The chart shows the distribution of publications by all Research.com ranked scientists in the field of Materials Science in 2026. The highlighted bar marks where William A. Lanford sits on this spectrum.
This scientist: 220 publications — 37th percentile
37% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 1,163 publications or more.
The chart shows the D-index (discipline H-index) distribution of Materials Science scientists ranked by Research.com in 2026. The highlighted bar marks where William A. Lanford sits on this spectrum.
This scientist: 50 D-Index — 22nd percentile
22% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 165 D-Index or more.
William A. Lanford is affiliated with the University at Albany, State University of New York in the United States. Their research spans multiple fields related to materials science and engineering, with a focus on materials chemistry and electrical and electronic engineering. The subfields studied also include polymers and plastics, instrumentation, and electronic, optical, and magnetic materials.
Their work covers a range of specialized topics within materials science, including diamond and carbon-based materials research, thermal properties of materials, and semiconductor materials and devices. Additional areas of investigation include polymer nanocomposite synthesis and irradiation, advanced semiconductor detectors and materials, integrated circuits and semiconductor failure analysis, as well as advanced optical sensing technologies.
Recent papers authored or coauthored by William A. Lanford illustrate their contributions to these areas. Notable publications include:
Frequent coauthors collaborating with William A. Lanford include:
The venues where William A. Lanford has recently published reflect the interdisciplinary nature of their research:
William A. Lanford was recognized with the distinction of Fellow of the Alfred P. Sloan Foundation in 1979.
W. A. Lanford;M. J. Rand
A. A. Langford;M. L. Fleet;B. P. Nelson;W. A. Lanford
D.J Cherniak;W.A Lanford;F.J Ryerson
W.A. Lanford;K. Davis;P. Lamarche;T. Laursen
M. H. Brodsky;M. A. Frisch;J. F. Ziegler;W. A. Lanford
S.P. Murarka;R.J. Gutmann;A.E. Kaloyeros;W.A. Lanford
J. F. Ziegler;W. A. Lanford
W.A. Lanford
J.F. Ziegler;C.P. Wu;P. Williams;C.W. White
Ray Chow;W. A. Lanford;Wang Ke‐Ming;Richard S. Rosler
W.A. Lanford
P. J. Ding;W. A. Lanford;S. Hymes;S. P. Murarka
F. J. Ryerson;W. B. Durham;D. J. Cherniak;W. A. Lanford
W.A. Lanford;P.J. Ding;W. Wang;S. Hymes
R. H. Do Remus;Y. Mehrotra;W. A. Lanford;C. Burman
S. Hymes;S. P. Murarka;C. Shepard;W. A. Lanford
Thomas J. Webster;Celaletdin Ergun;Robert H. Doremus;William A. Lanford
P. J. Ding;W. A. Lanford;S. Hymes;S. P. Murarka
John T. Gaskins;Patrick E. Hopkins;Devin R. Merrill;Devin R. Merrill;Sage R. Bauers
Ulrich K. Krieger;W.A. Lanford
S.W. King;M. French;J. Bielefeld;W.A. Lanford
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