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Junichi Koike

Junichi Koike

D-Index & Metrics

Materials Science

D-Index
53
Citations
12803
World Ranking
9108
National Ranking
528

Overview

Junichi Koike is affiliated with Tohoku University in Japan, specializing in engineering and materials science. Their research primarily focuses on electrical and electronic engineering, with significant contributions to electronic, optical, and magnetic materials, as well as atomic and molecular physics and optics.

The scientist's main research topics include copper interconnects and reliability, semiconductor materials and devices, semiconductor materials and interfaces, aluminum alloys composites properties, electronic packaging and soldering technologies, 3D IC and TSV technologies, and molecular junctions and nanostructures.

Junichi Koike has published in several academic venues, with frequent appearances in:

  • Applied Surface Science
  • Journal of Applied Physics
  • Journal of The Electrochemical Society
  • Journal of Alloys and Compounds
  • AIP Advances

Their recent papers cover diverse topics within their fields of expertise. These include:

  • "Interdiffusion reliability and resistivity scaling of intermetallic compounds as advanced interconnect materials," 2021, Journal of Applied Physics
  • "Polydopamine and Its Composite Film as an Adhesion Layer for Cu Electroless Deposition on SiO2," 2020, Journal of The Electrochemical Society
  • "Potential of low-resistivity Cu2Mg for highly scaled interconnects and its challenges," 2020, Applied Surface Science
  • "Electromigration characteristics of CuAl2," 2022, Journal of Alloys and Compounds
  • "Low contact resistivity of metal/n-GaN by the reduction of gap states with an epitaxially grown GaOx insulating layer," 2022, AIP Advances

Junichi Koike has collaborated frequently with other researchers in the field. Their notable co-authors include:

  • Masataka Yahagi
  • Yuji Sutou
  • Daisuke Ando
  • Linghan Chen
  • Toshihiro Kuge

Best Publications

  • The activity of non-basal slip systems and dynamic recovery at room temperature in fine-grained AZ31B magnesium alloys

    J Koike;T Kobayashi;T Mukai;H Watanabe

  • Strengthening Mechanisms of Creep Resistant Tempered Martensitic Steel

    Kouichi Maruyama;Kota Sawada;Jun-ichi Koike

  • Enhanced deformation mechanisms by anisotropic plasticity in polycrystalline Mg alloys at room temperature

    Junichi Koike

  • Novel hexagonal structure and ultrahigh strength of magnesium solid solution in the Mg–Zn–Y system

    Akihisa Inoue;Yoshihito Kawamura;Mitsuhide Matsushita;Kentaro Hayashi

  • Grain-Boundary Sliding in AZ31 Magnesium Alloys at Room Temperature to 523 K

    J. Koike;R. Ohyama;T. Kobayashi;M. Suzuki

  • Geometrical criterion for the activation of prismatic slip in AZ61 Mg alloy sheets deformed at room temperature

    J. Koike;R. Ohyama

  • Self-forming diffusion barrier layer in Cu–Mn alloy metallization

    J. Koike;M. Wada

  • Relationship between deformation twinning and surface step formation in AZ31 magnesium alloys

    D. Ando;J. Koike;Y. Sutou

  • Strengthening effect of Zn in heat resistant Mg-Y-Zn solid solution alloys

    M. Suzuki;T. Kimura;J. Koike;K. Maruyama

  • Displacement threshold energy for type IIa diamond

    J. Koike;D. M. Parkin;T. E. Mitchell

  • A lightweight shape-memory magnesium alloy.

    Yukiko Ogawa;Daisuke Ando;Yuji Sutou;Junichi Koike

  • Crystal to amorphous transformation of NiTi induced by cold rolling

    J. Koike;D. M. Parkin;M. Nastasi

  • The role of deformation twinning in the fracture behavior and mechanism of basal textured magnesium alloys

    D. Ando;J. Koike;Y. Sutou

  • Roles of deformation twinning and dislocation slip in the fatigue failure mechanism of AZ31 Mg alloys

    J. Koike;N. Fujiyama;D. Ando;Y. Sutou

  • Effects of zinc on creep strength and deformation substructures in Mg–Y alloy

    Mayumi Suzuki;Tsuyoshi Kimura;Junichi Koike;Kouichi Maruyama

  • Origin of the Anomalous {1012} Twinning during Tensile Deformation of Mg Alloy Sheet

    J. Koike;Y. Sato;D. Ando

  • Stress-induced phase transformation during superplastic deformation in two-phase Ti–Al–Fe alloy

    J. Koike;Y. Shimoyama;I. Ohnuma;T. Okamura

  • In situ observation of partial melting in superplastic aluminum alloy composites at high temperatures

    J. Koike;M. Mabuchi;K. Higashi

  • Growth behavior of self-formed barrier at Cu–Mn∕SiO2 interface at 250–450°C

    M. Haneda;J. Iijima;J. Koike

  • Growth kinetics and thermal stability of a self-formed barrier layer at Cu-Mn∕SiO2 interface

    J. Koike;M. Haneda;J. Iijima;Y. Otsuka

Frequent Co-Authors

Yuji Sutou
Yuji Sutou Tohoku University
Yoshihito Kawamura
Yoshihito Kawamura Kumamoto University
Tatsuya Shimoda
Tatsuya Shimoda Japan Advanced Institute of Science and Technology
Akihisa Inoue
Akihisa Inoue Josai International University
Kenji Higashi
Kenji Higashi Osaka Metropolitan University
Young-Chang Joo
Young-Chang Joo Seoul National University
Shigeharu Kamado
Shigeharu Kamado Nagaoka University of Technology
Keisuke Kobayashi
Keisuke Kobayashi Japan Atomic Energy Agency
Mitsumasa Koyanagi
Mitsumasa Koyanagi Tohoku University
Toshiji Mukai
Toshiji Mukai Kobe University

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