Rafael Reif

Rafael Reif publication distribution in Engineering and Technology in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Engineering and Technology in 2026. The highlighted bar marks where Rafael Reif sits on this spectrum.

Rafael Reif D-index placement in Engineering and Technology in 2026

The chart shows the D-index (discipline H-index) distribution of Engineering and Technology scientists ranked by Research.com in 2026. The highlighted bar marks where Rafael Reif sits on this spectrum.

Research.com Recognitions

• 1993 - IEEE Fellow For pioneering work in the low-temperature epitaxial growth of semiconductor thin films.

Overview

Best Publications

• Interconnect limits on gigascale integration (GSI) in the 21st century

  J.A. Davis;R. Venkatesan;A. Kaloyeros;M. Beylansky

  865
  Citations

• Copper Wafer Bonding

  A. Fan;A. Rahman;R. Reif

  320
  Citations

• Recrystallization of amorphized polycrystalline silicon films on SiO2: Temperature dependence of the crystallization parameters

  Unknown

  313
  Citations

• System-level performance evaluation of three-dimensional integrated circuits

  A. Rahman;R. Reif

  261
  Citations

• Wiring requirement and three-dimensional integration technology for field programmable gate arrays

  A. Rahman;S. Das;A.P. Chandrakasan;R. Reif

  249
  Citations

• Polycrystalline silicon thin films processed with silicon ion implantation and subsequent solid-phase crystallization: Theory, experiments, and thin-film transistor applications

  Noriyoshi Yamauchi;Rafael Reif

  233
  Citations

• Technology, performance, and computer-aided design of three-dimensional integrated circuits

  Shamik Das;Andy Fan;Kuan-Neng Chen;Chuan Seng Tan

  211
  Citations

• Morphology and Bond Strength of Copper Wafer Bonding

  Kuan-Neng Chen;C. S. Tan;A. Fan;R. Reif

  204
  Citations

• Polysilicon thin-film transistors with channel length and width comparable to or smaller than the grain size of the thin film

  N. Yamauchi;J.-J.J. Hajjar;R. Reif

  178
  Citations

• Fabrication technologies for three-dimensional integrated circuits

  R. Reif;A. Fan;Kuan-Neng Chen;S. Das

  176
  Citations

• Design tools for 3-D integrated circuits

  Shamik Das;Anantha Chandrakasan;Rafael Reif

  163
  Citations

• Measurements of the bulk, C-axis electromechanical coupling constant as a function of AlN film quality

  R.S. Naik;J.J. Lutsky;R. Reif;C.G. Sodini

  146
  Citations

• Silicon epitaxy at 650–800 °C using low‐pressure chemical vapor deposition both with and without plasma enhancement

  Unknown

  125
  Citations

• Silicon surface cleaning by low dose argon‐ion bombardment for low‐temperature (750 °C) epitaxial silicon deposition. I. Process considerations

  James H. Comfort;Linda M. Garverick;Rafael Reif

  123
  Citations

• Electromechanical coupling constant extraction of thin-film piezoelectric materials using a bulk acoustic wave resonator

  R.S. Naik;J.J. Lutsky;R. Reif;C.G. Sodini

  120
  Citations

• Air‐bridge microcavities

  Pierre R. Villeneuve;Shanhui Fan;J. D. Joannopoulos;Kuo‐Yi Lim

  119
  Citations

• Chemical Vapor Deposition of Epitaxial Silicon from Silane at Low Temperatures I . Very Low Pressure Deposition

  James H. Comfort;Rafael Reif

  116
  Citations

• Three-dimensional integrated circuits: performance, design methodology, and CAD tools

  S. Das;A. Chandrakasan;R. Reif

  115
  Citations

• Low‐Temperature Deposition of Highly Textured Aluminum Nitride by Direct Current Magnetron Sputtering for Applications in Thin‐Film Resonators

  R. S. Naik;R. Reif;J. J. Lutsky;C. G. Sodini

  107
  Citations

• Temperature dependence of Si1−xGex epitaxial growth using very low pressure chemical vapor deposition

  Syun‐Ming Jang;Rafael Reif

  104
  Citations

• Microstructure examination of copper wafer bonding

  Kuan-Neng Chen;Andy Fan;Rafael Reif

  103
  Citations

• Bonding parameters of blanket copper wafer bonding

  Kuan-Neng Chen;A. Fan;C. S. Tan;R. Reif

  97
  Citations

• Silicon Multilayer Stacking Based on Copper Wafer Bonding

  C. S. Tan;R. Reif

  91
  Citations

• Plasma-Enhanced Chemical Vapor Deposition

  Prabha K. Tedrow;Rafael Reif

  90
  Citations