World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
31
Citations
5111
World Ranking
6494
National Ranking
2129

Keith Bowman publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Keith Bowman sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 100 publications — 4th percentile

4% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Keith Bowman D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Keith Bowman sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 31 D-Index — 6th percentile

6% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

Keith Bowman is affiliated with Qualcomm in the United States. Their research primarily focuses on engineering, with a strong emphasis on electrical and electronic engineering as well as biomedical engineering.

Bowman has an extensive publication record in the field of electrical and electronic engineering, contributing to various subfields and topics including:

  • Low-power high-performance VLSI design
  • Semiconductor materials and devices
  • Advancements in Semiconductor Devices and Circuit Design
  • Analog and Mixed-Signal Circuit Design
  • Advanced Memory and Neural Computing
  • Smart Grid Energy Management
  • 3D IC and TSV technologies

Their recent publications cover a range of relevant topics and were published in notable venues between 2020 and 2022. Key papers include:

  • "Review, Survey, and Benchmark of Recent Digital LDO Voltage Regulators," 2022, 2022 IEEE Custom Integrated Circuits Conference (CICC)
  • "A Proactive System for Voltage-Droop Mitigation in a 7-nm Hexagon™ Processor," 2020, IEEE Journal of Solid-State Circuits
  • "A Current and Temperature Limiting System in a 7-nm Hexagon™ Compute Digital Signal Processor," 2021, IEEE Journal of Solid-State Circuits
  • "Constructive Feedback, Positive Influence [People]," 2021, IEEE Solid-State Circuits Magazine
  • "ISSCC Special Event: Going Remote-Challenges and Opportunities for Remote Learning, Work, and Collaboration [Conferece Reports]," 2021, IEEE Solid-State Circuits Magazine

Keith Bowman's frequent coauthors include:

  • Vijay Kiran Kalyanam
  • Eric Mahurin
  • Jacob A. Abraham
  • Zhaoqing Wang
  • Sung Justin Kim

The venues where Bowman's research appears most frequently are:

  • IEEE Journal of Solid-State Circuits
  • IEEE Solid-State Circuits Magazine
  • 2022 IEEE Custom Integrated Circuits Conference (CICC)
  • IEEE Spectrum

Best Publications

  • Impact of die-to-die and within-die parameter fluctuations on the maximum clock frequency distribution for gigascale integration

    K.A. Bowman;S.G. Duvall;J.D. Meindl

  • Energy-Efficient and Metastability-Immune Resilient Circuits for Dynamic Variation Tolerance

    Keith A. Bowman;James W. Tschanz;Nam Sung Kim;Janice C. Lee

  • Energy-Efficient and Metastability-Immune Resilient Circuits for Dynamic Variation Tolerance

    K.A. Bowman;J.W. Tschanz;Nam Sung Kim;J.C. Lee

  • A physical alpha-power law MOSFET model

    K.A. Bowman;B.L. Austin;J.C. Eble;Xinghai Tang

  • A 45 nm Resilient Microprocessor Core for Dynamic Variation Tolerance

    K A Bowman;J W Tschanz;S L Lu;P A Aseron

  • A physical alpha-power law MOSFET model

    Keith A. Bowman;Blanca L. Austin;John C. Eble;Xinghai Tang

  • Tunable replica circuits and adaptive voltage-frequency techniques for dynamic voltage, temperature, and aging variation tolerance

    James Tschanz;Keith Bowman;Steve Walstra;Marty Agostinelli

  • Within-Die Variation-Aware Dynamic-Voltage-Frequency-Scaling With Optimal Core Allocation and Thread Hopping for the 80-Core TeraFLOPS Processor

    S Dighe;S R Vangal;P Aseron;S Kumar

  • Impact of Parameter Variations on Circuits and Microarchitecture

    O.S. Unsal;J.W. Tschanz;K. Bowman;V. De

  • Circuit techniques for dynamic variation tolerance

    Keith Bowman;James Tschanz;Chris Wilkerson;Shih-Lien Lu

  • Impact of extrinsic and intrinsic parameter fluctuations on CMOS circuit performance

    K.A. Bowman;Xinghai Tang;J.C. Eble;J.D. Menldl

  • Energy-Efficient and Metastability-Immune Timing-Error Detection and Instruction-Replay-Based Recovery Circuits for Dynamic-Variation Tolerance

    K.A. Bowman;J.W. Tschanz;Nam Sung Kim;J.C. Lee

  • A minimum total power methodology for projecting limits on CMOS GSI

    A.J. Bhavnagarwala;B.L. Austin;K.A. Bowman;J.D. Meindl

  • Variation-tolerant circuits: circuit solutions and techniques

    Jim Tschanz;Keith Bowman;Vivek De

  • Optimal n-tier multilevel interconnect architectures for gigascale integration (GSI)

    R. Venkatesan;J.A. Davis;K.A. Bowman;J.D. Meindl

  • PVT-and-aging adaptive wordline boosting for 8T SRAM power reduction

    Arijit Raychowdhury;Bibiche Geuskens;Jaydeep Kulkarni;Jim Tschanz

  • A 22 nm All-Digital Dynamically Adaptive Clock Distribution for Supply Voltage Droop Tolerance

    K. A. Bowman;C. Tokunaga;T. Karnik;V. K. De

  • Impact of Die-to-Die and Within-Die Parameter Variations on the Clock Frequency and Throughput of Multi-Core Processors

    K.A. Bowman;A.R. Alameldeen;S.T. Srinivasan;C.B. Wilkerson

  • Impact of die-to-die and within-die parameter variations on the throughput distribution of multi-core processors

    Keith A. Bowman;Alaa R. Alameldeen;Srikanth T. Srinivasan;Chris B. Wilkerson

  • A 45nm resilient and adaptive microprocessor core for dynamic variation tolerance

    James Tschanz;Keith Bowman;Shih-Lien Lu;Paolo Aseron

  • Within-die variation-aware dynamic-voltage-frequency scaling core mapping and thread hopping for an 80-core processor

    Saurabh Dighe;Sriram Vangal;Paolo Aseron;Shasi Kumar

  • Variation -To I era n t C i rcu its : C i rc u i t So I uti o n s and Techniques

    Jim Tschanz;Keith Bowman;Vivek De

Frequent Co-Authors

James W. Tschanz
James W. Tschanz Intel (United States)
Vivek De
Vivek De Intel (United States)
Tanay Karnik
Tanay Karnik Intel (United States)
Shih-Lien Lu
Shih-Lien Lu Washington State University
James D. Meindl
James D. Meindl Georgia Institute of Technology
Chris Wilkerson
Chris Wilkerson Nvidia (United Kingdom)
Arijit Raychowdhury
Arijit Raychowdhury Georgia Institute of Technology
Muhammad M. Khellah
Muhammad M. Khellah Intel (United States)
Nam Sung Kim
Nam Sung Kim University of Illinois at Urbana-Champaign
Shekhar Borkar
Shekhar Borkar Qualcomm (United States)

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