World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
61
Citations
11203
World Ranking
1574
National Ranking
640

Overview

Jack O Chu is a researcher primarily affiliated with IBM in the United States. Their work is situated within the field of Computer Science, with a specific focus on Artificial Intelligence and Computer Vision and Pattern Recognition.

Their research contributions include studies in Multimodal Machine Learning Applications, Domain Adaptation and Few-Shot Learning, and Topic Modeling. These topics reflect a concentration on how different machine learning techniques can be applied across varied data modalities and learning environments.

Jack O Chu has collaborated with several co-authors, including Tony Jun Huang and Fangyun Wei. These collaborations have contributed to their research output and reflect active engagement within a network of scholars working on related topics.

Their publication record includes work published in venues such as arXiv (Cornell University), indicating engagement with preprint archives common in computer science research. One notable recent paper is titled Unsupervised Prompt Learning for Vision-Language Models, published in 2022 in arXiv (Cornell University).

  • Unsupervised Prompt Learning for Vision-Language Models, 2022, arXiv (Cornell University)

Jack O Chu's research emphasizes areas that intersect machine learning models dealing with multiple data types, including visual and linguistic information, as well as approaches suited for limited data settings like few-shot learning. These areas are significant in advancing methodologies that enable models to generalize and perform effectively across different tasks and domains.

Best Publications

  • Characteristics and device design of sub-100 nm strained Si N- and PMOSFETs

    K. Rim;J. Chu;H. Chen;K.A. Jenkins

  • Controllable valley splitting in silicon quantum devices

    Srijit Goswami;K. A. Slinker;Mark Friesen;L. M. McGuire

  • Strained Si NMOSFETs for high performance CMOS technology

    K. Rim;S. Koester;M. Hargrove;J. Chu

  • Low leakage heterojunction vertical transistors and high performance devices thereof

    Qiqing Christine Ouyang;Jack Oon Chu

  • Transferable device-containing layer for silicon-on-insulator applications

    Jack Oon Chu;Alfred Grill;Dean A. Herman;Katherine L. Saenger

  • Integration of strained Ge into advanced CMOS technology

    Huiling Shang;Meikei Ieong;Jack Oon Chu;Kathryn W. Guarini

  • Germanium channel MOSFETs: opportunities and challenges

    H. Shang;M. M. Frank;E. P. Gusev;J. O. Chu

  • High performance strained silicon finfets device and method for forming same

    Stephen W. Bedell;Kevin K. Chan;Dureseti Chidambarrao;Silke H. Christiansen

  • Relaxed SiGe layers on Si or silicon-on-insulator substrates by ion implantation and thermal annealing

    Silke H. Christiansen;Jack O. Chu;Alfred Grill;Patricia M. Mooney

  • Advance integrated chemical vapor deposition (AICVD) for semiconductor

    Jack Oon Chu;Khalid EzzEldin Ismail

  • Germanium-on-SOI Infrared Detectors for Integrated Photonic Applications

    S.J. Koester;J.D. Schaub;G. Dehlinger;G. Dehlinger;J.O. Chu

  • A 0.18 /spl mu/m BiCMOS technology featuring 120/100 GHz (f/sub T//f/sub max/) HBT and ASIC-compatible CMOS using copper interconnect

    A. Joseph;D. Coolbaugh;M. Zierak;R. Wuthrich

  • Heteroepitaxial growth of Ge on (100) Si by ultrahigh vacuum, chemical vapor deposition

    Brian Cunningham;Jack O. Chu;Shah Akbar

  • High speed Ge channel heterostructures for field effect devices

    Jack Oon Chu

  • Dual strain-state SiGe layers for microelectronics

    Jack Oon Chu

  • Ultra scalable high speed heterojunction vertical n-channel MISFETs and methods thereof

    Qiqing Christine Ouyang;Jack Oon Chu

  • Strained Si based layer made by UHV-CVD, and devices therein

    Jack O. Chu;Khaled Apt. Ismail

  • Carrier mobility enhancement in strained Si-on-insulator fabricated by wafer bonding

    L.-J. Huang;J.O. Chu;S. Goma;C.P. D'Emic

  • SiGe-on-insulator prepared by wafer bonding and layer transfer for high-performance field-effect transistors

    L. J. Huang;J. O. Chu;D. F. Canaperi;C. P. D’Emic

  • Scalable MOS field effect transistor

    Kevin Kok Chan;Jack Oon Chu;Khalid EzzEldin Ismail;Stephen Anthony Rishton

  • High-transconductance n-type Si/SiGe modulation-doped field-effect transistors

    K. Ismail;B.S. Meyerson;S. Rishton;J. Chu

  • Electron and hole mobility enhancement in strained SOI by wafer bonding

    Lijuan Huang;J.O. Chu;S.A. Goma;C.P. D'Emic

Frequent Co-Authors

John A. Ott
John A. Ott IBM (United States)
Steven J. Koester
Steven J. Koester University of Minnesota
Kevin K. Chan
Kevin K. Chan IBM (United States)
Alfred Grill
Alfred Grill IBM (United States)
Patricia M. Mooney
Patricia M. Mooney Simon Fraser University
Christos D. Dimitrakopoulos
Christos D. Dimitrakopoulos University of Massachusetts Amherst
Katherine L. Saenger
Katherine L. Saenger Auburn University
Meikei Ieong
Meikei Ieong Simbury Limited
Guy M. Cohen
Guy M. Cohen IBM (United States)
Silke Christiansen
Silke Christiansen Fraunhofer Society

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