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G. Van der Plas

G. Van der Plas

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
36
Citations
7080
World Ranking
5275
National Ranking
112

Overview

G. Van der Plas is affiliated with Imec in Belgium and focuses primarily on engineering, with a specialization in electrical and electronic engineering. Their research encompasses several subfields including atomic and molecular physics, industrial and manufacturing engineering, aerospace engineering, and hardware and architecture.

The scientist's work spans multiple topics related to semiconductor technology and electronic engineering. Key areas of research include:

  • 3D IC and TSV technologies
  • Semiconductor materials and devices
  • Advancements in Semiconductor Devices and Circuit Design
  • Electromagnetic Compatibility and Noise Suppression
  • Electronic Packaging and Soldering Technologies
  • Electromagnetic Scattering and Analysis
  • Electromagnetic Simulation and Numerical Methods

Van der Plas has contributed to several papers over recent years, published in notable venues. Some recent publications include:

  • "Buried Power Rails and Nano-Scale TSV: Technology Boosters for Backside Power Delivery Network and 3D Heterogeneous Integration," 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • "3D SoC integration, beyond 2.5D chiplets," 2021, 2021 IEEE International Electron Devices Meeting (IEDM)
  • "Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network," 2022, 2022 International Electron Devices Meeting (IEDM)
  • "Entire Domain Basis Function Expansion of the Differential Surface Admittance for Efficient Broadband Characterization of Lossy Interconnects," 2020, IEEE Transactions on Microwave Theory and Techniques
  • "Package level thermal analysis of backside power delivery network (BS-PDN) configurations," 2022, 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

Work by Van der Plas commonly appears in venues such as:

  • 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • 2021 IEEE International Electron Devices Meeting (IEDM)
  • IEEE Transactions on Microwave Theory and Techniques

Frequent collaborators include:

  • Eric Beyne
  • Dragomir Milojevic
  • Xiao Sun
  • Anne Jourdain
  • A. Veloso

The scientist's contributions are primarily concentrated on advancing knowledge in three-dimensional integrated circuits, heterogeneous integration, efficient power delivery networks, and thermal management techniques. They have also worked on electromagnetic characterization and simulation methods applicable to electronic interconnects.

Best Publications

  • Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

    G Van der Plas;P Limaye;I Loi;A Mercha

  • A 14-bit intrinsic accuracy Q/sup 2/ random walk CMOS DAC

    G.A.M. Van Der Plas;J. Vandenbussche;W. Sansen;M.S.J. Steyaert

  • Noise Analysis of Regenerative Comparators for Reconfigurable ADC Architectures

    P. Nuzzo;F. De Bernardinis;P. Terreni;G. Van der Plas

  • A 65fJ/Conversion-Step 0-to-50MS/s 0-to-0.7mW 9b Charge-Sharing SAR ADC in 90nm Digital CMOS

    J. Craninckx;G. Van der Plas

  • A 0.16pJ/Conversion-Step 2.5mW 1.25GS/s 4b ADC in a 90nm Digital CMOS Process

    G. Van der Plas;S. Decoutere;S. Donnay

  • Ultra-wide-band transmitter for low-power wireless body area networks: design and evaluation

    J. Ryckaert;C. Desset;A. Fort;M. Badaroglu

  • An 820μW 9b 40MS/s Noise-Tolerant Dynamic-SAR ADC in 90nm Digital CMOS

    V. Giannini;P. Nuzzo;V. Chironi;A. Baschirotto

  • AMGIE-A synthesis environment for CMOS analog integrated circuits

    G. Van der Plas;G. Debyser;F. Leyn;K. Lampaert

  • A 0.65-to-1.4 nJ/Burst 3-to-10 GHz UWB All-Digital TX in 90 nm CMOS for IEEE 802.15.4a

    J. Ryckaert;G. Van der Plas;V. De Heyn;C. Desset

  • A CMOS 18 THz/spl Omega/ 248 Mb/s transimpedance amplifier and 155 Mb/s LED-driver for low cost optical fiber links

    M. Ingels;G. Van Der Plas;J. Crols;M. Steyaert

  • Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performance

    A. Mercha;G. Van der Plas;V. Moroz;I. De Wolf

  • A layout-aware synthesis methodology for RF circuits

    P. Vancorenland;G. Van der Plas;M. Steyaert;G. Gielen

  • A CMOS multi-parameter biochemical microsensor with temperature control and signal interfacing

    E.Y. Lauwers;J. Suls;G. Van Der Plas;E. Peeters

  • A 2.4 GHz Low-Power Sixth-Order RF Bandpass $\Delta\Sigma$ Converter in CMOS

    J. Ryckaert;J. Borremans;B. Verbruggen;L. Bos

  • A 2.2 mW 1.75 GS/s 5 Bit Folding Flash ADC in 90 nm Digital CMOS

    B. Verbruggen;J. Craninckx;M. Kuijk;P. Wambacq

  • A 150 MS/s 133 $~\mu$ W 7 bit ADC in 90 nm Digital CMOS

    G. Van der Plas;B. Verbruggen

  • CYCLONE: automated design and layout of RF LC-oscillators

    C.R.C. De Ranter;G. Van der Plas;M.S.J. Steyaert;G.G.E. Gielen

  • A 2.2mW 5b 1.75GS/s Folding Flash ADC in 90nm Digital CMOS

    B. Verbruggen;J. Craninckx;M. Kuijk;P. Wambacq

  • A CMOS Ultra-Wideband Receiver for Low Data-Rate Communication

    J. Ryckaert;M. Verhelst;M. Badaroglu;S. D'Amico

  • RF-to-Baseband Digitization in 40 nm CMOS With RF Bandpass $\Delta\Sigma$ Modulator and Polyphase Decimation Filter

    E. Martens;A. Bourdoux;A. Couvreur;R. Fasthuber

Frequent Co-Authors

Piet Wambacq
Piet Wambacq Vrije Universiteit Brussel
I. De Wolf
I. De Wolf KU Leuven
Willy Sansen
Willy Sansen KU Leuven
Yves Rolain
Yves Rolain Vrije Universiteit Brussel
Gerd Vandersteen
Gerd Vandersteen Vrije Universiteit Brussel

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