization of High Bandwidth Memory (HBM)," 2022, IEEE Transactions on Microwave Theory and Techniques
  • "A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System," 2020, IEEE Transactions on Electromagnetic Compatibility
  • "Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme," 2021, IEEE Transactions on Components Packaging and Manufacturing Technology

Joungho Kim collaborates with several researchers in their field. Frequent coauthors include:

  • Hyunwook Park
  • Youngwoo Kim
  • Seongguk Kim
  • Boogyo Sim
  • Taein Shin

Best Publications

  • Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System

    Jiseong Kim;Jonghoon Kim;Sunkyu Kong;Hongseok Kim

  • High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

    Joohee Kim;Jun So Pak;Jonghyun Cho;Eakhwan Song

  • Power distribution networks for system-on-package: status and challenges

    M. Swaminathan;Joungho Kim;I. Novak;J.P. Libous

  • Design and Analysis of a Resonant Reactive Shield for a Wireless Power Electric Vehicle

    Seonghwan Kim;Hyun-Ho Park;Jonghoon Kim;Jingook Kim

  • Development and Evaluation of 3-D SiP with Vertically Interconnected Through Silicon Vias (TSV)

    Dong Min Jang;Chunghyun Ryu;Kwang Yong Lee;Byeong Hoon Cho

  • Coil Design and Measurements of Automotive Magnetic Resonant Wireless Charging System for High-Efficiency and Low Magnetic Field Leakage

    Hongseok Kim;Chiuk Song;Dong-Hyun Kim;Daniel H. Jung

  • 3D-MAPS: 3D Massively parallel processor with stacked memory

    Dae Hyun Kim;Krit Athikulwongse;Michael Healy;Mohammad Hossain

  • Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

    Er-Ping Li;Xing-Chang Wei;Andreas C Cangellaris;En-Xiao Liu

  • Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

    Jonghyun Cho;Eakhwan Song;Kihyun Yoon;Jun So Pak

  • Magnetic field design for high efficient and low EMF wireless power transfer in on-line electric vehicle

    Seungyoung Ahn;Joungho Kim

  • PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

    Jun So Pak;Joohee Kim;Jonghyun Cho;Kiyeong Kim

  • EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger Using Tightly Coupled Three-Phase Resonant Magnetic Field

    Chiuk Song;Hongseok Kim;Youngwoo Kim;Donghyun Kim

  • Low frequency electromagnetic field reduction techniques for the On-Line Electric Vehicle (OLEV)

    Seungyoung Ahn;Junso Pak;Taigon Song;Heejae Lee

  • Circuital Modeling and Measurement of Shielding Effectiveness Against Oblique Incident Plane Wave on Apertures in Multiple Sides of Rectangular Enclosure

    Jongjoo Shim;Dong Gun Kam;Jong Hwa Kwon;Joungho Kim

  • Electrical characterization of trough silicon via (TSV) depending on structural and material parameters based on 3D full wave simulation

    Jun So Pak;Chunghyun Ryu;Joungho Kim

  • Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method

    Jaemin Kim;Woojin Lee;Yujeong Shim;Jongjoo Shim

  • Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC

    Chang Liu;Taigon Song;Jonghyun Cho;Joohee Kim

  • Thin Hybrid Metamaterial Slab With Negative and Zero Permeability for High Efficiency and Low Electromagnetic Field in Wireless Power Transfer Systems

    Yeonje Cho;Seongsoo Lee;Dong-Hyun Kim;Hongseok Kim

  • High Frequency Electrical Model of Through Wafer Via for 3-D Stacked Chip Packaging

    Chunghyun Ryu;Jiwang Lee;Hyein Lee;Kwangyong Lee

  • Controlled generation of submicron emulsion droplets via highly stable tip-streaming mode in microfluidic devices

    Woong-Chan Jeong;Jong-Min Lim;Jae-Hoon Choi;Jong-Hoon Kim

  • Modeling and measurement of simultaneous switching noise coupling through signal via transition

    Jongbae Park;Hyungsoo Kim;Youchul Jeong;Jingook Kim

Frequent Co-Authors

Rao Tummala
Rao Tummala Georgia Institute of Technology
Jun Fan
Jun Fan Missouri University of Science and Technology
Antonio Orlandi
Antonio Orlandi University of L'Aquila
Dong-Ho Cho
Dong-Ho Cho Korea Advanced Institute of Science and Technology
Madhavan Swaminathan
Madhavan Swaminathan Pennsylvania State University
James L. Drewniak
James L. Drewniak Missouri University of Science and Technology
Sung Kyu Lim
Sung Kyu Lim Georgia Institute of Technology
Hoi-Jun Yoo
Hoi-Jun Yoo Korea Advanced Institute of Science and Technology
Gyu-Hyeong Cho
Gyu-Hyeong Cho Korea Advanced Institute of Science and Technology
Jonghoon Kim
Jonghoon Kim Chungnam National University

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