World's Best Scientists 2026 revealed!

D-Index & Metrics

Computer Science

D-Index
49
Citations
8006
World Ranking
5964
National Ranking
47

Electronics and Electrical Engineering

D-Index
47
Citations
7833
World Ranking
3262
National Ranking
46

Research.com Recognitions

  • 2004 - IEEE Fellow For contributions to design and test of array structures.

Overview

Cheng-Wen Wu is affiliated with National Tsing Hua University in Taiwan and works primarily in the field of Engineering. Their research spans multiple subfields including Electrical and Electronic Engineering, Molecular Biology, Electronic, Optical and Magnetic Materials, Materials Chemistry, and Biomedical Engineering.

The scientist's research focuses on topics such as:

  • Electromagnetic wave absorption materials
  • Advanced Memory and Neural Computing
  • Ferroelectric and Negative Capacitance Devices
  • Advanced Antenna and Metasurface Technologies
  • Metamaterials and Metasurfaces Applications
  • 3D IC and TSV technologies
  • VLSI and Analog Circuit Testing

Recent publications authored or co-authored by Cheng-Wen Wu include:

  • "Multifunctional SiC aerogel reinforced with nanofibers and nanowires for high-efficiency electromagnetic wave absorption" (2023, Chemical Engineering Journal)
  • "Sr(Cr0.2Mn0.2Fe0.2Co0.2Ni0.2)O3: A novel high-entropy perovskite oxide with enhanced electromagnetic wave absorption properties" (2023, Journal of Materiomics)
  • "From binary to ternary and back to binary: Transition of electromagnetic wave shielding to absorption among MAB phase Ni3ZnB2 and corresponding binary borides Nin+1Bn (n = 1, 3)" (2023, Journal of Advanced Ceramics)
  • "Enhancing Fan Engagement in a 5G Stadium With AI-Based Technologies and Live Streaming" (2022, IEEE Systems Journal)
  • "Fe2AlB2: A novel ferromagnetic material with superior electromagnetic wave absorption performance" (2023, Ceramics International)

Cheng-Wen Wu has frequently published in venues such as Biochimica et Biophysica Acta (BBA) - Molecular Cell Research, Chemical Engineering Journal, Journal of Materiomics, Journal of Advanced Ceramics, and Ceramics International.

Frequent collaborators of the scientist include Rui Zhang, Bingbing Fan, Qing Hui Zhi, Yongqiang Chen, and Hailong Wang.

Cheng-Wen Wu was recognized as an IEEE Fellow in 2004 for contributions to the design and test of array structures.

Best Publications

  • VLSI Test Principles and Architectures: Design for Testability

    Laung-Terng Wang;Cheng-Wen Wu;Xiaoqing Wen

  • RRAM Defect Modeling and Failure Analysis Based on March Test and a Novel Squeeze-Search Scheme

    Ching Yi Chen;Hsiu Chuan Shih;Cheng Wen Wu;Chih He Lin

  • Built-in redundancy analysis for memory yield improvement

    Chih-Tsun Huang;Chi-Feng Wu;Jin-Fu Li;Cheng-Wen Wu

  • On-Chip TSV Testing for 3D IC before Bonding Using Sense Amplification

    Po-Yuan Chen;Cheng-Wen Wu;Ding-Ming Kwai

  • VLSI Test Principles and Architectures: Design for Testability (Systems on Silicon)

    Laung-Terng Wang;Cheng-Wen Wu;Xiaoqing Wen

  • A programmable BIST core for embedded DRAM

    Chih-Tsun Huang;Jing-Reng Huang;Chi-Feng Wu;Cheng-Wen Wu

  • On-chip testing of blind and open-sleeve TSVs for 3D IC before bonding

    Po-Yuan Chen;Cheng-Wen Wu;Ding-Ming Kwai

  • Efficient built-in redundancy analysis for embedded memories with 2-D redundancy

    Shyue-Kung Lu;Yu-Chen Tsai;C.-H. Hsu;Kuo-Hua Wang

  • A high-throughput low-cost AES processor

    Chih-Pin Su;Tsung-Fu Lin;Chih-Tsiun Huang;Cheng-Wen Wu

  • A built-in self-repair design for RAMs with 2-D redundancy

    Jin-Fu Li;J.-C. Yeh;Rei-Fu Huang;Cheng-Wen Wu

  • IEEE Std. 1149.1 boundary scan circuit capable of built-in self-testing

    Ching-Hong Tsai;Fang-Diahn Guo;Jin-Hua Hong;Cheng-Wen Wu

  • RAMSES: a fast memory fault simulator

    Chi-Feng Wu;Chih-Tsun Huang;Cheng-Wen Wu

  • Single- and Multi-core Configurable AES Architectures for Flexible Security

    Mao-Yin Wang;Chih-Pin Su;Chia-Lung Horng;Cheng-Wen Wu

  • An Adaptive-Rate Error Correction Scheme for NAND Flash Memory

    Te-Hsuan Chen;Yu-Ying Hsiao;Yu-Tsao Hsing;Cheng-Wen Wu

  • An integrated ECC and redundancy repair scheme for memory reliability enhancement

    Chin-Lung Su;Yi-Ting Yeh;Cheng-Wen Wu

  • A built-in self-test scheme for the post-bond test of TSVs in 3D ICs

    Yu-Jen Huang;Jin-Fu Li;Ji-Jan Chen;Ding-Ming Kwai

  • Sequential circuit fault simulation using logic emulation

    Shih-Arn Hwang;Jin-Hua Hong;Cheng-Wen Wu

  • March-based RAM diagnosis algorithms for stuck-at and coupling faults

    Jin-Fu Li;Kuo-Liang Cheng;Chih-Tsun Huang;Cheng-Wen Wu

  • RSA cryptosystem design based on the Chinese remainder theorem

    Chung-Hsien Wu;Jin-Hua Hong;Cheng-Wen Wu

  • A built-in self-repair scheme for semiconductor memories with 2-d redundancy

    Jin-Fu Li;Jen-Chieh Yeh;Rei-Fu Huang;Cheng-Wen Wu

Frequent Co-Authors

Kwang-Ting Cheng
Kwang-Ting Cheng Hong Kong University of Science and Technology
Sy-Yen Kuo
Sy-Yen Kuo National Taiwan University
Xiaoqing Wen
Xiaoqing Wen Kyushu Institute of Technology
Frederick T. Chen
Frederick T. Chen ITRI International
Kees Goossens
Kees Goossens Eindhoven University of Technology
Jacob A. Abraham
Jacob A. Abraham The University of Texas at Austin

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