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Engineering and Technology

D-Index
56
Citations
11751
World Ranking
2822
National Ranking
47

Overview

Maud Vinet is affiliated with Grenoble Alpes University in France, focusing their research on engineering and physics, with a specialized emphasis on electrical and electronic engineering as well as atomic and molecular physics, and optics. Their work spans several interdisciplinary topics within semiconductor technology, quantum physics, and device engineering.

The main fields of study for Maud Vinet include:

  • Engineering
  • Physics and Astronomy

Within these fields, their research tackles subfields such as:

  • Electrical and Electronic Engineering
  • Atomic and Molecular Physics, and Optics
  • Artificial Intelligence
  • Biomedical Engineering
  • Condensed Matter Physics

The scientist's research topics cover a range of semiconductor and quantum phenomena including:

  • Advancements in Semiconductor Devices and Circuit Design
  • Semiconductor materials and devices
  • Quantum and electron transport phenomena
  • Quantum Computing Algorithms and Architecture
  • Semiconductor Quantum Structures and Devices
  • Nanowire Synthesis and Applications
  • Quantum Information and Cryptography

Maud Vinet's recent notable publications include:

  • The future transistors, 2023, Nature
  • Scaling silicon-based quantum computing using CMOS technology, 2021, Nature Electronics
  • Strong coupling between a photon and a hole spin in silicon, 2023, Nature Nanotechnology
  • Single-electron operations in a foundry-fabricated array of quantum dots, 2020, Nature Communications
  • A single hole spin with enhanced coherence in natural silicon, 2022, Nature Nanotechnology

The scientist frequently publishes in several venues, with prominent appearances in:

  • Solid-State Electronics
  • arXiv (Cornell University)
  • IEEE Transactions on Electron Devices
  • Nature Nanotechnology
  • Physical Review Applied

Maud Vinet has collaborated frequently with peers such as Tristan Meunier, M. Cassé, Benoît Bertrand, S. De Franceschi, and Bruna Cardoso Paz, each contributing significantly over multiple joint publications.

Best Publications

  • A CMOS silicon spin qubit.

    R. Maurand;X. Jehl;D. Kotekar-Patil;A. Corna

  • The future transistors

    Unknown

  • Advances, challenges and opportunities in 3D CMOS sequential integration

    P. Batude;M. Vinet;B. Previtali;C. Tabone

  • Single-donor ionization energies in a nanoscale CMOS channel

    M. Pierre;R. Wacquez;X. Jehl;M. Sanquer

  • Advances in 3D CMOS sequential integration

    P. Batude;M. Vinet;A. Pouydebasque;C. Le Royer

  • 22nm FDSOI technology for emerging mobile, Internet-of-Things, and RF applications

    R. Carter;J. Mazurier;L. Pirro;J-U. Sachse

  • Planar Fully depleted SOI technology: A powerful architecture for the 20nm node and beyond

    O. Faynot;F. Andrieu;O. Weber;C. Fenouillet-Beranger

  • 3D monolithic integration: Technological challenges and electrical results

    M. Vinet;P. Batude;C. Tabone;B. Previtali

  • Setting up 3D sequential integration for back-illuminated CMOS image sensors with highly miniaturized pixels with low temperature fully depleted SOI transistors

    P. Coudrain;P. Batude;X. Gagnard;C. Leyris

  • Demonstration of low temperature 3D sequential FDSOI integration down to 50 nm gate length

    P. Batude;M. Vinet;C. Xu;B. Previtali

  • 3D monolithic integration

    P. Batude;M. Vinet;A. Pouydebasque;C. Le Royer

  • Electrical Spin Driving by g-Matrix Modulation in Spin-Orbit Qubits.

    Alessandro Crippa;Romain Maurand;Léo Bourdet;Dharmraj Kotekar-Patil

  • Cryogenic Subthreshold Swing Saturation in FD-SOI MOSFETs Described With Band Broadening

    Unknown

  • Multiple gate devices: advantages and challenges

    T. Poiroux;M. Vinet;O. Faynot;J. Widiez

  • CIRCUIT A TRANSISTOR INTEGRES DANS TROIS DIMENSIONS ET AYANT UNE TENSION DE SEUIL VT AJUSTABLE DYNAMIQUEMENT

    Batude Perrine;Clavelier Laurent;Jaud Marie Anne;Thomas Olivier

  • Bonded planar double-metal-gate NMOS transistors down to 10 nm

    M. Vinet;T. Poiroux;J. Widiez;J. Lolivier

  • 3DVLSI with CoolCube process: An alternative path to scaling

    P. Batude;C. Fenouillet-Beranger;L. Pasini;V. Lu

  • Gate-based high fidelity spin readout in a CMOS device

    Matias Urdampilleta;David J Niegemann;Emmanuel Chanrion;Baptiste Jadot

  • Performance and design considerations for gate-all-around stacked-NanoWires FETs

    S. Barraud;V. Lapras;B. Previtali;M. P. Samson

  • GeOI pMOSFETs Scaled Down to 30-nm Gate Length With Record Off-State Current

    L. Hutin;C. Le Royer;J.-F. Damlencourt;J.-M. Hartmann

  • CELLULE DE MEMOIRE SRAM A TRANSISTOR INTEGRES SUR PLUSIEURS NIVEAUX ET DONT LA TENSION DE SEUIL VT EST AJUSTABLE DYNAMIQUEMENT

    Thomas Olivier;Batude Perrine;Pouydebbasque Arnaud;Vinet Maud

  • Germanium on insulator and new 3D architectures opportunities for integration

    M. Vinet;C. Le Royer;P. Batude;J.-F. Damlencourt

  • Simple and controlled single electron transistor based on doping modulation in silicon nanowires

    M. Hofheinz;X. Jehl;M. Sanquer;G. Molas

  • Scaling silicon-based quantum computing using CMOS technology: State-of-the-art, Challenges and Perspectives

    M. F. Gonzalez-Zalba;S. de Franceschi;E. Charbon;T. Meunier

Frequent Co-Authors

O. Faynot
O. Faynot CEA LETI
Gerard Ghibaudo
Gerard Ghibaudo Grenoble Alpes University
Thomas Ernst
Thomas Ernst Grenoble Alpes University
Marco Fanciulli
Marco Fanciulli University of Milano-Bicocca
Sorin Cristoloveanu
Sorin Cristoloveanu Grenoble Institute of Technology
Bruce B. Doris
Bruce B. Doris IBM (United States)

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