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D-Index & Metrics

Electronics and Electrical Engineering

D-Index
35
Citations
5356
World Ranking
5547
National Ranking
1903

Overview

Todd H. Hubing is affiliated with Clemson University in the United States and has a research focus in the field of engineering, particularly in electrical and electronic engineering. Their work spans topics related to electromagnetic compatibility, noise suppression, electronic packaging, soldering technologies, and advanced 3D IC and TSV technologies. Their research also includes power line communications, noise issues, and low-power, high-performance VLSI design.

Hubing's recent papers have predominantly appeared in the IEEE Electromagnetic Compatibility Magazine, with four publications demonstrating ongoing contributions to this venue. Notable papers include:

  • "Power bus decoupling on multilayer printed circuit boards" (2020, IEEE Electromagnetic Compatibility Magazine)
  • "Signal Integrity and Power Integrity" (2023, IEEE Electromagnetic Compatibility Magazine)
  • "Announcing Special Sessions in Spokane!" (2021, IEEE Electromagnetic Compatibility Magazine)
  • "Announcing Special Sessions in Spokane!" (2022, IEEE Electromagnetic Compatibility Magazine)

Frequent collaborators have supported and co-authored many works with Hubing, including:

  • F. Maradei
  • James L. Drewniak
  • Thomas P. Van Doren
  • D.M. Hockanson
  • Jai Narayan Tripathi

The main topics covered in their research include:

  • Electromagnetic Compatibility and Noise Suppression
  • Electronic Packaging and Soldering Technologies
  • 3D IC and TSV technologies
  • Power Line Communications and Noise
  • Low-power high-performance VLSI design

The concentration on electromagnetic compatibility and related technical challenges forms the core of Hubing's contributions. Their work often addresses practical solutions and theoretical analyses connected to signal integrity, power decoupling, and noise reduction in electronic systems.

Best Publications

  • The Electromagnetic Compatibility of Integrated Circuits—Past, Present, and Future

    M. Ramdani;E. Sicard;A. Boyer;S. Ben Dhia

  • Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables

    D.M. Hockanson;J.L. Drewniak;T.H. Hubing;T.P. Van Doren

  • EMI from cavity modes of shielding enclosures-FDTD modeling and measurements

    Min Li;J. Nuebel;J.L. Drewniak;R.E. DuBroff

  • Power bus decoupling on multilayer printed circuit boards

    T.H. Hubing;J.L. Drewniak;T.P. Van Doren;D.M. Hockanson

  • Quantifying SMT decoupling capacitor placement in dc power-bus design for multilayer PCBs

    Jun Fan;J.L. Drewniak;J.L. Knighten;N.W. Smith

  • Quantifying EMI resulting from finite-impedance reference planes

    D.M. Hockanson;J.L. Dreniak;T.H. Hubing;T.P. van Doren

  • Power-bus decoupling with embedded capacitance in printed circuit board design

    Minjia Xu;T.H. Hubing;J. Chen;T.P. Van Doren

  • EMI from airflow aperture arrays in shielding enclosures-experiments, FDTD, and MoM modeling

    Min Li;J. Nuebel;J.L. Drewniak;R.E. DuBroff

  • Model for estimating radiated emissions from a printed circuit board with attached cables due to Voltage-driven sources

    Hwan-Woo Shim;T.H. Hubing

  • An EMI estimate for shielding-enclosure evaluation

    Min Li;J.L. Drewniak;S. Radu;J. Nuebel

  • Comparison of FDTD algorithms for subcellular modeling of slots in shielding enclosures

    Kuang-Pin Ma;Min Li;J.L. Drewniak;T.H. Hubing

  • FDTD modeling of common-mode radiation from cables

    D.M. Hockanson;J.L. Drewniak;T.H. Hubing;T.P. Van Doren

  • Power bus decoupling on multilayer printed circuit boards

    Todd H. Hubing;James L. Drewniak;Thomas P. Van Doren;David M. Hockanson

  • The development of a closed-form expression for the input impedance of power-return plane structures

    Minjia Xu;T.H. Hubing

  • Numerical and experimental corroboration of an FDTD thin-slot model for slots near corners of shielding enclosures

    Min Li;Kuang-Ping Ma;D.M. Hockanson;J.L. Drewniak

  • A closed-form expression for estimating radiated emissions from the power planes in a populated printed circuit board

    Hwan-Woo Shim;T.H. Hubing

  • A hybrid FEM/MOM technique for electromagnetic scattering and radiation from dielectric objects with attached wires

    M.W. Ali;T.H. Hubing;J.L. Dreniak

  • Estimating Maximum Radiated Emissions From Printed Circuit Boards With an Attached Cable

    Shaowei Deng;T. Hubing;D. Beetner

  • Development of a closed-form expression for the input impedance of power-ground plane structures

    Minjia Xu;Yun Ji;T.H. Hubing;T.P. Van Doren

  • Imbalance Difference Model for Common-Mode Radiation From Printed Circuit Boards

    Changyi Su;T H Hubing

  • Investigation of fundamental mechanisms of common-mode radiation from printed circuit boards with attached cables

    J.L. Drewniak;T.H. Hubing;T.P. Van Doren

Frequent Co-Authors

James L. Drewniak
James L. Drewniak Missouri University of Science and Technology
Jun Fan
Jun Fan Missouri University of Science and Technology
Chunlei Guo
Chunlei Guo University of Rochester
David Pommerenke
David Pommerenke Graz University of Technology
Antonio Orlandi
Antonio Orlandi University of L'Aquila
Christophe Fumeaux
Christophe Fumeaux University of Queensland
Douglas H. Werner
Douglas H. Werner Pennsylvania State University
Juan R. Mosig
Juan R. Mosig École Polytechnique Fédérale de Lausanne
Natalia K. Nikolova
Natalia K. Nikolova McMaster University

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