World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
40
Citations
6274
World Ranking
4519
National Ranking
1600

Voya R. Markovich publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Voya R. Markovich sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 178 publications — 22nd percentile

22% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Voya R. Markovich D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Voya R. Markovich sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 40 D-Index — 36th percentile

36% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

Voya R. Markovich is affiliated with IBM in the United States. Their academic contributions, as represented in the available data, focus on their institutional association.

There are no recent papers listed under their name, nor are there records of frequent co-authors or publication venues linked to their research output.

Their research profile does not include information on specific fields or subfields of study, nor are there main topics of work documented.

There are no book publications or awards recorded for Voya R. Markovich in the provided data.

Thus, the information available is limited primarily to the affiliation with IBM in the United States, without further details regarding research focus, contributions, or collaborations.

Best Publications

  • Method of preparing a printed circuit board

    Anilkumar C. Bhatt;Roy H. Magnuson;Voya R. Markovich;Konstantinos I. Papathomas

  • Interconnection method and structure for organic circuit boards

    Perminder Singh Bindra;Ross Downey Havens;Voya Rista Markovich;Jaynal Abedin Molla

  • Encapsulated circuitized power core alignment and lamination

    Perminder S. Bindra;Dennis A. Canfield;Voya Rista Markovich;Jeffrey McKeveny

  • Printed wiring board

    Anilkumar Bhatt;Ashwinkumar Bhatt;Subahu Desai;John Lauffer

  • Multi-layered interconnect structure using liquid crystalline polymer dielectric

    Frank D. Egitto;Donald S. Farquhar;Voya R. Markovich;Mark D. Poliks

  • Tamper-responding encapsulated enclosure having flexible protective mesh structure

    Donald S. Farquhar;Claudius Feger;Voya Markovich;Konstantinos I. Papathomas

  • Method and apparatus for testing integrated circuit chips

    Richard Gordon Charlton;George Charles Correia;Mark Andrew Couture;Gary Ray Hill

  • Printed circuit board with aligned connections and method of making same

    Christina M. Boyko;Francis J. Bucek;Richard W. Carpenter;Voya R. Markovich

  • Electrically conductive adhesive (eca) for multilayer device interconnects

    Rabindra N. Das;Voya R. Markovich;John M. Lauffer;Roy H. Magnuson

  • Two signal one power plane circuit board

    Kenneth Fallon;Miguel A. Jimarez;Ross W. Keesler;John M. Lauffer

  • Structure including a partially electrochemically reduced halogenated polymeric containing layer and an electrically conductive pattern

    Harry Randall Bickford;Peter J. Duke;Elizabeth Foster;Martin Goldberg

  • Economical high density chip carrier

    Sylvia Adae-Amoakoh;John S. Kresge;Voya R. Markovich;Thurston B. Youngs

  • Stacked chip electronic package having laminate carrier and method of making same

    Lawrence R. Fraley;Voya R. Markovich

  • Via fill compositions for direct attach of devices and methods for applying same

    Roy Lynn Arldt;Christina Marie Boyko;Burtran Joe Cayson;Richard Michael Kozlowski

  • Method of making printed circuit board

    Warren Alan Alpaugh;Voya Rista Markovich;Ajit Kumar Trivedi;Richard Stuart Zarr

  • Separable electrical connection technology

    Perminder S. Bindra;Jerome J. Cuomo;Thomas P. Gall;Anthony P. Ingraham

  • Circuitized substrate assembly with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same

    Kim J. Blackwell;John M. Lauffer;Frank D. Egitto;Voya R. Markovich

  • Method of providing printed circuit board with con

    Larnerd James M;Lauffer John M;Markovich Voya R;Papathomas Kostas I

  • Process for selective application of solder to circuit packages

    Charles Francis Carey;Kenneth Michael Fallon;Voya Rista Markovich;Douglas Oliver Powell

  • Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

    Rabindra N. Das;John M. Lauffer;Voya R. Markovich;Mark D. Poliks

Frequent Co-Authors

Sampath Purushothaman
Sampath Purushothaman IBM (United States)
John U. Knickerbocker
John U. Knickerbocker IBM (United States)
Jerome J. Cuomo
Jerome J. Cuomo North Carolina State University
Edwin L. Thomas
Edwin L. Thomas Texas A&M University
Bahgat Sammakia
Bahgat Sammakia Binghamton University

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Best Scientists Citing Voya R. Markovich