Nikhilesh Chawla

Research.com Recognitions

• 2008 - ASM Fellow For significant contribution and analytical modeling of fatigue behavior of materials and innovative characterization of single and multiphase microstructures.

Overview

Best Publications

• Mechanical Behavior of Particle Reinforced Metal Matrix Composites

  Nikhilesh Chawla;Yu Lin Shen

  936
  Citations

• Tensile behavior of high performance natural (sisal) fibers

  Flavio de Andrade Silva;Nikhilesh Chawla;Romildo Dias de Toledo Filho

  447
  Citations

• Microstructure and mechanical behavior of porous sintered steels

  Nikhilesh Chawla;X. Deng

  427
  Citations

• Metal Matrix Composites

  Nikhilesh Chawla;Krishan Kumar Chawla

  390
  Citations

• Deformation behavior of (Cu, Ag)–Sn intermetallics by nanoindentation

  X. Deng;Nikhilesh Chawla;K. K. Chawla;M. Koopman

  386
  Citations

• Three-dimensional visualization and microstructure-based modeling of deformation in particle-reinforced composites

  Nikhilesh Chawla;R. S. Sidhu;V. V. Ganesh

  360
  Citations

• Microstructure and deformation behavior of biocompatible TiO2 nanotubes on titanium substrate.

  G. A. Crawford;Nikhilesh Chawla;K. Das;S. Bose

  325
  Citations

• Effect of SiC volume fraction and particle size on the fatigue resistance of a 2080 Al/SiCp composite

  N. Chawla;C. Andres;J. W. Jones;J. E. Allison

  304
  Citations

• Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales

  M. Kerr;Nikhilesh Chawla

  298
  Citations

• Three-dimensional (3D) microstructure visualization and finite element modeling of the mechanical behavior of SiC particle reinforced aluminum composites

  Nikhilesh Chawla;V. V. Ganesh;B. Wunsch

  286
  Citations

• Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder

  F. Ochoa;J. J. Williams;Nikhilesh Chawla

  259
  Citations

• Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints

  X. Deng;R. S. Sidhu;P. Johnson;Nikhilesh Chawla

  236
  Citations

• Young's modulus of (Cu, Ag)-Sn intermetallics measured by nanoindentation

  X. Deng;M. Koopman;Nikhilesh Chawla;K. K. Chawla

  221
  Citations

• Effect of particle orientation anisotropy on the tensile behavior of metal matrix composites: experiments and microstructure-based simulation

  V. V. Ganesh;Nikhilesh Chawla

  220
  Citations

• Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints

  X. Deng;G. Piotrowski;J. J. Williams;Nikhilesh Chawla

  204
  Citations

• The influence of microencapsulated phase change material (PCM) characteristics on the microstructure and strength of cementitious composites: Experiments and finite element simulations

  Matthew Aguayo;Sumanta Das;Amit Maroli;Nihat Kabay;Nihat Kabay

  194
  Citations

• Microstructure-based modeling of the deformation behavior of particle reinforced metal matrix composites

  Nikhilesh Chawla;K. K. Chawla

  189
  Citations

• Metal-matrix composites in ground transportation

  Nikhilesh Chawla;K. K. Chawla

  186
  Citations

• Microstructure-based modeling of crack growth in particle reinforced composites

  A. Ayyar;Nikhilesh Chawla

  185
  Citations

• Effects of cooling rate on creep behavior of a Sn-3.5Ag alloy

  F. Ochoa;X. Deng;Nikhilesh Chawla

  168
  Citations