The chart shows the distribution of publications by all Research.com ranked scientists in the field of Materials Science in 2026. The highlighted bar marks where Robert Benjamin Laibowitz sits on this spectrum.
This scientist: 198 publications — 29th percentile
29% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 1,163 publications or more.
The chart shows the D-index (discipline H-index) distribution of Materials Science scientists ranked by Research.com in 2026. The highlighted bar marks where Robert Benjamin Laibowitz sits on this spectrum.
This scientist: 52 D-Index — 27th percentile
27% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 165 D-Index or more.
Robert Benjamin Laibowitz is affiliated with IBM in the United States. Their research primarily focuses on engineering and materials science, with significant contributions across subfields such as electrical and electronic engineering, electronic, optical and magnetic materials, and mechanics of materials.
Laibowitz's work covers multiple core topics, including semiconductor materials and devices, copper interconnects and reliability, and metal and thin film mechanics. These areas reflect a blend of materials science and electrical engineering challenges relevant to modern electronics and reliability engineering.
Their recent publication, "AC conductivity analysis as a measure of low k dielectric capacitor reliability degradation due to moisture ingress," was published in 2020 in the journal Microelectronic Engineering. This paper highlights investigation into reliability issues affecting dielectric capacitors, specifically focusing on moisture-induced degradation mechanisms.
Frequent collaborators in Laibowitz's research include C. Cabral, Franco Stellari, and Peilin Song, each contributing to these research efforts. Their work has been published primarily in Microelectronic Engineering, indicating a focus on applied research in microelectronics manufacturing and reliability.
Laibowitz has also been recognized by the American Physical Society as a Fellow since 1980, an acknowledgment that situates them within the broader physics and materials science community.
The combination of Laibowitz's specialties in semiconductor devices and copper interconnect reliability addresses critical aspects of device performance and longevity at the materials and component level. Their contributions extend into the mechanical properties of metals and thin films, which are important for understanding material behavior under operational stresses.
P. Chaudhari;R. H. Koch;R. B. Laibowitz;T. R. McGuire
R. H. Koch;C. P. Umbach;G. J. Clark;P. Chaudhari
D.B. Mitzi;C.A. Feild;Z. Schlesinger;R.B. Laibowitz
T. M. Shaw;Z. Suo;M. Huang;E. Liniger
R. B. Laibowitz;R. H. Koch;P. Chaudhari;R. J. Gambino
G. Koren;A. Gupta;E. A. Giess;A. Segmüller
G. Koren;A. Gupta;R. J. Baseman;M. I. Lutwyche
G. J. Clark;A. D. Marwick;R. H. Koch;R. B. Laibowitz
D. E. Kotecki;J. D. Baniecki;H. Shen;R. B. Laibowitz
R. L. Sandstrom;E. A. Giess;W. J. Gallagher;A. Segmüller
R. F. Voss;R. B. Laibowitz;E. I. Allessandrini
J. D. Baniecki;R. B. Laibowitz;T. M. Shaw;P. R. Duncombe
C. D. Dimitrakopoulos;I. Kymissis;S. Purushothaman;D. A. Neumayer
R. B. Laibowitz;Yuval Gefen
Limin Huang;Zhuoying Chen;James D. Wilson;Sarbajit Banerjee
J. Z. Sun;L. Krusin-Elbaum;P. R. Duncombe;A. Gupta
Christos Dimitrios Dimitrakopoulos;Peter Richard Duncombe;Bruce K. Furman;Robert B. Laibowitz
R. L. Sandstrom;W. J. Gallagher;T. R. Dinger;R. H. Koch
C. P. Umbach;C. Van Haesendonck;R. B. Laibowitz;S. Washburn
R. B. Laibowitz;R. H. Koch;A. Gupta;G. Koren
Christos Dimitrios Dimitrakopoulos;Peter Richard Duncombe;Bruce K. Furman;Robert B. Laibowitz
G. J. Clark;F. K. LeGoues;A. D. Marwick;R. B. Laibowitz
If you think any of the details on this page are incorrect, let us know.
Chinese Academy of Sciences
Royal Institute of Technology
South China Normal University
University of Twente
Erasmus University Rotterdam
University of Chicago
University of Pennsylvania
McGill University
Huazhong University of Science and Technology
University of Southern California
Apple (United States)
Indian Institute of Technology Bombay
University of Messina
University of Wisconsin–Madison
The University of Texas at Austin
US Forest Service
