World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
47
Citations
7833
World Ranking
3262
National Ranking
46

Computer Science

D-Index
49
Citations
8006
World Ranking
5965
National Ranking
47

Cheng-Wen Wu publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Cheng-Wen Wu sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 356 publications — 68th percentile

68% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Cheng-Wen Wu D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Cheng-Wen Wu sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 47 D-Index — 54th percentile

54% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Research.com Recognitions

  • 2004 - IEEE Fellow For contributions to design and test of array structures.

Overview

Cheng-Wen Wu is affiliated with National Tsing Hua University in Taiwan and works primarily in the field of Engineering. Their research spans multiple subfields including Electrical and Electronic Engineering, Molecular Biology, Electronic, Optical and Magnetic Materials, Materials Chemistry, and Biomedical Engineering.

The scientist's research focuses on topics such as:

  • Electromagnetic wave absorption materials
  • Advanced Memory and Neural Computing
  • Ferroelectric and Negative Capacitance Devices
  • Advanced Antenna and Metasurface Technologies
  • Metamaterials and Metasurfaces Applications
  • 3D IC and TSV technologies
  • VLSI and Analog Circuit Testing

Recent publications authored or co-authored by Cheng-Wen Wu include:

  • "Multifunctional SiC aerogel reinforced with nanofibers and nanowires for high-efficiency electromagnetic wave absorption" (2023, Chemical Engineering Journal)
  • "Sr(Cr0.2Mn0.2Fe0.2Co0.2Ni0.2)O3: A novel high-entropy perovskite oxide with enhanced electromagnetic wave absorption properties" (2023, Journal of Materiomics)
  • "From binary to ternary and back to binary: Transition of electromagnetic wave shielding to absorption among MAB phase Ni3ZnB2 and corresponding binary borides Nin+1Bn (n = 1, 3)" (2023, Journal of Advanced Ceramics)
  • "Enhancing Fan Engagement in a 5G Stadium With AI-Based Technologies and Live Streaming" (2022, IEEE Systems Journal)
  • "Fe2AlB2: A novel ferromagnetic material with superior electromagnetic wave absorption performance" (2023, Ceramics International)

Cheng-Wen Wu has frequently published in venues such as Biochimica et Biophysica Acta (BBA) - Molecular Cell Research, Chemical Engineering Journal, Journal of Materiomics, Journal of Advanced Ceramics, and Ceramics International.

Frequent collaborators of the scientist include Rui Zhang, Bingbing Fan, Qing Hui Zhi, Yongqiang Chen, and Hailong Wang.

Cheng-Wen Wu was recognized as an IEEE Fellow in 2004 for contributions to the design and test of array structures.

Best Publications

  • VLSI Test Principles and Architectures: Design for Testability

    Laung-Terng Wang;Cheng-Wen Wu;Xiaoqing Wen

  • RRAM Defect Modeling and Failure Analysis Based on March Test and a Novel Squeeze-Search Scheme

    Ching Yi Chen;Hsiu Chuan Shih;Cheng Wen Wu;Chih He Lin

  • Built-in redundancy analysis for memory yield improvement

    Chih-Tsun Huang;Chi-Feng Wu;Jin-Fu Li;Cheng-Wen Wu

  • On-Chip TSV Testing for 3D IC before Bonding Using Sense Amplification

    Po-Yuan Chen;Cheng-Wen Wu;Ding-Ming Kwai

  • VLSI Test Principles and Architectures: Design for Testability (Systems on Silicon)

    Laung-Terng Wang;Cheng-Wen Wu;Xiaoqing Wen

  • A programmable BIST core for embedded DRAM

    Chih-Tsun Huang;Jing-Reng Huang;Chi-Feng Wu;Cheng-Wen Wu

  • On-chip testing of blind and open-sleeve TSVs for 3D IC before bonding

    Po-Yuan Chen;Cheng-Wen Wu;Ding-Ming Kwai

  • Efficient built-in redundancy analysis for embedded memories with 2-D redundancy

    Shyue-Kung Lu;Yu-Chen Tsai;C.-H. Hsu;Kuo-Hua Wang

  • A high-throughput low-cost AES processor

    Chih-Pin Su;Tsung-Fu Lin;Chih-Tsiun Huang;Cheng-Wen Wu

  • A built-in self-repair design for RAMs with 2-D redundancy

    Jin-Fu Li;J.-C. Yeh;Rei-Fu Huang;Cheng-Wen Wu

  • IEEE Std. 1149.1 boundary scan circuit capable of built-in self-testing

    Ching-Hong Tsai;Fang-Diahn Guo;Jin-Hua Hong;Cheng-Wen Wu

  • RAMSES: a fast memory fault simulator

    Chi-Feng Wu;Chih-Tsun Huang;Cheng-Wen Wu

  • Single- and Multi-core Configurable AES Architectures for Flexible Security

    Mao-Yin Wang;Chih-Pin Su;Chia-Lung Horng;Cheng-Wen Wu

  • An Adaptive-Rate Error Correction Scheme for NAND Flash Memory

    Te-Hsuan Chen;Yu-Ying Hsiao;Yu-Tsao Hsing;Cheng-Wen Wu

  • An integrated ECC and redundancy repair scheme for memory reliability enhancement

    Chin-Lung Su;Yi-Ting Yeh;Cheng-Wen Wu

  • A built-in self-test scheme for the post-bond test of TSVs in 3D ICs

    Yu-Jen Huang;Jin-Fu Li;Ji-Jan Chen;Ding-Ming Kwai

  • Sequential circuit fault simulation using logic emulation

    Shih-Arn Hwang;Jin-Hua Hong;Cheng-Wen Wu

  • March-based RAM diagnosis algorithms for stuck-at and coupling faults

    Jin-Fu Li;Kuo-Liang Cheng;Chih-Tsun Huang;Cheng-Wen Wu

  • RSA cryptosystem design based on the Chinese remainder theorem

    Chung-Hsien Wu;Jin-Hua Hong;Cheng-Wen Wu

  • A built-in self-repair scheme for semiconductor memories with 2-d redundancy

    Jin-Fu Li;Jen-Chieh Yeh;Rei-Fu Huang;Cheng-Wen Wu

Frequent Co-Authors

Kwang-Ting Cheng
Kwang-Ting Cheng Hong Kong University of Science and Technology
Sy-Yen Kuo
Sy-Yen Kuo National Taiwan University
Xiaoqing Wen
Xiaoqing Wen Kyushu Institute of Technology
Frederick T. Chen
Frederick T. Chen ITRI International
Kees Goossens
Kees Goossens Eindhoven University of Technology
Jacob A. Abraham
Jacob A. Abraham The University of Texas at Austin

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