World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
59
Citations
10895
World Ranking
1797
National Ranking
713

Research.com Recognitions

  • 2010 - IEEE Fellow For contributions to portable system and millimeter wave antenna design

Overview

Duixian Liu is affiliated with IBM in the United States and works primarily in the field of Engineering, with a focus on Electrical and Electronic Engineering, Aerospace Engineering, Media Technology, and Computer Networks and Communications.

Their research covers key topics including:

  • Microwave Engineering and Waveguides
  • Antenna Design and Analysis
  • Millimeter-Wave Propagation and Modeling
  • Full-Duplex Wireless Communications
  • Advanced Antenna and Metasurface Technologies
  • Antenna Design and Optimization
  • Advanced MIMO Systems Optimization

Duixian Liu's recent published papers include:

  • "Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond," 2021, IEEE Journal of Microwaves
  • "A 24-30-GHz 256-Element Dual-Polarized 5G Phased Array Using Fast On-Chip Beam Calculators and Magnetoelectric Dipole Antennas," 2022, IEEE Journal of Solid-State Circuits
  • "Antenna-in-Package Integration for a Wideband Scalable 5G Millimeter-Wave Phased-Array Module," 2021, IEEE Microwave and Wireless Components Letters
  • "A Heterogeneously Integrated 256-Element 5G Phased Array: Design, Assembly, Test," 2024, IEEE Journal of Microwaves
  • "Issues and Solutions for On-chip Antenna Designs in High Resistivity Silicon," 2022, 2022 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (AP-S/URSI)

Frequent co-authors working with Duixian Liu include:

  • Bodhisatwa Sadhu
  • Xiaoxiong Gu
  • Arun Paidimarri
  • Christian Baks
  • Ning Guan

The scientist's work has appeared in several publication venues, notably:

  • IEEE Journal of Microwaves
  • IEEE Journal of Solid-State Circuits
  • IEEE Microwave and Wireless Components Letters
  • 2022 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (AP-S/URSI)
  • IEEE Transactions on Antennas and Propagation

Duixian Liu was recognized as an IEEE Fellow in 2010 for contributions to portable system and millimeter wave antenna design.

Best Publications

  • Antenna-on-Chip and Antenna-in-Package Solutions to Highly Integrated Millimeter-Wave Devices for Wireless Communications

    Y.P. Zhang;Duixian Liu

  • A 28-GHz 32-Element TRX Phased-Array IC With Concurrent Dual-Polarized Operation and Orthogonal Phase and Gain Control for 5G Communications

    Bodhisatwa Sadhu;Yahya Tousi;Joakim Hallin;Stefan Sahl

  • A Fully Integrated 16-Element Phased-Array Transmitter in SiGe BiCMOS for 60-GHz Communications

    A Natarajan;S K Reynolds;Ming-Da Tsai;S T Nicolson

  • Advanced millimeter-wave technologies : antennas, packaging and circuits

    Duixian Liu

  • Advanced Millimeter-Wave Technologies

    Duixian Liu;Brian Gaucher;Ulrich Pfeiffer;Janusz Grzyb

  • Package structures to improve on-chip antenna performance

    Bing Dang;Duixian Liu;Loïc Marnat;Atif Shamim

  • Design of wide-band CMOS VCO for multiband wireless LAN applications

    N.H.W. Fong;J.-O. Plouchart;N. Zamdmer;Duixian Liu

  • Handbook of Antenna Technologies

    Zhi Ning Chen;Duixian Liu;Hisamatsu Nakano;Xianming Qing

  • Apparatus and methods for constructing antennas us

    Gaucher Brian Paul;Liu Duixian;Pfeiffer Ullrich Richard Rudolf;Zwick Thomas Martin

  • Antenna-in-Package Design Considerations for Ka-Band 5G Communication Applications

    Duixian Liu;Xiaoxiong Gu;Christian W. Baks;Alberto Valdes-Garcia

  • A Fully Integrated 16-Element Phased-Array Transmitter in SiGe BiCMOS for 60-GHz Communications

    Unknown

  • Integrated antenna for laptop applications

    Ephraim Bemis Flint;Brian Paul Gaucher;Duixian Liu

  • A chip-scale packaging technology for 60-GHz wireless chipsets

    U.R. Pfeiffer;J. Grzyb;Duixian Liu;B. Gaucher

  • Antenna-in-Package Design for Wirebond Interconnection to Highly Integrated 60-GHz Radios

    Y.P. Zhang;M. Sun;K.M. Chua;L.L. Wai

  • Wide band AC power line characterization

    D. Liu;E. Flint;B. Gaucher;Y. Kwark

  • Antenna-in-package structures with broadside and end-fire radiations

    Alberto V. Garcia;Xiaoxiong Gu;Duixian Liu

  • Antennas integrated within the metallic display frame of a computing device

    Takeshi Asano;Shohhei Fujio;Brian Paul Gaucher;Peter Lee

  • Development, Implementation, and Characterization of a 64-Element Dual-Polarized Phased-Array Antenna Module for 28-GHz High-Speed Data Communications

    Xiaoxiong Gu;Duixian Liu;Christian Baks;Ola Tageman

  • LTCC Packages With Embedded Phased-Array Antennas for 60 GHz Communications

    Dong Gun Kam;Duixian Liu;A Natarajan;S Reynolds

  • Broadband Planar Superstrate Antenna for Integrated Millimeterwave Transceivers

    T. Zwick;Duixian Liu;B.P. Gaucher

  • Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond

    Xiaoxiong Gu;Duixian Liu;Bodhisatwa Sadhu

  • A 1-V 3.8 - 5.7-GHz wide-band VCO with differentially tuned accumulation MOS varactors for common-mode noise rejection in CMOS SOI technology

    N.H.W. Fong;J.-O. Plouchart;N. Zamdmer;Duixian Liu

Frequent Co-Authors

Brian P. Gaucher
Brian P. Gaucher IBM (United States)
Alberto Valdes-Garcia
Alberto Valdes-Garcia IBM (United States)
Xiaoxiong Gu
Xiaoxiong Gu IBM (United States)
Scott K. Reynolds
Scott K. Reynolds IBM (United States)
Christian W. Baks
Christian W. Baks IBM (United States)
Brian Floyd
Brian Floyd North Carolina State University
Jean-Olivier Plouchart
Jean-Olivier Plouchart IBM (United States)
Arun Natarajan
Arun Natarajan Oregon State University
Ullrich R. Pfeiffer
Ullrich R. Pfeiffer University of Wuppertal
Thomas Zwick
Thomas Zwick Karlsruhe Institute of Technology

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