World's Best Scientists 2026 revealed!
I. De Wolf

I. De Wolf

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
51
Citations
11532
World Ranking
2632
National Ranking
61

Overview

I. De Wolf is affiliated with KU Leuven in Belgium and has a research portfolio primarily situated within the field of Engineering. Their work extensively covers Electrical and Electronic Engineering, supplemented by contributions in Atomic and Molecular Physics, Biomedical Engineering, Electronic, Optical and Magnetic Materials, and Materials Chemistry.

The scientist's research topics include Semiconductor materials and devices, Advancements in Semiconductor Devices and Circuit Design, Integrated Circuits and Semiconductor Failure Analysis, Copper Interconnects and Reliability, Photonic and Optical Devices, 3D IC and TSV technologies, and Semiconductor materials and interfaces.

Among I. De Wolf's recent papers are the following:

  • "Properties of ultrathin molybdenum films for interconnect applications" (2022) published in Materialia
  • "Thermal Modelling of Silicon Photonic Ring Modulator with Substrate Undercut" (2022) published in Journal of Lightwave Technology
  • "Nozzle scaling effects for the thermohydraulic performance of microjet impingement cooling with distributed returns" (2020) published in Applied Thermal Engineering
  • "A methodology for mechanical stress and wafer warpage minimization during 3D NAND fabrication" (2021) published in Microelectronic Engineering
  • "Hot-Electron-Induced Punch-Through (HEIP) Effect in p-MOSFET Enhanced by Mechanical Stress" (2021) published in IEEE Electron Device Letters

The scientist collaborates frequently with other researchers, including Herman Oprins, Joris Van Campenhout, David Coenen, Kristof Croes, and B. Kaczer.

I. De Wolf's work appears regularly in prominent publication venues such as:

  • IEEE Transactions on Electron Devices
  • Proceedings - International Symposium for Testing and Failure Analysis
  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • Journal of Applied Physics
  • Journal of Lightwave Technology

Best Publications

  • Micro-Raman spectroscopy to study local mechanical stress in silicon integrated circuits

    Ingrid De Wolf

  • Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

    G Van der Plas;P Limaye;I Loi;A Mercha

  • Stress measurements in silicon devices through Raman spectroscopy: Bridging the gap between theory and experiment

    Ingrid De Wolf;H. E. Maes;Stephen K. Jones

  • A comprehensive model to predict the charging and reliability of capacitive RF MEMS switches

    W Merlijn van Spengen;Robert Puers;Robert Mertens;Ingrid De Wolf

  • A physical model to predict stiction in MEMS

    W M van Spengen;R Pures;I De Wolf

  • Stress measurements in Si microelectronics devices using Raman spectroscopy

    Ingrid De Wolf

  • A physical model to predict stiction in MEMS

    Unknown

  • Micro-Raman study of stress distribution in local isolation structures and correlation with transmission electron microscopy

    I. De Wolf;J. Vanhellemont;A. Romano‐Rodríguez;H. Norström

  • Analytical Model of the DC Actuation of Electrostatic MEMS Devices With Distributed Dielectric Charging and Nonplanar Electrodes

    X. Rottenberg;I. De Wolf;B.K.J.C. Nauwelaers;W. De Raedt

  • Printed circuit board technology inspired stretchable circuits

    J. Vanfleteren;M. Gonzalez;F. Bossuyt;Y. Y. Hsu

  • Fabrication and reliability testing of Ti/TiN heaters

    Piet De Moor;Ann Witvrouw;Veerle Simons;Ingrid De Wolf

  • Stresses and strains in lattice‐mismatched stripes, quantum wires, quantum dots, and substrates in Si technology

    S. C. Jain;H. E. Maes;K. Pinardi;I. De Wolf

  • Cu pumping in TSVs: Effect of pre-CMP thermal budget

    I. De Wolf;K. Croes;O. Varela Pedreira;R. Labie

  • Study of damage and stress induced by backgrinding in Si wafers

    Jian Chen;Ingrid De Wolf

  • Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performance

    A. Mercha;G. Van der Plas;V. Moroz;I. De Wolf

  • Advanced RF MEMS

    Stepan Lucyszyn

  • On the physics of stiction and its impact on the reliability of microstructures

    W. Merlijn Van Spengen;Robert Puers;Ingrid De Wolf

  • Strain determination in silicon microstructures by combined convergent beam electron diffraction, process simulation, and micro-Raman spectroscopy

    Vincent Senez;Aldo Armigliato;Ingrid De Wolf;Gianpietro Carnevale

  • Polyimide-Enhanced Stretchable Interconnects: Design, Fabrication, and Characterization

    Yung-Yu Hsu;M. Gonzalez;F. Bossuyt;J. Vanfleteren

  • Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-)MEMS devices

    A Jourdain;P De Moor;K Baert;I De Wolf

  • Non-uniform triggering of gg-nMOSt investigated by combined emission microscopy and transmission line pulsing

    C. Russ;K. Bock;M. Rasras;I. De Wolf

  • Experimental characterization of stiction due to charging in RF MEMS

    W.M. van Spengen;R. Puers;R. Mertens;I. De Wolf

  • Materials issues in the processing, the operation and the reliability of MEMS

    A. Witvrouw;H. A. C. Tilmans;I. De Wolf

  • The investigation of microsystems using Raman spectroscopy

    Ingrid De Wolf;Chen Jian;W.Merlijn van Spengen

  • A physical model to predict stiction in MEMS (vol 12, pg 702, 2002)

    WM van Spengen;Robert Puers;Ingrid De Wolf

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