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Electronics and Electrical Engineering

D-Index
35
Citations
6869
World Ranking
5479
National Ranking
1879

Overview

Philip G. Neudeck is affiliated with the Glenn Research Center in the United States. Their research primarily focuses on engineering, with a special emphasis on electrical and electronic engineering. The body of work spans several subfields, including materials chemistry, ceramics and composites, condensed matter physics, and mechanics of materials.

The scientist's research topics encompass a variety of specialized areas, such as:

  • Silicon Carbide Semiconductor Technologies
  • Semiconductor materials and devices
  • Silicon and Solar Cell Technologies
  • Advanced ceramic materials synthesis
  • Electromagnetic Compatibility and Noise Suppression
  • GaN-based semiconductor devices and materials
  • Electronic Packaging and Soldering Technologies

Philip G. Neudeck has contributed to multiple scientific publications, including:

  • "Emerging SiC Applications beyond Power Electronic Devices", 2023, published in Micromachines
  • "A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits", 2021, published in Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
  • "Experimental Study of Structural Materials for Prolonged Venus Surface Exploration Missions", 2020, published in Journal of Spacecraft and Rockets
  • "Upscaling of 500 °C Durable SiC JFET-R Integrated Circuits", 2021, published in Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
  • "Experimental Study on Mitigation of Lifetime-Limiting Dielectric Cracking in Extreme Temperature 4H-SiC JFET Integrated Circuits", 2020, published in Materials science forum

Frequent coauthors working alongside Philip G. Neudeck include:

  • David J. Spry
  • Dorothy Lukco
  • Gary W. Hunter
  • Michael J. Krasowski
  • Carl W. Chang

The primary publication venues where their work appears are:

  • Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
  • Materials science forum
  • Key engineering materials
  • Advanced Electronic Materials
  • IMAPSource Proceedings

Best Publications

  • High-temperature electronics - a role for wide bandgap semiconductors?

    Unknown

  • Site‐competition epitaxy for superior silicon carbide electronics

    David J. Larkin;Philip G. Neudeck;J. Anthony Powell;Lawrence G. Matus

  • Performance limiting micropipe defects in silicon carbide wafers

    P.G. Neudeck;J.A. Powell

  • Progress in silicon carbide semiconductor electronics technology

    Philip G. Neudeck

  • Study of bulk and elementary screw dislocation assisted reverse breakdown in low-voltage (<250 V) 4H-SiC p/sup +/-n junction diodes. I. DC properties

    P.G. Neudeck;Wei Huang;M. Dudley

  • Extreme temperature 6H-SiC JFET integrated circuit technology

    Philip G. Neudeck;Steven L. Garverick;David J. Spry;Liang Yu Chen

  • The mechanism of micropipe nucleation at inclusions in silicon carbide

    M. Dudley;X. R. Huang;W. Huang;A. Powell

  • Electrical Impact of SiC Structural Crystal Defects on High Electric Field Devices

    Philip G. Neudeck

  • Breakdown degradation associated with elementary screw dislocations in 4H-SiC p+n junction rectifiers

    P.G Neudeck;W Huang;M Dudley

  • Demonstration of 4H-SiC Digital Integrated Circuits Above 800 °C

    Philip G. Neudeck;David J. Spry;Liangyu Chen;Norman F. Prokop

  • Growth of step-free surfaces on device-size (0001)SiC mesas

    J. Anthony Powell;Philip G. Neudeck;Andrew J. Trunek;Glenn M. Beheim

  • 2000 V 6H-SIC P-N JUNCTION DIODES GROWN BY CHEMICAL VAPOR DEPOSITION

    Philip G. Neudeck;David J. Larkin;J. Anthony Powell;Lawrence G. Matus

  • Stable Electrical Operation of 6H–SiC JFETs and ICs for Thousands of Hours at 500 $^{\circ}\hbox{C}$

    Unknown

  • Positive temperature coefficient of breakdown voltage in 4H-SiC pn junction rectifiers

    P.G. Neudeck;C. Fazi

  • Comparison of interfacial and electronic properties of annealed Pd/SiC and Pd/SiO2/SiC Schottky diode sensors

    Liang-Yu Chen;Gary W. Hunter;Philip G. Neudeck;Gaurav Bansal

  • Emerging SiC Applications beyond Power Electronic Devices

    Unknown

  • CFD Growth of 3C-SiC on 4H/6H Mesas

    Philip G. Neudeck;Andrew J. Trunek;David J. Spry;J. Anthony Powell

  • Prolonged silicon carbide integrated circuit operation in Venus surface atmospheric conditions

    Philip G. Neudeck;Roger D. Meredith;Liangyu Chen;David J. Spry

  • Analysis of the temperature dependent thermal conductivity of silicon carbide for high temperature applications

    R. P. Joshi;P. G. Neudeck;C. Fazi

  • Electrical properties of epitaxial 3C- and 6H-SiC p-n junction diodes produced side-by-side on 6H-SiC substrates

    P.G. Neudeck;D.J. Larkin;J.E. Starr;J.A. Powell

  • An Overview of High Temperature Electronics and Sensor Development at NASA Glenn Research Center

    Gary W. Hunter;Philip G. Neudeck;Robert S. Okojie;Glenn M. Beheim

  • Prolonged 500 °C Demonstration of 4H-SiC JFET ICs With Two-Level Interconnect

    David J. Spry;Philip G. Neudeck;Liangyu Chen;Dorothy Lukco

  • SiC-Based Gas Sensor Development

    Gary W. Hunter;Philip G. Neudeck;M. Gray;D. Androjna

  • Measurement of n‐type dry thermally oxidized 6H‐SiC metal‐oxide‐semiconductor diodes by quasistatic and high‐frequency capacitance versus voltage and capacitance transient techniques

    P. Neudeck;S. Kang;J. Petit;M. Tabib‐Azar

  • Development of SiC-based Gas Sensors for Aerospace Applications

    G. W. Hunter;P. G. Neudeck;J. Xu;D. Lukco

Frequent Co-Authors

Michael Dudley
Michael Dudley Stony Brook University
Chung-Chiun Liu
Chung-Chiun Liu Case Western Reserve University
Charles R. Eddy
Charles R. Eddy United States Naval Research Laboratory
Marek Skowronski
Marek Skowronski Carnegie Mellon University
George E. Ponchak
George E. Ponchak Glenn Research Center
Joshua D. Caldwell
Joshua D. Caldwell Vanderbilt University
Mehran Mehregany
Mehran Mehregany Case Western Reserve University
Haibin Su
Haibin Su Hong Kong University of Science and Technology
Stephen J. Pearton
Stephen J. Pearton University of Florida
Pirouz Pirouz
Pirouz Pirouz Case Western Reserve University

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