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Wim Dehaene

Wim Dehaene

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
53
Citations
11457
World Ranking
2398
National Ranking
53

Overview

Wim Dehaene is affiliated with KU Leuven in Belgium and conducts research predominantly in the field of Engineering, with a particular focus on Electrical and Electronic Engineering. Their work also extends into Biomedical Engineering, Hardware and Architecture, Education, and Cognitive Neuroscience.

The main topics of their research include:

  • Thin-Film Transistor Technologies
  • Advancements in Semiconductor Devices and Circuit Design
  • Semiconductor Materials and Devices
  • Low-power High-performance VLSI Design
  • CCD and CMOS Imaging Sensors
  • Advanced Memory and Neural Computing
  • Nanowire Synthesis and Applications

Dehaene has co-authored several papers with frequent collaborators such as Kris Myny, Florian De Roose, Jan Genoe, Hikmet Çeliker, and Marc Ameys.

Their research contributions have been published in venues including:

  • IEEE Journal of Solid-State Circuits
  • IEEE Transactions on Electron Devices
  • SID Symposium Digest of Technical Papers
  • IEEE Solid-State Circuits Letters
  • 2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)

Notable recent papers authored or co-authored by Wim Dehaene include:

  • "A Comprehensive Study of Nanosheet and Forksheet SRAM for Beyond N5 Node," 2021, IEEE Transactions on Electron Devices
  • "Multi-project wafers for flexible thin-film electronics by independent foundries," 2024, Nature
  • "The Complementary FET (CFET) 6T-SRAM," 2021, IEEE Transactions on Electron Devices
  • "Flex6502: A Flexible 8b Microprocessor in 0.8µm Metal-Oxide Thin-Film Transistor Technology Implemented with a Complete Digital Design Flow Running Complex Assembly Code," 2022, 2022 IEEE International Solid-State Circuits Conference (ISSCC)
  • "Bridging the Gap between Secondary and Higher STEM Education - the Case of STEM@school," 2020, European Review

Best Publications

  • Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs

    G. Katti;M. Stucchi;K. De Meyer;W. Dehaene

  • Read Stability and Write-Ability Analysis of SRAM Cells for Nanometer Technologies

    E. Grossar;M. Stucchi;K. Maex;W. Dehaene

  • Integrated STEM Education: A Systematic Review of Instructional Practices in Secondary Education

    Lieve Thibaut;Stijn Ceuppens;Haydée De Loof;Jolien De Meester

  • 14.5 Envision: A 0.26-to-10TOPS/W subword-parallel dynamic-voltage-accuracy-frequency-scalable Convolutional Neural Network processor in 28nm FDSOI

    Bert Moons;Roel Uytterhoeven;Wim Dehaene;Marian Verhelst

  • Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

    G Van der Plas;P Limaye;I Loi;A Mercha

  • Energy Efficiency of the IEEE 802.15.4 Standard in Dense Wireless Microsensor Networks: Modeling and Improvement Perspectives

    Bruno Bougard;Francky Catthoor;Denis C. Daly;Anantha Chandrakasan

  • Organic RFID transponder chip with data rate compatible with electronic product coding

    K. Myny;S. Steudel;S. Smout;P. Vicca

  • An 8-Bit, 40-Instructions-Per-Second Organic Microprocessor on Plastic Foil

    K. Myny;E. van Veenendaal;G. H. Gelinck;J. Genoe

  • 3-D Technology Assessment: Path-Finding the Technology/Design Sweet-Spot

    P. Marchal;B. Bougard;G. Katti;M. Stucchi

  • 3D stacked IC demonstration using a through Silicon Via First approach

    J. Van Olmen;A. Mercha;G. Katti;C. Huyghebaert

  • Plastic circuits and tags for 13.56 MHz radio-frequency communication

    Kris Myny;Soeren Steudel;Peter Vicca;Monique J. Beenhakkers

  • Methods and apparatus for synchronization of training sequences

    Yves Vanderperren;Wim Dehaene

  • Unipolar Organic Transistor Circuits Made Robust by Dual-Gate Technology

    K Myny;M J Beenhakkers;N A J M van Aerle;G H Gelinck

  • From UML/SysML to Matlab/Simulink: Current State and Future Perspectives

    Y. Vanderperren;W. Dehaene

  • A 0.02mm 2 65nm CMOS 30MHz BW all-digital differential VCO-based ADC with 64dB SNDR

    Jorg Daniels;Wim Dehaene;Michiel Steyaert;Andreas Wiesbauer

  • A high-voltage output driver in a 2.5-V 0.25-/spl mu/m CMOS technology

    B. Serneels;T. Piessens;M. Steyaert;W. Dehaene

  • Through-Silicon-Via Capacitance Reduction Technique to Benefit 3-D IC Performance

    Guruprasad Katti;Michele Stucchi;Jan Van Olmen;Kristin De Meyer

  • Analog and Digital Circuit Design in 65 nm CMOS: End of the Road?

    Georges Gielen;Wim Dehaene;Phillip Christie;Dieter Draxelmayr

  • A/D Conversion Using Asynchronous Delta-Sigma Modulation and Time-to-Digital Conversion

    Jorg Daniels;Wim Dehaene;Michiel S J Steyaert;Andreas Wiesbauer

  • A thin-film microprocessor with inkjet print-programmable memory

    Kris Myny;Steve Smout;Maarten Rockelé;Ajay Bhoolokam

Frequent Co-Authors

Kris Myny
Kris Myny KU Leuven
Gerwin H. Gelinck
Gerwin H. Gelinck Netherlands Organisation for Applied Scientific Research

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