Robert John Wojnarowski

Best Publications

• Capacitive touch entry apparatus having high degree of personal safety

  Charles W. Eichelberger;Robert J. Wojnarowski

  288
  Citations

• Electronic device pad relocation, precision placement, and packaging in arrays

  Robert John Wojnarowski

  264
  Citations

• Circuit chip package and fabrication method

  Raymond Albert Fillion;Ernest Wayne Balch;Ronald Frank Kolc;William Edward Burdick

  234
  Citations

• Method for thinning of integrated circuit chips for lightweight packaged electronic systems

  Robert J. Wojnarowski

  224
  Citations

• Phosphor coating with self-adjusting distance from LED chip

  Steven Jude Duclos;Jon Jansma;Jacob C. Bortscheller;Robert J. Wojnarowski

  197
  Citations

• Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer

  Charles W. Eichelberger;Robert J. Wojnarowski;B. Welles Ii Kenneth

  196
  Citations

• Multichip integrated circuit packaging method

  Charles W. Eichelberger;Robert J. Wojnarowski

  193
  Citations

• Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers

  Robert John Wojnarowski;Thomas Bert Gorczyca

  186
  Citations

• LED cross-linkable phosphor coating

  Jacob C. Bortscheller;Robert J. Wojnarowski

  175
  Citations

• Integral power and ground structure for multi-chip modules

  Raymond A. Fillion;Robert J. Wojnarowski

  174
  Citations

• Method of forming thin film resistors on organic surfaces

  Robert John Wojnarowski;James Wilson Rose;Kyung Wook Paik;Michael Gdula

  164
  Citations

• Light source including an array of light emitting semiconductor devices and control method

  Robert John Wojnarowski;Barry Scott Whitmore;William Paul Kornrumpf

  163
  Citations

• Integrated circuit packaging configuration for rapid customized design and unique test capability

  Charles William Eichelberger;Kenneth Brakeley Ii Welles;Robert John Wojnarowski

  154
  Citations

• Interface structures for electronic devices

  Robert John Wojnarowski

  150
  Citations

• Excimer laser patterning of a novel resist

  Robert J. Wojnarowski;Charles W. Eichelberger

  149
  Citations

• Method for packaging integrated circuit chips employing a polymer film overlay layer

  Charles W. Eichelberger;Robert J. Wojnarowski;B. Welles Ii Kenneth

  149
  Citations

• High power LED lamp structure using phase change cooling enhancements for LED lighting products

  Robert J. Wojnarowski;William P. Minnear

  147
  Citations

• Vacuum fixture and method for fabricating electronic assemblies

  Robert J. Wojnarowski;Thomas B. Gorczyca

  142
  Citations

• Led lead frame assembly

  Robert J. Wojnarowski;Richard J. Uriarte;Ferenc Horkay;Pamela K. Benicewicz

  138
  Citations

• High power white LED lamp structure using unique phosphor application for LED lighting products

  Robert J. Wojnarowski;Thomas J. Pozda

  128
  Citations