World's Best Scientists 2026 revealed!

D-Index & Metrics

Materials Science

D-Index
63
Citations
12876
World Ranking
6257
National Ranking
1595

Overview

What is he best known for?

The fields of study he is best known for:

  • Semiconductor
  • Ion
  • Silicon

His main research concerns Optoelectronics, Substrate, Cleave, Plasma-immersion ion implantation and Layer. His research in Optoelectronics intersects with topics in Sapphire and Ion implantation. Nathan W. Cheung has included themes like Thin film and Light-emitting diode in his Sapphire study.

His work carried out in the field of Plasma-immersion ion implantation brings together such families of science as Sputtering and Analytical chemistry. The Analytical chemistry study combines topics in areas such as Electromigration and Cluster. His research integrates issues of Electronic engineering and Integrated circuit in his study of Layer.

His most cited work include:

  • Separation of thin films from transparent substrates by selective optical processing (506 citations)
  • Plasma immersion ion implantation—a fledgling technique for semiconductor processing (356 citations)
  • Fabrication of thin-film InGaN light-emitting diode membranes by laser lift-off (317 citations)

What are the main themes of his work throughout his whole career to date?

His primary areas of investigation include Optoelectronics, Analytical chemistry, Plasma-immersion ion implantation, Ion implantation and Wafer. His Optoelectronics research incorporates elements of Layer, Substrate and Thin film. His work deals with themes such as Sapphire and Excimer laser, which intersect with Thin film.

He interconnects Oxide, Epitaxy, Diode, Annealing and Transmission electron microscopy in the investigation of issues within Analytical chemistry. The study incorporates disciplines such as Getter, Nanotechnology, Doping and Semiconductor in addition to Plasma-immersion ion implantation. The concepts of his Ion implantation study are interwoven with issues in Hydrogen, Silicon, Amorphous solid, Ionization and Ion beam.

He most often published in these fields:

  • Optoelectronics (43.87%)
  • Analytical chemistry (32.55%)
  • Plasma-immersion ion implantation (31.60%)

What were the highlights of his more recent work (between 2000-2008)?

  • Optoelectronics (43.87%)
  • Cleave (9.91%)
  • Layer (8.96%)

In recent papers he was focusing on the following fields of study:

Nathan W. Cheung mostly deals with Optoelectronics, Cleave, Layer, Wafer and Energy source. His Optoelectronics research integrates issues from Substrate and Plasma-immersion ion implantation. In his work, Nathan W. Cheung performs multidisciplinary research in Cleave and Substrate.

His Layer research incorporates elements of Silicon on insulator, Electronic engineering and Integrated circuit. His Wafer study integrates concerns from other disciplines, such as Ion implantation, Composite material and Silicon. His research in Ion implantation intersects with topics in Hydrogen and Biomedical engineering.

Between 2000 and 2008, his most popular works were:

  • Controlled cleaving process (286 citations)
  • Method and device for controlled cleaving process (214 citations)
  • Controlled cleavage process using pressurized fluid (188 citations)

In his most recent research, the most cited papers focused on:

  • Semiconductor
  • Ion
  • Silicon

His scientific interests lie mostly in Cleave, Energy source, Substrate, Optoelectronics and Substrate. His research on Optoelectronics often connects related topics like Electronic engineering. His Electronic engineering study incorporates themes from Silicon on insulator and Wafer.

Nathan W. Cheung has included themes like Thin film and Nitride in his Substrate study. He has researched Thin film in several fields, including Microfluidics, Photodetector, Light-emitting diode, Microsystem and Sapphire. His studies deal with areas such as Chemical vapor deposition, Getter, Layer and Transistor, Gate oxide as well as Integrated circuit.

Best Publications

  • Controlled cleaving process

    Francois J. Henley;Nathan W. Cheung

  • Separation of thin films from transparent substrates by selective optical processing

    Nathan W. Cheung;Timothy D. Sands;William S. Wong

  • Damage-free separation of GaN thin films from sapphire substrates

    W. S. Wong;T. Sands;N. W. Cheung

  • Plasma immersion ion implantation—a fledgling technique for semiconductor processing

    Paul K. Chu;Shu Qin;Chung Chan;Nathan W. Cheung

  • Fabrication of thin-film InGaN light-emitting diode membranes by laser lift-off

    W. S. Wong;T. Sands;N. W. Cheung;M. Kneissl

  • Cluster tool method using plasma immersion ion implantation

    Francois J. Henley;Nathan Cheung

  • Method and device for controlled cleaving process

    Francois J. Henley;Nathan W. Cheung

  • Controlled cleavage process using pressurized fluid

    Francois J. Henley;Nathan Cheung

  • Method for controlled cleaving process

    Francois J. Henley;Nathan W. Cheung

  • InxGa1−xN light emitting diodes on Si substrates fabricated by Pd–In metal bonding and laser lift-off

    W. S. Wong;T. Sands;N. W. Cheung;M. Kneissl

  • Method of forming a low temperature metal bond for use in the transfer of bulk and thin film materials

    Nathan W. Cheung;Timothy David Sands;William S. Wong

  • Proximity gettering with mega-electron-volt carbon and oxygen implantations

    H. Wong;N. W Cheung;P. K. Chu;J. Liu

  • Plasma immersion ion implantation for ULSI processing

    Nathan W. Cheung

  • Pre-semiconductor process implant and post-process film separation

    Francois J. Henley;Nathan W. Cheung

  • Planarizing technique for multilayered substrates

    Francois J. Henley;Nathan Cheung

  • Transfer of patterned ion-cut silicon layers

    C. H. Yun;A. B. Wengrow;N. W. Cheung;Y. Zheng

  • Electromigration characteristics of copper interconnects

    J. Tao;N.W. Cheung;C. Hu

  • Heterogeneous integration of CdS filters with GaN LEDs for fluorescence detection microsystems

    J.Alex Chediak;Zhongsheng Luo;Jeonggi Seo;Nathan Cheung

  • Gettering technique for silicon-on-insulator wafers

    Francois J. Henley;Nathan W. Cheung

  • Gettering technique for wafers made using a controlled cleaving process

    Francois J. Henley;Nathan W. Cheung

Frequent Co-Authors

Chenming Hu
Chenming Hu University of California, Berkeley
Paul K. Chu
Paul K. Chu City University of Hong Kong
Timothy D. Sands
Timothy D. Sands Virginia Tech
Kin Man Yu
Kin Man Yu City University of Hong Kong
William S. Wong
William S. Wong University of Waterloo
Seongil Im
Seongil Im Yonsei University
Ronald Gronsky
Ronald Gronsky University of California, Berkeley
Ian G. Brown
Ian G. Brown Lawrence Berkeley National Laboratory
Eicke R. Weber
Eicke R. Weber University of California, Berkeley
Eric A. Stach
Eric A. Stach University of Pennsylvania

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