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Charles W. Koburger

Charles W. Koburger

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
36
Citations
5465
World Ranking
5345
National Ranking
1843

Overview

Charles W. Koburger is affiliated with IBM in the United States. Their professional work is carried out primarily within this organization.

There are no recent papers listed under their name, and no frequent co-authors or common publication venues have been identified. Similarly, there is no information available regarding book publications or specific awards.

The data does not include detailed information about the main fields of study, subfields, or specific topics related to Koburger's research. As a result, further details on these aspects cannot be provided.

Best Publications

  • Method for manufacturing a multi-level interconnect structure

    David Vaclav Horak;Charles William Koburger;Peter H. Mitchell;Larry Alan Nesbit

  • Forming capping layer over metal wire structure using selective atomic layer deposition

    Toshiharu Furukawa;Steven J. Holmes;David V. Horak;Charles W. Koburger

  • MOVEMENT OF LENS FOR IMMERSION OPTICAL LITHOGRAPHY

    Hakey Mark Charles;Horak David;Koburger Charles W;Mitchell Peter H

  • Liquid-filled balloons for immersion lithography

    Mark C. Hakey;David V. Horak;Charles W. Koburger;Peter H. Mitchell

  • System and apparatus for photolithography

    Mark Charles Hakey;David Vaclay Horak;Charles William Koburger;Peter H. Mitchell

  • A variable-size shallow trench isolation (STL) technology with diffused sidewall doping for submicron CMOS

    B. Davari;C. Koburger;T. Furukawa;Y. Taur

  • Method for forming quadruple density sidewall image transfer (SIT) structures

    Toshiharu Furukawa;Mark Charles Hakey;Steven John Holmes;David Vaclav Horak

  • Integration of chemical-mechanical polishing into CMOS integrated circuit manufacturing

    Howard Landis;Peter Burke;William Cote;William Hill

  • The evolution of IBM CMOS DRAM technology

    E. Adler;J. K. DeBrosse;S. F. Geissler;S. J. Holmes

  • A new planarization technique, using a combination of RIE and chemical mechanical polish (CMP)

    B. Davarik;C.W. Koburger;R. Schulz;J.D. Warnock

  • Layout and process to contact sub-lithographic structures

    Toshiharu Furukawa;Mark Charles Hakey;Steven J. Holmes;David V. Horak

  • Simultaneous conditioning of a plurality of memory cells through series resistors

    Toshijaru Furukawa;Mark C. Hakey;Steven J. Holmes;David V. Horak

  • Forming wide dielectric-filled isolation trenches in semi-conductors

    Somanath Dash;Michael L. Kerbaugh;Charles W. Koburger;Brian J. Machesney

  • Sealed air gap for semiconductor chip

    David V. Horak;Elbert E. Huang;Charles W. Koburger;Douglas C. La Tulipe

  • Ultra-thin-body and BOX (UTBB) fully depleted (FD) device integration for 22nm node and beyond

    Q. Liu;A. Yagishita;N. Loubet;A. Khakifirooz

  • 22 nm technology compatible fully functional 0.1 μm 2 6T-SRAM cell

    B.S. Haran;A. Kumar;L. Adam;J. Chang

  • METHOD OF FORMING VERTICAL NANOTUBE SEMICONDUCTOR DEVICE STRUCTURES

    Furukawa Toshiharu;Hackney Marc Charles;Steven John Holmes;David Vaclav Horak

  • Silicon-on-insulator (SOI) Read Only Memory (ROM) array and method of making a SOI ROM

    Toshiharu Furukawa;Mark C. Hakey;Steven J. Holmes;David V. Horak

  • Borderless contact structures

    Toshiharu Furukawa;David V. Horak;Charles W. Koburger

  • Method for fabricating strained silicon-on-insulator strucutures and strained silicon-on-insulator strucutres formed thereby

    Furukawa Toshiharu;Koburger Iii Charles William;Slinkman James Albert

Frequent Co-Authors

David V. Horak
David V. Horak IBM (United States)
Toshiharu Furukawa
Toshiharu Furukawa IBM (United States)
Steven J. Holmes
Steven J. Holmes IBM (United States)
Mark C. Hakey
Mark C. Hakey Semivation
Jack A. Mandelman
Jack A. Mandelman Independent Scientist / Consultant, US
William R. Tonti
William R. Tonti Institute of Electrical and Electronics Engineers
Bruce B. Doris
Bruce B. Doris IBM (United States)
Kangguo Cheng
Kangguo Cheng IBM (United States)
Ali Khakifirooz
Ali Khakifirooz Intel (United States)
Vamsi K. Paruchuri
Vamsi K. Paruchuri IBM (United States)

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Best Scientists Citing Charles W. Koburger