World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
35
Citations
6869
World Ranking
5479
National Ranking
1880

Philip G. Neudeck publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Philip G. Neudeck sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 268 publications — 50th percentile

50% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Philip G. Neudeck D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Philip G. Neudeck sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 35 D-Index — 21st percentile

21% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

Philip G. Neudeck is affiliated with the Glenn Research Center in the United States. Their research primarily focuses on engineering, with a special emphasis on electrical and electronic engineering. The body of work spans several subfields, including materials chemistry, ceramics and composites, condensed matter physics, and mechanics of materials.

The scientist's research topics encompass a variety of specialized areas, such as:

  • Silicon Carbide Semiconductor Technologies
  • Semiconductor materials and devices
  • Silicon and Solar Cell Technologies
  • Advanced ceramic materials synthesis
  • Electromagnetic Compatibility and Noise Suppression
  • GaN-based semiconductor devices and materials
  • Electronic Packaging and Soldering Technologies

Philip G. Neudeck has contributed to multiple scientific publications, including:

  • "Emerging SiC Applications beyond Power Electronic Devices", 2023, published in Micromachines
  • "A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits", 2021, published in Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
  • "Experimental Study of Structural Materials for Prolonged Venus Surface Exploration Missions", 2020, published in Journal of Spacecraft and Rockets
  • "Upscaling of 500 °C Durable SiC JFET-R Integrated Circuits", 2021, published in Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
  • "Experimental Study on Mitigation of Lifetime-Limiting Dielectric Cracking in Extreme Temperature 4H-SiC JFET Integrated Circuits", 2020, published in Materials science forum

Frequent coauthors working alongside Philip G. Neudeck include:

  • David J. Spry
  • Dorothy Lukco
  • Gary W. Hunter
  • Michael J. Krasowski
  • Carl W. Chang

The primary publication venues where their work appears are:

  • Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
  • Materials science forum
  • Key engineering materials
  • Advanced Electronic Materials
  • IMAPSource Proceedings

Best Publications

  • High-temperature electronics - a role for wide bandgap semiconductors?

    Unknown

  • Site‐competition epitaxy for superior silicon carbide electronics

    David J. Larkin;Philip G. Neudeck;J. Anthony Powell;Lawrence G. Matus

  • Performance limiting micropipe defects in silicon carbide wafers

    P.G. Neudeck;J.A. Powell

  • Progress in silicon carbide semiconductor electronics technology

    Philip G. Neudeck

  • Study of bulk and elementary screw dislocation assisted reverse breakdown in low-voltage (<250 V) 4H-SiC p/sup +/-n junction diodes. I. DC properties

    P.G. Neudeck;Wei Huang;M. Dudley

  • Extreme temperature 6H-SiC JFET integrated circuit technology

    Philip G. Neudeck;Steven L. Garverick;David J. Spry;Liang Yu Chen

  • The mechanism of micropipe nucleation at inclusions in silicon carbide

    M. Dudley;X. R. Huang;W. Huang;A. Powell

  • Electrical Impact of SiC Structural Crystal Defects on High Electric Field Devices

    Philip G. Neudeck

  • Breakdown degradation associated with elementary screw dislocations in 4H-SiC p+n junction rectifiers

    P.G Neudeck;W Huang;M Dudley

  • Demonstration of 4H-SiC Digital Integrated Circuits Above 800 °C

    Philip G. Neudeck;David J. Spry;Liangyu Chen;Norman F. Prokop

  • Growth of step-free surfaces on device-size (0001)SiC mesas

    J. Anthony Powell;Philip G. Neudeck;Andrew J. Trunek;Glenn M. Beheim

  • 2000 V 6H-SIC P-N JUNCTION DIODES GROWN BY CHEMICAL VAPOR DEPOSITION

    Philip G. Neudeck;David J. Larkin;J. Anthony Powell;Lawrence G. Matus

  • Stable Electrical Operation of 6H–SiC JFETs and ICs for Thousands of Hours at 500 $^{\circ}\hbox{C}$

    Unknown

  • Positive temperature coefficient of breakdown voltage in 4H-SiC pn junction rectifiers

    P.G. Neudeck;C. Fazi

  • Comparison of interfacial and electronic properties of annealed Pd/SiC and Pd/SiO2/SiC Schottky diode sensors

    Liang-Yu Chen;Gary W. Hunter;Philip G. Neudeck;Gaurav Bansal

  • Emerging SiC Applications beyond Power Electronic Devices

    Unknown

  • CFD Growth of 3C-SiC on 4H/6H Mesas

    Philip G. Neudeck;Andrew J. Trunek;David J. Spry;J. Anthony Powell

  • Prolonged silicon carbide integrated circuit operation in Venus surface atmospheric conditions

    Philip G. Neudeck;Roger D. Meredith;Liangyu Chen;David J. Spry

  • Analysis of the temperature dependent thermal conductivity of silicon carbide for high temperature applications

    R. P. Joshi;P. G. Neudeck;C. Fazi

  • Electrical properties of epitaxial 3C- and 6H-SiC p-n junction diodes produced side-by-side on 6H-SiC substrates

    P.G. Neudeck;D.J. Larkin;J.E. Starr;J.A. Powell

  • An Overview of High Temperature Electronics and Sensor Development at NASA Glenn Research Center

    Gary W. Hunter;Philip G. Neudeck;Robert S. Okojie;Glenn M. Beheim

  • Prolonged 500 °C Demonstration of 4H-SiC JFET ICs With Two-Level Interconnect

    David J. Spry;Philip G. Neudeck;Liangyu Chen;Dorothy Lukco

  • SiC-Based Gas Sensor Development

    Gary W. Hunter;Philip G. Neudeck;M. Gray;D. Androjna

  • Measurement of n‐type dry thermally oxidized 6H‐SiC metal‐oxide‐semiconductor diodes by quasistatic and high‐frequency capacitance versus voltage and capacitance transient techniques

    P. Neudeck;S. Kang;J. Petit;M. Tabib‐Azar

  • Development of SiC-based Gas Sensors for Aerospace Applications

    G. W. Hunter;P. G. Neudeck;J. Xu;D. Lukco

Frequent Co-Authors

Michael Dudley
Michael Dudley Stony Brook University
Chung-Chiun Liu
Chung-Chiun Liu Case Western Reserve University
Charles R. Eddy
Charles R. Eddy United States Naval Research Laboratory
Marek Skowronski
Marek Skowronski Carnegie Mellon University
George E. Ponchak
George E. Ponchak Glenn Research Center
Joshua D. Caldwell
Joshua D. Caldwell Vanderbilt University
Mehran Mehregany
Mehran Mehregany Case Western Reserve University
Haibin Su
Haibin Su Hong Kong University of Science and Technology
Stephen J. Pearton
Stephen J. Pearton University of Florida
Pirouz Pirouz
Pirouz Pirouz Case Western Reserve University

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