Claude L. Bertin

What is he best known for?

The fields of study he is best known for:

• Electrical engineering
• Integrated circuit
• Transistor

Chip, Electrical engineering, Integrated circuit, Optoelectronics and Electronic engineering are his primary areas of study. His Chip research is multidisciplinary, incorporating perspectives in Electrical conductor, Semiconductor device, Semiconductor and Cable gland. As part of his studies on Electrical engineering, Claude L. Bertin often connects relevant subjects like Trench.

Claude L. Bertin usually deals with Integrated circuit and limits it to topics linked to Computer hardware and Lead frame. Claude L. Bertin interconnects Layer, Transistor, Front and Static random-access memory in the investigation of issues within Optoelectronics. His work deals with themes such as Semiconductor chip and Wafer, which intersect with Electronic engineering.

His most cited work include:

• Highly integrated chip-on-chip packaging (367 citations)
• Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit (261 citations)
• Three-dimensional direct-write EEPROM arrays and fabrication methods (195 citations)

What are the main themes of his work throughout his whole career to date?

His primary areas of study are Electrical engineering, Optoelectronics, Chip, Electronic engineering and Integrated circuit. He regularly ties together related areas like Semiconductor device in his Electrical engineering studies. His study in the field of Semiconductor, Insulator and Wafer is also linked to topics like Stack.

The study incorporates disciplines such as Semiconductor chip and Polyimide in addition to Semiconductor. His work in Chip tackles topics such as Substrate which are related to areas like Structural engineering. His Electronic engineering study combines topics in areas such as Electrical impedance and Driver circuit, Signal.

He most often published in these fields:

• Electrical engineering (45.56%)
• Optoelectronics (39.64%)
• Chip (25.44%)

What were the highlights of his more recent work (between 1998-2006)?

• Optoelectronics (39.64%)
• Electrical engineering (45.56%)
• Electronic engineering (25.44%)

In recent papers he was focusing on the following fields of study:

Claude L. Bertin mainly focuses on Optoelectronics, Electrical engineering, Electronic engineering, Voltage and Chip. His study in Optoelectronics is interdisciplinary in nature, drawing from both Low voltage and Conductor. The concepts of his Electrical engineering study are interwoven with issues in Silicon on insulator and Semiconductor device.

His work deals with themes such as Wafer, Substrate, Node, Electrical impedance and Signal, which intersect with Electronic engineering. His Chip study incorporates themes from Electrical conductor, Integrated circuit, Soldering and Cable gland. His Integrated circuit research is multidisciplinary, relying on both Computer hardware and Embedded system.

Between 1998 and 2006, his most popular works were:

• Through-chip conductors for low inductance chip-to-chip integration and off-chip connections (148 citations)
• Chip interconnection structure using stub terminals (144 citations)
• Rolling ball connector (112 citations)

In his most recent research, the most cited papers focused on:

• Electrical engineering
• Integrated circuit
• Transistor

Claude L. Bertin spends much of his time researching Electrical engineering, Optoelectronics, Electronic engineering, Integrated circuit and Chip. His Electrical engineering study frequently intersects with other fields, such as Silicon on insulator. His Optoelectronics study integrates concerns from other disciplines, such as Semiconductor device and Conductor.

The Electronic engineering study combines topics in areas such as Semiconductor structure, Gate dielectric, Wafer backgrinding and Copper interconnect. His Integrated circuit research integrates issues from Power management, Decodes, Embedded system and Power control. His Chip research incorporates themes from Cable gland, Structural engineering and Electrical conductor, Composite material, Thermal expansion.