World's Best Scientists 2026 revealed!

D-Index & Metrics

Materials Science

D-Index
46
Citations
9678
World Ranking
11352
National Ranking
2664

Joy Cheng publication distribution in Materials Science in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Materials Science in 2026. The highlighted bar marks where Joy Cheng sits on this spectrum.

50–69 publications: 28 scientists 70–89 publications: 152 scientists 90–109 publications: 356 scientists 110–129 publications: 487 scientists 130–149 publications: 723 scientists 150–169 publications: 835 scientists 170–189 publications: 850 scientists 190–209 publications: 891 scientists 210–229 publications: 862 scientists 230–249 publications: 766 scientists 250–269 publications: 726 scientists 270–289 publications: 665 scientists 290–309 publications: 593 scientists 310–329 publications: 537 scientists 330–349 publications: 477 scientists 350–369 publications: 440 scientists 370–389 publications: 356 scientists 390–409 publications: 321 scientists 410–429 publications: 256 scientists 430–449 publications: 246 scientists 450–469 publications: 216 scientists 470–489 publications: 212 scientists 490–509 publications: 174 scientists 510–529 publications: 194 scientists 530–549 publications: 162 scientists 550–569 publications: 131 scientists 570–589 publications: 111 scientists 590–609 publications: 103 scientists 610–629 publications: 99 scientists 630–649 publications: 77 scientists 650–669 publications: 92 scientists 670–689 publications: 56 scientists 690–709 publications: 53 scientists 710–729 publications: 53 scientists 730–749 publications: 38 scientists 750–769 publications: 52 scientists 770–789 publications: 43 scientists 790–809 publications: 38 scientists 810–829 publications: 34 scientists 830–849 publications: 25 scientists 850–869 publications: 18 scientists 870–889 publications: 20 scientists 890–909 publications: 24 scientists 910–929 publications: 27 scientists 930–949 publications: 20 scientists 950–969 publications: 17 scientists 970–989 publications: 10 scientists 990–1,009 publications: 16 scientists 1,010–1,029 publications: 13 scientists 1,030–1,049 publications: 12 scientists 1,050–1,069 publications: 9 scientists 1,070–1,089 publications: 8 scientists 1,090–1,109 publications: 7 scientists 1,110–1,129 publications: 9 scientists 1,130–1,149 publications: 2 scientists 1,150–1,162 publications: 5 scientists 1,163+ publications: 100 scientists
50 publications 1,163+

This scientist: 137 publications — 10th percentile

10% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,163 publications or more.

Joy Cheng D-index placement in Materials Science in 2026

The chart shows the D-index (discipline H-index) distribution of Materials Science scientists ranked by Research.com in 2026. The highlighted bar marks where Joy Cheng sits on this spectrum.

40–41 D-Index: 211 scientists 42–43 D-Index: 450 scientists 44–45 D-Index: 612 scientists 46–47 D-Index: 612 scientists 48–49 D-Index: 598 scientists 50–51 D-Index: 657 scientists 52–53 D-Index: 667 scientists 54–55 D-Index: 621 scientists 56–57 D-Index: 597 scientists 58–59 D-Index: 610 scientists 60–61 D-Index: 587 scientists 62–63 D-Index: 606 scientists 64–65 D-Index: 533 scientists 66–67 D-Index: 490 scientists 68–69 D-Index: 469 scientists 70–71 D-Index: 378 scientists 72–73 D-Index: 421 scientists 74–75 D-Index: 359 scientists 76–77 D-Index: 323 scientists 78–79 D-Index: 299 scientists 80–81 D-Index: 230 scientists 82–83 D-Index: 210 scientists 84–85 D-Index: 195 scientists 86–87 D-Index: 203 scientists 88–89 D-Index: 175 scientists 90–91 D-Index: 175 scientists 92–93 D-Index: 142 scientists 94–95 D-Index: 121 scientists 96–97 D-Index: 117 scientists 98–99 D-Index: 107 scientists 100–101 D-Index: 88 scientists 102–103 D-Index: 85 scientists 104–105 D-Index: 68 scientists 106–107 D-Index: 62 scientists 108–109 D-Index: 57 scientists 110–111 D-Index: 45 scientists 112–113 D-Index: 49 scientists 114–115 D-Index: 50 scientists 116–117 D-Index: 34 scientists 118–119 D-Index: 38 scientists 120–121 D-Index: 37 scientists 122–123 D-Index: 29 scientists 124–125 D-Index: 28 scientists 126–127 D-Index: 24 scientists 128–129 D-Index: 33 scientists 130–131 D-Index: 28 scientists 132–133 D-Index: 21 scientists 134–135 D-Index: 20 scientists 136–137 D-Index: 23 scientists 138–139 D-Index: 17 scientists 140–141 D-Index: 12 scientists 142–143 D-Index: 17 scientists 144–145 D-Index: 21 scientists 146–147 D-Index: 13 scientists 148–149 D-Index: 11 scientists 150–151 D-Index: 14 scientists 152–153 D-Index: 13 scientists 154–155 D-Index: 9 scientists 156–157 D-Index: 10 scientists 158–159 D-Index: 7 scientists 160–161 D-Index: 4 scientists 162–163 D-Index: 4 scientists 164 D-Index: 3 scientists 165+ D-Index: 98 scientists
40 D-Index 165+

This scientist: 46 D-Index — 12th percentile

12% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 165 D-Index or more.

Overview

Joy Cheng is affiliated with IBM in the United States and specializes in the field of Materials Science. Their research encompasses several interdisciplinary subfields, including Materials Chemistry, Computational Theory and Mathematics, Molecular Biology, and Organic Chemistry.

Their scholarly output includes work published in highly recognized venues such as ACS Applied Polymer Materials and ACS Applied Materials & Interfaces. Two notable papers authored by Cheng include:

  • Essential Step Toward Mining Big Polymer Data: PolyName2Structure, Mapping Polymer Names to Structures (2020, ACS Applied Polymer Materials)
  • Spatial Control of the Self-assembled Block Copolymer Domain Orientation and Alignment on Photopatterned Surfaces (2020, ACS Applied Materials & Interfaces)

Joy Cheng's research interests cover a variety of advanced topics, such as:

  • Machine Learning in Materials Science
  • Computational Drug Discovery Methods
  • Biomedical Text Mining and Ontologies
  • Block Copolymer Self-Assembly
  • Advanced Polymer Synthesis and Characterization

Throughout their career, Cheng has frequently collaborated with several co-authors, including:

  • Daniel P. Sanders
  • Chieh Lin
  • Peihua Wang
  • Yi Hsiao
  • Yi-Tsu Chan

This collaboration network highlights an engagement with peers active in related domains, contributing to joint studies and publications. The work has predominantly concentrated on computational and experimental methods to better understand polymer materials and their behavior at molecular and larger structural scales.

Best Publications

  • Nanostructure engineering by templated self-assembly of block copolymers.

    Joy Y. Cheng;Anne M. Mayes;Caroline A. Ross

  • Templated Self‐Assembly of Block Copolymers: Top‐Down Helps Bottom‐Up

    Joy Y. Cheng;Joy Y. Cheng;Caroline A. Ross;Henry I. Smith;Edwin L. Thomas

  • Formation of a Cobalt Magnetic Dot Array via Block Copolymer Lithography

    J.Y. Cheng;C.A. Ross;V.Z.H. Chan;E.L. Thomas

  • Polymer self assembly in semiconductor microelectronics

    C. T. Black;R. Ruiz;Gregory Breyta;J. Y. Cheng

  • Fabrication of nanostructures with long-range order using block copolymer lithography

    J. Y. Cheng;C. A. Ross;E. L. Thomas;Henry I. Smith

  • Dense Self-Assembly on Sparse Chemical Patterns : Rectifying and Multiplying Lithographic Patterns Using Block Copolymers

    Joy Y. Cheng;Charles T. Rettner;Daniel P. Sanders;Ho-Cheol Kim

  • Templated Self-Assembly of Block Copolymers: Effect of Substrate Topography†

    Joy Y. Cheng;C.A. Ross;Edwin L. Thomas;Henry I. Smith

  • Micromagnetic behavior of electrodeposited cylinder arrays

    C. A. Ross;M. Hwang;M. Shima;J. Y. Cheng

  • Simple and Versatile Methods To Integrate Directed Self-Assembly with Optical Lithography Using a Polarity-Switched Photoresist

    Joy Y. Cheng;Daniel P. Sanders;Hoa D. Truong;Stefan Harrer

  • Methods of directed self-assembly and layered structures formed therefrom

    Daniel Paul Sanders;Joy Cheng;William Hinsberg;Ho-Cheol Kim

  • A 16nm FinFET CMOS technology for mobile SoC and computing applications

    Shien-Yang Wu;C. Y. Lin;M. C. Chiang;J. J. Liaw

  • Three-dimensional nanofabrication by block copolymer self-assembly.

    Caroline A. Ross;Karl K. Berggren;Joy Y. Cheng;Yeon Sik Jung

  • Magnetic behavior of lithographically patterned particle arrays (invited)

    C. A. Ross;S. Haratani;F. J. Castaño;Y. Hao

  • Two-Dimensional Pattern Formation Using Graphoepitaxy of PS-b-PMMA Block Copolymers for Advanced FinFET Device and Circuit Fabrication

    Hsinyu Tsai;Jed W. Pitera;Hiroyuki Miyazoe;Sarunya Bangsaruntip

  • A 7nm CMOS platform technology featuring 4 th generation FinFET transistors with a 0.027um 2 high density 6-T SRAM cell for mobile SoC applications

    Shien-Yang Wu;C.Y. Lin;M.C. Chiang;J.J. Liaw

  • Self-assembly patterning for sub-15nm half-pitch: a transition from lab to fab

    Chris Bencher;Jeffrey Smith;Liyan Miao;Cathy Cai

  • Method of forming sub-lithographic structure utilizing polymer directional self-organization

    Joy Cheng;Yang Da;P Sanders Daniel;Lai Kafai

  • Method of forming polymer features by directed self-assembly of block copolymers

    Joy Cheng;William D. Hinsberg;Ho-cheol Kim;Charles T. Rettner

  • Self-assembled one-dimensional nanostructure arrays.

    Joy Y. Cheng;Feng Zhang;Vivian P. Chuang;and Anne M. Mayes

  • Facile postpolymerization end‐modification of RAFT polymers

    Jason M. Spruell;Benjamin A. Levy;Alexander Sutherland;William R. Dichtel

  • Polymer self assembly in semiconductor microelectronics

    C.T. Black;K.W. Guarini;R. Ruiz;E.M. Sikorski

Frequent Co-Authors

Charles T. Rettner
Charles T. Rettner IBM (United States)
Michael A. Guillorn
Michael A. Guillorn IBM (United States)
Ho-Cheol Kim
Ho-Cheol Kim IBM (United States)
Matthew E. Colburn
Matthew E. Colburn Facebook (United States)
Steven J. Holmes
Steven J. Holmes IBM (United States)
Alshakim Nelson
Alshakim Nelson University of Washington
Edwin L. Thomas
Edwin L. Thomas Texas A&M University
Jhon-Jhy Liaw
Jhon-Jhy Liaw Taiwan Semiconductor Manufacturing Company (Taiwan)

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