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W. De Raedt

W. De Raedt

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
34
Citations
5511
World Ranking
5756
National Ranking
122

Best Publications

  • MEMS for wireless communications: 'from RF-MEMS components to RF-MEMS-SiP'

    Harrie A C Tilmans;Walter De Raedt;Eric Beyne

  • Band‐gap narrowing in highly doped n‐ and p‐type GaAs studied by photoluminescence spectroscopy

    G. Borghs;K. Bhattacharyya;K. Deneffe;P. Van Mieghem

  • Franz–Keldysh oscillations originating from a well‐controlled electric field in the GaAs depletion region

    C. Van Hoof;K. Deneffe;J. De Boeck;D. J. Arent

  • Accurate Multibias Equivalent-Circuit Extraction for GaN HEMTs

    G. Crupi;Dongping Xiao;D.M.M.-P. Schreurs;E. Limiti

  • Strain effects and band offsets in GaAs/InGaAs strained layered quantum structures

    D. J. Arent;K. Deneffe;C. Van Hoof;J. De Boeck

  • Analytical Model of the DC Actuation of Electrostatic MEMS Devices With Distributed Dielectric Charging and Nonplanar Electrodes

    X. Rottenberg;I. De Wolf;B.K.J.C. Nauwelaers;W. De Raedt

  • Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits

    G. Carchon;K. Vaesen;S. Brebels;W. De Raedt

  • Distributed dielectric charging and its impact on RF MEMS devices

    X. Rottenberg;B. Nauwelaers;W. De Raedt;H.A.C. Tilmans

  • Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab

    H.A.C. Tilmans;H. Ziad;H. Jansen;O. Di Monaco

  • Quality Assessment of Computational Techniques and Software Tools for Planar-Antenna Analysis

    A. Vasylchenko;Y. Schols;W. De Raedt;G.A.E. Vandenbosch

  • Accurate modeling of high-Q spiral inductors in thin-film multilayer technology for wireless telecommunication applications

    P. Pieters;K. Vaesen;S. Brebels;S.F. Mahmoud

  • Wafer-level packaging technology for high-Q on-chip inductors and transmission lines

    G.J. Carchon;Walter De Raedt;E. Beyne

  • Tunable stop-band filter at Q-band based on RF-MEMS metamaterials

    I. Gil;F. Martin;X. Rottenberg;W. De Raedt

  • Chip-package codesign of a low-power 5-GHz RF front end

    S. Donnay;P. Pieters;K. Vaesen;W. Diels

  • Two new measurement methods for explicit determination of complex permittivity

    C. Wan;B. Nauwelaers;W. De Raedt;M. Van Rossum

  • Single-package integration of RF blocks for a 5 GHz WLAN application

    W. Diels;K. Vaesen;P. Wambacq;S. Donnay

  • 50-to-67GHz ESD-protected power amplifiers in digital 45nm LP CMOS

    Kuba Raczkowski;Steven Thijs;Walter De Raedt;Bart Nauwelaers

  • SOP integration and codesign of antennas

    S. Brebels;J. Ryckaert;B. Come;S. Donnay

  • A wideband beamformer for a phased-array 60GHz receiver in 40nm digital CMOS

    Kuba Raczkowski;Walter De Raedt;Bart Nauwelaers;Piet Wambacq

  • A 665 μW Silicon Photomultiplier-Based NIRS/EEG/EIT Monitoring ASIC for Wearable Functional Brain Imaging

    Jiawei Xu;Mario Konijnenburg;Shuang Song;Hyunsoo Ha

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