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D-Index & Metrics

Electronics and Electrical Engineering

D-Index
33
Citations
4414
World Ranking
6100
National Ranking
108

Overview

Jhon-Jhy Liaw is affiliated with Taiwan Semiconductor Manufacturing Company (Taiwan) and works in the engineering field, focusing primarily on electrical and electronic engineering. Their research contributions span several interconnected areas within semiconductor technology and integrated circuits.

The main topics explored in Liaw's work include:

  • Advancements in Semiconductor Devices and Circuit Design
  • Semiconductor Materials and Devices
  • Integrated Circuits and Semiconductor Failure Analysis
  • Low-power High-performance VLSI Design
  • Radiation Effects in Electronics

Liaw has published research in prominent venues such as the 2022 International Electron Devices Meeting (IEDM) and the IEEE Journal of Solid-State Circuits. These venues feature high-impact studies related to semiconductor device technologies and circuit design.

Recent papers authored by or involving Liaw include:

  • "A 3nm CMOS FinFlex™ Platform Technology with Enhanced Power Efficiency and Performance for Mobile SoC and High Performance Computing Applications," 2022, 2022 International Electron Devices Meeting (IEDM)
  • "Critical Process Features Enabling Aggressive Contacted Gate Pitch Scaling for 3nm CMOS Technology and Beyond," 2022, 2022 International Electron Devices Meeting (IEDM)
  • "3.7-GHz Multi-Bank High-Current Single-Port Cache SRAM With Leakage Saving Circuits in 3-nm FinFET for HPC Applications," 2024, IEEE Journal of Solid-State Circuits

Their collaborative work involves frequent coauthors including Shien-Yang Wu, M.C. Chiang, J.-Y. Yeh, H.F. Chen, and K.T. Lai, each coauthoring multiple publications in the semiconductor field. This network supports ongoing research in device performance improvement and semiconductor scaling.

Liaw's contributions focus on developing low-power, high-efficiency semiconductor device platforms and novel circuit designs tailored for mobile systems-on-chips and high-performance computing applications. This aligns with trends in scaling CMOS technology to advanced nodes such as 3nm, addressing performance, power efficiency, and integration challenges.

Best Publications

  • Method of forming static random access memory (SRAM) and layout of SRAM

    Liaw Jhon-Jhy

  • Memory cell structure

    Jhon-Jhy Liaw

  • A 16nm FinFET CMOS technology for mobile SoC and computing applications

    Shien-Yang Wu;C. Y. Lin;M. C. Chiang;J. J. Liaw

  • SRAM cell design with high resistor CMOS gate structure for soft error rate improvement

    Jhon-Jhy Liaw

  • Methods for operating a FinFET SRAM array

    Jhon-Jhy Liaw

  • A 7nm CMOS platform technology featuring 4 th generation FinFET transistors with a 0.027um 2 high density 6-T SRAM cell for mobile SoC applications

    Shien-Yang Wu;C.Y. Lin;M.C. Chiang;J.J. Liaw

  • 13.5 A 16nm 128Mb SRAM in high-κ metal-gate FinFET technology with write-assist circuitry for low-V MIN applications

    Jonathan Chang;Yen-Huei Chen;Wei-Min Chan;Sahil Preet Singh

  • Semiconductor structure and method for forming the semiconductor structure

    Liaw Jhon-Jhy

  • FinFET Memory Device

    Jhon-Jhy Liaw

  • Method for metal gate structure for MOS devices

    Jhon-Jhy Liaw

  • Leakage scaling in deep submicron CMOS for SoC

    Yo-Sheng Lin;Chung-Cheng Wu;Chih-Sheng Chang;Rong-Ping Yang

  • Using an extra boron implant to improve the NMOS reverse narrow width effect in shallow trench isolation process

    Jhon-Jhy Liaw;Dun-Nian Yaung;Jin-Yuan Lee

  • Semiconductor device with improved contact structure and method of forming same

    Jhon-Jhy Liaw

  • Method of forming a static random access memory with a buried local interconnect

    Jhon-Jhy Liaw

  • An enhanced 16nm CMOS technology featuring 2 nd generation FinFET transistors and advanced Cu/low-k interconnect for low power and high performance applications

    Shien-Yang Wu;C.Y. Lin;M.C. Chiang;J.J. Liaw

  • Laterally recessed tungsten silicide gate structure used with a self-aligned contact structure including a straight walled sidewall spacer while filling recess

    Jhon-Jhy Liaw

  • Fuse window guard ring structure for nitride capped self aligned contact processes

    Jhon-Jhy Liaw

  • A 25-nm gate-length FinFET transistor module for 32nm node

    Chang-Yun Chang;Tsung-Lin Lee;Clement Wann;Li-Shyue Lai

  • Shallow trench isolation methods employing gap filling doped silicon oxide dielectric layer

    Jhon-Jhy Liaw;Jin-Yuan Lee;Kuei-Ying Lee;Chu-Yun Fu

  • Methods and apparatus for FinFET SRAM cells

    Jhon-Jhy Liaw

Frequent Co-Authors

Carlos H. Diaz
Carlos H. Diaz Taiwan Semiconductor Manufacturing Company (United States)
Mong-Song Liang
Mong-Song Liang Taiwan Semiconductor Manufacturing Company (United States)
Chenming Hu
Chenming Hu University of California, Berkeley
Clement Hsingjen Wann
Clement Hsingjen Wann Taiwan Semiconductor Manufacturing Company (Taiwan)
Fu-Liang Yang
Fu-Liang Yang Academia Sinica

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