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Materials Science

D-Index
50
Citations
10176
World Ranking
10168
National Ranking
2438

Research.com Recognitions

  • 1979 - Fellow of Alfred P. Sloan Foundation

Overview

William A. Lanford is affiliated with the University at Albany, State University of New York in the United States. Their research spans multiple fields related to materials science and engineering, with a focus on materials chemistry and electrical and electronic engineering. The subfields studied also include polymers and plastics, instrumentation, and electronic, optical, and magnetic materials.

Their work covers a range of specialized topics within materials science, including diamond and carbon-based materials research, thermal properties of materials, and semiconductor materials and devices. Additional areas of investigation include polymer nanocomposite synthesis and irradiation, advanced semiconductor detectors and materials, integrated circuits and semiconductor failure analysis, as well as advanced optical sensing technologies.

Recent papers authored or coauthored by William A. Lanford illustrate their contributions to these areas. Notable publications include:

  • Thermal Conductivity Enhancement in Ion-Irradiated Hydrogenated Amorphous Carbon Films, 2021, published in Nano Letters
  • In Situ Deep-Level Transient Spectroscopy and Dark Current Measurements of Proton-Irradiated InGaAs Photodiodes, 2020, IEEE Transactions on Nuclear Science
  • Density and atomic coordination dictate vibrational characteristics and thermal conductivity of amorphous silicon carbide, 2022, Physical Review Materials
  • Comprehensive Study of the Chemical, Physical, and Structural Evolution of Molecular Layer Deposited Alucone Films during Thermal Processing, 2023, Chemistry of Materials
  • Effects of burial powder configuration on the microstructure, composition, and ion conductivity of perovskite Li 3xLa 1/3-x TaO 3 ion conductors, 2022, Journal of the American Ceramic Society

Frequent coauthors collaborating with William A. Lanford include:

  • Sean W. King
  • Han Li
  • Patrick E. Hopkins
  • Kevin B. Wynne
  • Ethan A. Scott

The venues where William A. Lanford has recently published reflect the interdisciplinary nature of their research:

  • Nano Letters
  • IEEE Transactions on Nuclear Science
  • Physical Review Materials
  • Chemistry of Materials
  • Journal of the American Ceramic Society

William A. Lanford was recognized with the distinction of Fellow of the Alfred P. Sloan Foundation in 1979.

Best Publications

  • The hydrogen content of plasma‐deposited silicon nitride

    W. A. Lanford;M. J. Rand

  • Infrared absorption strength and hydrogen content of hydrogenated amorphous silicon.

    A. A. Langford;M. L. Fleet;B. P. Nelson;W. A. Lanford

  • Lead diffusion in apatite and zircon using ion implantation and Rutherford Backscattering techniques

    D.J Cherniak;W.A Lanford;F.J Ryerson

  • Hydration of soda-lime glass

    W.A. Lanford;K. Davis;P. Lamarche;T. Laursen

  • Quantitative analysis of hydrogen in glow discharge amorphous silicon

    M. H. Brodsky;M. A. Frisch;J. F. Ziegler;W. A. Lanford

  • Advanced multilayer metallization schemes with copper as interconnection metal

    S.P. Murarka;R.J. Gutmann;A.E. Kaloyeros;W.A. Lanford

  • The effect of sea level cosmic rays on electronic devices

    J. F. Ziegler;W. A. Lanford

  • Analysis for hydrogen by nuclear reaction and energy recoil detection

    W.A. Lanford

  • Profiling hydrogen in materials using ion beams

    J.F. Ziegler;C.P. Wu;P. Williams;C.W. White

  • Hydrogen content of a variety of plasma‐deposited silicon nitrides

    Ray Chow;W. A. Lanford;Wang Ke‐Ming;Richard S. Rosler

  • 15N hydrogen profiling: Scientific applications

    W.A. Lanford

  • Effects of the addition of small amounts of Al to copper: Corrosion, resistivity, adhesion, morphology, and diffusion

    P. J. Ding;W. A. Lanford;S. Hymes;S. P. Murarka

  • Oxygen diffusion in olivine: Effect of oxygen fugacity and implications for creep

    F. J. Ryerson;W. B. Durham;D. J. Cherniak;W. A. Lanford

  • Low-temperature passivation of copper by doping with Al or Mg

    W.A. Lanford;P.J. Ding;W. Wang;S. Hymes

  • REACTION OF WATER WITH GLASS: INFLUENCE OF A TRANSFORMED SURFACE LAYER

    R. H. Do Remus;Y. Mehrotra;W. A. Lanford;C. Burman

  • Passivation of copper by silicide formation in dilute silane

    S. Hymes;S. P. Murarka;C. Shepard;W. A. Lanford

  • Increased osteoblast adhesion on titanium-coated hydroxylapatite that forms CaTiO3.

    Thomas J. Webster;Celaletdin Ergun;Robert H. Doremus;William A. Lanford

  • Oxidation resistant high conductivity copper films

    P. J. Ding;W. A. Lanford;S. Hymes;S. P. Murarka

  • Review—Investigation and Review of the Thermal, Mechanical, Electrical, Optical, and Structural Properties of Atomic Layer Deposited High-k Dielectrics: Beryllium Oxide, Aluminum Oxide, Hafnium Oxide, and Aluminum Nitride

    John T. Gaskins;Patrick E. Hopkins;Devin R. Merrill;Devin R. Merrill;Sage R. Bauers

  • Field assisted transport of Na+ ions, Ca2+ ions and electrons in commercial soda-lime glass I: Experimental

    Ulrich K. Krieger;W.A. Lanford

  • Fourier transform infrared spectroscopy investigation of chemical bonding in low-k a-SiC:H thin films

    S.W. King;M. French;J. Bielefeld;W.A. Lanford

Frequent Co-Authors

Toh-Ming Lu
Toh-Ming Lu Rensselaer Polytechnic Institute
Robert H. Doremus
Robert H. Doremus Rensselaer Polytechnic Institute
Patrick E. Hopkins
Patrick E. Hopkins University of Virginia
Gwo-Ching Wang
Gwo-Ching Wang Rensselaer Polytechnic Institute
Sanjay K. Banerjee
Sanjay K. Banerjee The University of Texas at Austin
Frederick J. Ryerson
Frederick J. Ryerson Lawrence Livermore National Laboratory
Minoru Tomozawa
Minoru Tomozawa Rensselaer Polytechnic Institute
Thomas Peter
Thomas Peter ETH Zurich
Karl K. Turekian
Karl K. Turekian Yale University
S. Krishnaswami
S. Krishnaswami Physical Research Laboratory

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