World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
40
Citations
6274
World Ranking
4519
National Ranking
1599

Overview

Voya R. Markovich is affiliated with IBM in the United States. Their academic contributions, as represented in the available data, focus on their institutional association.

There are no recent papers listed under their name, nor are there records of frequent co-authors or publication venues linked to their research output.

Their research profile does not include information on specific fields or subfields of study, nor are there main topics of work documented.

There are no book publications or awards recorded for Voya R. Markovich in the provided data.

Thus, the information available is limited primarily to the affiliation with IBM in the United States, without further details regarding research focus, contributions, or collaborations.

Best Publications

  • Method of preparing a printed circuit board

    Anilkumar C. Bhatt;Roy H. Magnuson;Voya R. Markovich;Konstantinos I. Papathomas

  • Interconnection method and structure for organic circuit boards

    Perminder Singh Bindra;Ross Downey Havens;Voya Rista Markovich;Jaynal Abedin Molla

  • Encapsulated circuitized power core alignment and lamination

    Perminder S. Bindra;Dennis A. Canfield;Voya Rista Markovich;Jeffrey McKeveny

  • Printed wiring board

    Anilkumar Bhatt;Ashwinkumar Bhatt;Subahu Desai;John Lauffer

  • Multi-layered interconnect structure using liquid crystalline polymer dielectric

    Frank D. Egitto;Donald S. Farquhar;Voya R. Markovich;Mark D. Poliks

  • Tamper-responding encapsulated enclosure having flexible protective mesh structure

    Donald S. Farquhar;Claudius Feger;Voya Markovich;Konstantinos I. Papathomas

  • Method and apparatus for testing integrated circuit chips

    Richard Gordon Charlton;George Charles Correia;Mark Andrew Couture;Gary Ray Hill

  • Printed circuit board with aligned connections and method of making same

    Christina M. Boyko;Francis J. Bucek;Richard W. Carpenter;Voya R. Markovich

  • Electrically conductive adhesive (eca) for multilayer device interconnects

    Rabindra N. Das;Voya R. Markovich;John M. Lauffer;Roy H. Magnuson

  • Two signal one power plane circuit board

    Kenneth Fallon;Miguel A. Jimarez;Ross W. Keesler;John M. Lauffer

  • Structure including a partially electrochemically reduced halogenated polymeric containing layer and an electrically conductive pattern

    Harry Randall Bickford;Peter J. Duke;Elizabeth Foster;Martin Goldberg

  • Economical high density chip carrier

    Sylvia Adae-Amoakoh;John S. Kresge;Voya R. Markovich;Thurston B. Youngs

  • Stacked chip electronic package having laminate carrier and method of making same

    Lawrence R. Fraley;Voya R. Markovich

  • Via fill compositions for direct attach of devices and methods for applying same

    Roy Lynn Arldt;Christina Marie Boyko;Burtran Joe Cayson;Richard Michael Kozlowski

  • Method of making printed circuit board

    Warren Alan Alpaugh;Voya Rista Markovich;Ajit Kumar Trivedi;Richard Stuart Zarr

  • Separable electrical connection technology

    Perminder S. Bindra;Jerome J. Cuomo;Thomas P. Gall;Anthony P. Ingraham

  • Circuitized substrate assembly with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same

    Kim J. Blackwell;John M. Lauffer;Frank D. Egitto;Voya R. Markovich

  • Method of providing printed circuit board with con

    Larnerd James M;Lauffer John M;Markovich Voya R;Papathomas Kostas I

  • Process for selective application of solder to circuit packages

    Charles Francis Carey;Kenneth Michael Fallon;Voya Rista Markovich;Douglas Oliver Powell

  • Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

    Rabindra N. Das;John M. Lauffer;Voya R. Markovich;Mark D. Poliks

Frequent Co-Authors

Sampath Purushothaman
Sampath Purushothaman IBM (United States)
John U. Knickerbocker
John U. Knickerbocker IBM (United States)
Jerome J. Cuomo
Jerome J. Cuomo North Carolina State University
Edwin L. Thomas
Edwin L. Thomas Texas A&M University

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Best Scientists Citing Voya R. Markovich