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Christopher M. Gourlay

Christopher M. Gourlay

D-Index & Metrics

Materials Science

D-Index
42
Citations
5361
World Ranking
12632
National Ranking
519

Best Publications

  • The role of side-branching in microstructure development in laser powder-bed fusion

    Minh-Son Pham;Bogdan Dovgyy;Paul A. Hooper;Christopher M. Gourlay

  • Dilatant shear bands in solidifying metals

    C. M. Gourlay;A. K. Dahle

  • Printability and microstructure of the CoCrFeMnNi high-entropy alloy fabricated by laser powder bed fusion

    A. Piglione;B. Dovgyy;C. Liu;C.M. Gourlay

  • Defect Band Characteristics in Mg-Al and Al-Si High-Pressure Die Castings

    C.M. Gourlay;H.I. Laukli;A.K. Dahle

  • Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

    Kazuhiro Nogita;Kazuhiro Nogita;C. M Gourlay;T Nishimura

  • Microstructure Formation in AlSi4MgMn and AlMg5Si2Mn High-Pressure Die Castings

    S. Otarawanna;C. M. Gourlay;H. I. Laukli;A. K. Dahle

  • Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections

    J. W. Xian;S. A. Belyakov;M. Ollivier;Kazuhiro Nogita

  • Revealing the micromechanisms behind semi-solid metal deformation with time-resolved X-ray tomography

    K. M. Kareh;P. D. Lee;R. C. Atwood;T. Connolley

  • Granular deformation mechanisms in semi-solid alloys

    C. M. Gourlay;A. K. Dahle;T. Nagira;N. Nakatsuka

  • Migration of crystals during the filling of semi-solid castings

    Hans Ivar Laukli;Christopher M. Gourlay;Arne K Dahle

  • Direct observation of deformation in semi-solid carbon steel

    T. Nagira;T. Nagira;C.M. Gourlay;A. Sugiyama;M. Uesugi

  • Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders

    Z.L. Ma;S.A. Belyakov;C.M. Gourlay

  • Evidence of the hydrogen release mechanism in bulk MgH2.

    Kazuhiro Nogita;Xuan Q. Tran;Tomokazu Yamamoto;Eishi Tanaka

  • Segregation band formation in Al-Si die castings

    Christopher M. Gourlay;Arne K Dahle;Hans Ivar Laukli

  • Nucleation of tin on the Cu6Sn5 layer in electronic interconnections

    J.W. Xian;Z.L. Ma;S.A. Belyakov;M. Ollivier

  • The Influence of 0-0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi

    Tina Ventura;Christopher M. Gourlay;Kazuhiro Nogita;Tetsuro Nishimura

  • Kinetics of the η–η′ transformation in Cu6Sn5

    Kazuhiro Nogita;C. M. Gourlay;S. D. McDonald;Y. Q. Wu

  • Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections.

    Z. L. Ma;S. A. Belyakov;K. Sweatman;T. Nishimura

  • In-situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni

    C.M. Gourlay;K. Nogita;K. Nogita;A.K. Dahle;Y. Yamamoto

  • Nucleation and growth crystallography of Al8Mn5 on B2-Al(Mn,Fe) in AZ91 magnesium alloys

    G. Zeng;J.W. Xian;C.M. Gourlay

  • Engineering the Mg–Mg2Ni eutectic transformation to produce improved hydrogen storage alloys

    K. Nogita;S. Ockert;J. Pierce;M.C. Greaves

  • Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles

    M. A.A. Mohd Salleh;M. A.A. Mohd Salleh;S. D. McDonald;C. M. Gourlay;H. Yasuda

Frequent Co-Authors

Kazuhiro Nogita
Kazuhiro Nogita University of Queensland
Arne K. Dahle
Arne K. Dahle Jönköping University
Hideyuki Yasuda
Hideyuki Yasuda Kyoto University
Catherine O'Sullivan
Catherine O'Sullivan Imperial College London
Qinfen Gu
Qinfen Gu Australian Nuclear Science and Technology Organisation
Kentaro Uesugi
Kentaro Uesugi Stanford University
Peter D. Lee
Peter D. Lee University College London
Syo Matsumura
Syo Matsumura Kyushu University
Patrick S. Grant
Patrick S. Grant University of Oxford
Fionn P.E. Dunne
Fionn P.E. Dunne Imperial College London

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