World's Best Scientists 2026 revealed!
Jeehwan Kim

Jeehwan Kim

D-Index & Metrics

Materials Science

D-Index
45
Citations
9692
World Ranking
11639
National Ranking
2720

Overview

Jeehwan Kim is affiliated with MIT in the United States. Their research primarily spans the fields of Engineering and Materials Science, with a significant focus on Materials Chemistry and Electrical and Electronic Engineering as subfields. Biomedical Engineering, Electronic, Optical and Magnetic Materials, and Condensed Matter Physics also form part of their areas of study.

The scientist's work covers multiple topics related to advanced materials and devices. Major topics include Graphene research and applications, Advanced Memory and Neural Computing, 2D Materials and Applications, Electronic and Structural Properties of Oxides, Nanowire Synthesis and Applications, GaN-based semiconductor devices and materials, and Semiconductor materials and devices.

Jeehwan Kim has contributed to various recent publications as follows:

  • Heterogeneous integration of single-crystalline complex-oxide membranes, 2020, Nature
  • Alloying conducting channels for reliable neuromorphic computing, 2020, Nature Nanotechnology
  • Vertical full-colour micro-LEDs via 2D materials-based layer transfer, 2023, Nature
  • Chip-less wireless electronic skins by remote epitaxial freestanding compound semiconductors, 2022, Science
  • Recent Advances and Future Prospects for Memristive Materials, Devices, and Systems, 2023, ACS Nano

The scientist frequently publishes in high-impact journals. The most common publication venues include Nature Nanotechnology, ACS Nano, arXiv (Cornell University), Nature, and Nature Electronics.

  • Nature Nanotechnology
  • ACS Nano
  • arXiv (Cornell University)
  • Nature
  • Nature Electronics

Collaboration has been a notable aspect of their research career. Frequent co-authors include Hyunseok Kim, Sang-Hoon Bae, Sangho Lee, Kuangye Lu, and Hyun S. Kum, each contributing to multiple joint publications.

  • Hyunseok Kim
  • Sang-Hoon Bae
  • Sangho Lee
  • Kuangye Lu
  • Hyun S. Kum

Best Publications

  • SiGe epitaxial memory for neuromorphic computing with reproducible high performance based on engineered dislocations

    Shinhyun Choi;Scott H. Tan;Zefan Li;Yunjo Kim

  • Remote epitaxy through graphene enables two-dimensional material-based layer transfer

    Yunjo Kim;Samuel S. Cruz;Kyusang Lee;Babatunde O. Alawode

  • High Efficiency Cu2ZnSn(S,Se)4 Solar Cells by Applying a Double In2S3/CdS Emitter

    Jeehwan Kim;Homare Hiroi;Teodor K. Todorov;Oki Gunawan

  • Principle of direct van der Waals epitaxy of single-crystalline films on epitaxial graphene

    Jeehwan Kim;Can Bayram;Hongsik Park;Cheng Wei Cheng

  • Path towards graphene commercialization from lab to market.

    Wei Kong;Hyun Kum;Sang Hoon Bae;Jaewoo Shim

  • Heterogeneous integration of single-crystalline complex-oxide membranes.

    Hyun S. Kum;Hyungwoo Lee;Sungkyu Kim;Shane Lindemann

  • Chip-less wireless electronic skins by remote epitaxial freestanding compound semiconductors

    Unknown

  • Controlled crack propagation for atomic precision handling of wafer-scale two-dimensional materials

    Jaewoo Shim;Sang Hoon Bae;Wei Kong;Doyoon Lee

  • Building energy performance evaluation of building integrated photovoltaic (BIPV) window with semi-transparent solar cells

    Young Tae Chae;Jeehwan Kim;Hongsik Park;Byungha Shin

  • Vertical full-colour micro-LEDs via 2D materials-based layer transfer

    Unknown

  • Integration of bulk materials with two-dimensional materials for physical coupling and applications.

    Sang Hoon Bae;Hyun Kum;Wei Kong;Yunjo Kim

  • Epitaxial growth and layer-transfer techniques for heterogeneous integration of materials for electronic and photonic devices

    Hyun Kum;Doeon Lee;Wei Kong;Hyunseok Kim

  • Layer-Resolved Graphene Transfer via Engineered Strain Layers

    Jeehwan Kim;Hongsik Park;James B. Hannon;Stephen W. Bedell

  • Polarity governs atomic interaction through two-dimensional materials

    Wei Kong;Huashan Li;Huashan Li;Kuan Qiao;Yunjo Kim

  • Alloying conducting channels for reliable neuromorphic computing

    Hanwool Yeon;Peng Lin;Chanyeol Choi;Scott H. Tan

  • Non-epitaxial single-crystal 2D material growth by geometric confinement

    Unknown

  • Mechanical effects in peel adhesion test

    J. Kim;K.S. Kim;Y.H. Kim

  • Aluminum nitride integrated photonics platform for the ultraviolet to visible spectrum.

    Tsung-Ju Lu;Michael Fanto;Hyeongrak Choi;Paul Thomas

  • Long-term reliable physical health monitoring by sweat pore–inspired perforated electronic skins

    Hanwool Yeon;Haneol Lee;Haneol Lee;Yeongin Kim;Doyoon Lee

  • Ledge-directed epitaxy of continuously self-aligned single-crystalline nanoribbons of transition metal dichalcogenides

    Areej Aljarb;Areej Aljarb;Jui-Han Fu;Chih-Chan Hsu;Chih-Chan Hsu;Chih-Piao Chuu

  • Adhesion and interface studies between copper and polyimide

    Y.-H. Kim;G.F. Walker;J. Kim;J. Park

  • Extremely Large Gate Modulation in Vertical Graphene/WSe2 Heterojunction Barristor Based on a Novel Transport Mechanism.

    Jaewoo Shim;Hyo Seok Kim;Yoon Su Shim;Dong-Ho Kang

  • Low cost soi substrates for monolithic solar cells

    Stephen W. Bedell;Joel P. de Souza;Keith E. Fogel;Harold J. Hovel

Frequent Co-Authors

Devendra K. Sadana
Devendra K. Sadana IBM (United States)
Stephen W. Bedell
Stephen W. Bedell IBM (United States)
Christos D. Dimitrakopoulos
Christos D. Dimitrakopoulos University of Massachusetts Amherst
Oki Gunawan
Oki Gunawan IBM (United States)
Ya-Hong Xie
Ya-Hong Xie University of California, Los Angeles
John A. Ott
John A. Ott IBM (United States)
David B. Mitzi
David B. Mitzi Duke University
Khalil Amine
Khalil Amine Argonne National Laboratory
Katherine L. Saenger
Katherine L. Saenger Auburn University
Kangguo Cheng
Kangguo Cheng IBM (United States)

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