Thomas H. DiStefano

What is he best known for?

The fields of study he is best known for:

• Electrical engineering
• Mechanical engineering
• Composite material

The scientist’s investigation covers issues in Optoelectronics, Chip, Semiconductor chip, Electronic engineering and Microelectronics. Thomas H. DiStefano combines subjects such as Terminal and Substrate with his study of Optoelectronics. His Chip study combines topics in areas such as Layer, Bent molecular geometry, Dielectric and Flip chip.

Semiconductor chip and Mechanical engineering are frequently intertwined in his study. The various areas that Thomas H. DiStefano examines in his Electronic engineering study include Planar and Lead. The Microelectronics study combines topics in areas such as Structural engineering, Engineering drawing and Cable gland.

His most cited work include:

• Semiconductor chip assemblies with fan-in leads (565 citations)
• Semiconductor chip assemblies having interposer and flexible lead (453 citations)
• Semiconductor chip assemblies, methods of making same and components for same (310 citations)

What are the main themes of his work throughout his whole career to date?

His scientific interests lie mostly in Optoelectronics, Microelectronics, Semiconductor chip, Chip and Electronic engineering. Thomas H. DiStefano has researched Optoelectronics in several fields, including Layer, Interposer and Flip chip. His Microelectronics research is multidisciplinary, incorporating perspectives in Mechanical engineering, Cable gland, Structural engineering and Electrical conductor, Composite material.

His study looks at the relationship between Semiconductor chip and topics such as Chip carrier, which overlap with Thermal coefficient. His study in Chip is interdisciplinary in nature, drawing from both Substrate, Semiconductor, Dielectric, Bent molecular geometry and Edge. His Electronic engineering research includes elements of Planar, Thermal expansion and Integrated circuit.

He most often published in these fields:

• Optoelectronics (35.98%)
• Microelectronics (35.37%)
• Semiconductor chip (31.10%)

What were the highlights of his more recent work (between 2000-2016)?

• Microelectronics (35.37%)
• Semiconductor chip (31.10%)
• Optoelectronics (35.98%)

In recent papers he was focusing on the following fields of study:

Thomas H. DiStefano mainly focuses on Microelectronics, Semiconductor chip, Optoelectronics, Mechanical engineering and Layer. Thomas H. DiStefano interconnects Electronic engineering, Structural engineering, Electrical conductor, Composite material and Interposer in the investigation of issues within Microelectronics. His Electronic engineering research is multidisciplinary, incorporating elements of Printed circuit board and Dielectric layer.

His research investigates the connection with Semiconductor chip and areas like Chip which intersect with concerns in Integrated circuit. Thomas H. DiStefano has researched Optoelectronics in several fields, including Fixture, Curing and Closed space. His study in Mechanical engineering is interdisciplinary in nature, drawing from both Elastomer, Engineering drawing and Conductor.

Between 2000 and 2016, his most popular works were:

• Encapsulation of microelectronic assemblies (239 citations)
• Microelectronic component with rigid interposer (176 citations)
• Methods for providing void-free layers for semiconductor assemblies (152 citations)

In his most recent research, the most cited papers focused on:

• Mechanical engineering
• Electrical engineering
• Composite material

Thomas H. DiStefano mostly deals with Microelectronics, Structural engineering, Mechanical engineering, Semiconductor chip and Chip. His biological study spans a wide range of topics, including Electronic engineering and Interposer. His Electronic engineering study combines topics from a wide range of disciplines, such as Electrical conductor, Contact pad and Electrical connection.

The study incorporates disciplines such as Connection and Electrically conductive in addition to Semiconductor chip. His studies deal with areas such as Substrate, Printed circuit board and Soldering as well as Chip. His Optoelectronics research is multidisciplinary, incorporating perspectives in Fixture, Curing and Closed space.