The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Todd H. Hubing sits on this spectrum.
This scientist: 223 publications — 37th percentile
37% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 1,065 publications or more.
The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Todd H. Hubing sits on this spectrum.
This scientist: 35 D-Index — 21st percentile
21% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 111 D-Index or more.
Todd H. Hubing is affiliated with Clemson University in the United States and has a research focus in the field of engineering, particularly in electrical and electronic engineering. Their work spans topics related to electromagnetic compatibility, noise suppression, electronic packaging, soldering technologies, and advanced 3D IC and TSV technologies. Their research also includes power line communications, noise issues, and low-power, high-performance VLSI design.
Hubing's recent papers have predominantly appeared in the IEEE Electromagnetic Compatibility Magazine, with four publications demonstrating ongoing contributions to this venue. Notable papers include:
Frequent collaborators have supported and co-authored many works with Hubing, including:
The main topics covered in their research include:
The concentration on electromagnetic compatibility and related technical challenges forms the core of Hubing's contributions. Their work often addresses practical solutions and theoretical analyses connected to signal integrity, power decoupling, and noise reduction in electronic systems.
M. Ramdani;E. Sicard;A. Boyer;S. Ben Dhia
D.M. Hockanson;J.L. Drewniak;T.H. Hubing;T.P. Van Doren
Min Li;J. Nuebel;J.L. Drewniak;R.E. DuBroff
T.H. Hubing;J.L. Drewniak;T.P. Van Doren;D.M. Hockanson
Jun Fan;J.L. Drewniak;J.L. Knighten;N.W. Smith
D.M. Hockanson;J.L. Dreniak;T.H. Hubing;T.P. van Doren
Minjia Xu;T.H. Hubing;J. Chen;T.P. Van Doren
Min Li;J. Nuebel;J.L. Drewniak;R.E. DuBroff
Hwan-Woo Shim;T.H. Hubing
Min Li;J.L. Drewniak;S. Radu;J. Nuebel
Kuang-Pin Ma;Min Li;J.L. Drewniak;T.H. Hubing
D.M. Hockanson;J.L. Drewniak;T.H. Hubing;T.P. Van Doren
Todd H. Hubing;James L. Drewniak;Thomas P. Van Doren;David M. Hockanson
Minjia Xu;T.H. Hubing
Min Li;Kuang-Ping Ma;D.M. Hockanson;J.L. Drewniak
Hwan-Woo Shim;T.H. Hubing
M.W. Ali;T.H. Hubing;J.L. Dreniak
Shaowei Deng;T. Hubing;D. Beetner
Minjia Xu;Yun Ji;T.H. Hubing;T.P. Van Doren
Changyi Su;T H Hubing
J.L. Drewniak;T.H. Hubing;T.P. Van Doren
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