Charles W. Eichelberger

What is he best known for?

The fields of study he is best known for:

• Electrical engineering
• Integrated circuit
• Amplifier

His scientific interests lie mostly in Optoelectronics, Electronic engineering, Integrated circuit, Chip and Substrate. His Optoelectronics study integrates concerns from other disciplines, such as Electrical conductor, Capacitive sensing, Electrical engineering, Current and Layer. His Layer research is multidisciplinary, incorporating elements of Laser and Polymer.

His Electronic engineering research integrates issues from Interfacing, Twisted pair and Transceiver. His study in the fields of Integrated circuit packaging under the domain of Chip overlaps with other disciplines such as Overlay. Charles W. Eichelberger conducted interdisciplinary study in his works that combined Substrate and Stack.

His most cited work include:

• Multichip integrated circuit packaging configuration and method (323 citations)
• Compact high density interconnect structure (281 citations)
• Capacitive touch entry apparatus having high degree of personal safety (191 citations)

What are the main themes of his work throughout his whole career to date?

His primary scientific interests are in Optoelectronics, Electrical engineering, Electronic engineering, Composite material and Layer. His work on Integrated circuit is typically connected to High density as part of general Optoelectronics study, connecting several disciplines of science. His studies deal with areas such as Adhesive and Chip as well as Integrated circuit.

Charles W. Eichelberger interconnects Computer hardware, Interfacing, Relay and Waveform, Signal in the investigation of issues within Electronic engineering. His Composite material research includes elements of Metal and Dielectric. The various areas that Charles W. Eichelberger examines in his Layer study include Polymer dielectric and Laser.

He most often published in these fields:

• Optoelectronics (27.89%)
• Electrical engineering (27.89%)
• Electronic engineering (26.53%)

What were the highlights of his more recent work (between 1988-1997)?

• Optoelectronics (27.89%)
• Layer (21.77%)
• Composite material (25.85%)

In recent papers he was focusing on the following fields of study:

Charles W. Eichelberger mostly deals with Optoelectronics, Layer, Composite material, Substrate and High density. Charles W. Eichelberger has researched Optoelectronics in several fields, including Electronic engineering, Nanotechnology and Chip, Electrical engineering. His study explores the link between Chip and topics such as Wafer-scale integration that cross with problems in Integrated circuit packaging, Electronic circuit and Mixed-signal integrated circuit.

Charles W. Eichelberger has included themes like Electrical conductor, Polymer dielectric, Polymer and Laser in his Layer study. Composite material and Dielectric are frequently intertwined in his study. His Substrate research is multidisciplinary, incorporating elements of Structural engineering, Metal and Dielectric layer.

Between 1988 and 1997, his most popular works were:

• Compact high density interconnect structure (281 citations)
• Laser beam scanning method for forming via holes in polymer materials (158 citations)
• Flexible high density interconnect structure and flexibly interconnected system (136 citations)

In his most recent research, the most cited papers focused on:

• Electrical engineering
• Integrated circuit
• Electronics

The scientist’s investigation covers issues in Optoelectronics, High density, Electronic engineering, Dielectric and Chip. His research in Optoelectronics intersects with topics in Layer, Electrical engineering, Polymer and Output impedance. Charles W. Eichelberger integrates High density with Substrate in his research.

He interconnects Impedance bridging, Quarter-wave impedance transformer, Damping factor, High impedance and Monolithic microwave integrated circuit in the investigation of issues within Electronic engineering. As a part of the same scientific study, Charles W. Eichelberger usually deals with the Dielectric, concentrating on Composite material and frequently concerns with Fault. His Chip study deals with Wafer-scale integration intersecting with Integrated circuit and Integrated circuit packaging.