The chart shows the distribution of publications by all Research.com ranked scientists in the field of Materials Science in 2026. The highlighted bar marks where Mark C. Hersam sits on this spectrum.
This scientist: 889 publications — 98th percentile
98% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 1,163 publications or more.
The chart shows the D-index (discipline H-index) distribution of Materials Science scientists ranked by Research.com in 2026. The highlighted bar marks where Mark C. Hersam sits on this spectrum.
This scientist: 132 D-Index — 98th percentile
98% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 165 D-Index or more.
Mark C. Hersam is affiliated with Northwestern University in the United States and has contributed extensively to the fields of engineering and materials science. Their research spans multiple subfields, including materials chemistry, electrical and electronic engineering, biomedical engineering, atomic and molecular physics and optics, as well as electronic, optical, and magnetic materials.
The scientist's work addresses a range of topics, with a significant focus on 2D materials and applications, graphene research and applications, advanced memory and neural computing, advancements in battery materials, perovskite materials and applications, advanced battery materials and technologies, and ferroelectric and negative capacitance devices.
Several recent publications highlight the scope of their research:
Frequent co-authors of Mark C. Hersam include Vinod K. Sangwan, Tobin J. Marks, Michael J. Bedzyk, Vinayak P. Dravid, and Julia R. Downing. These collaborations have contributed to an extensive body of work published in notable venues.
Among the common publication venues are ACS Nano, ACS Applied Materials & Interfaces, Advanced Materials, arXiv (Cornell University), and ECS Meeting Abstracts.
Mark C. Hersam has been recognized by several professional organizations through fellowships. These include the National Academy of Inventors (2017), IEEE (2016) for contributions to carbon nanomaterial processing methods and devices, the American Association for the Advancement of Science (AAAS) (2014), the MacArthur Foundation (2014), the Materials Research Society (2012), the American Physical Society (APS) (2012) for pioneering research on nanoelectronic materials, SPIE (2012), and the Alfred P. Sloan Foundation (2005).
Michael S. Arnold;Alexander A. Green;James F. Hulvat;Samuel I. Stupp
Deep Jariwala;Vinod K. Sangwan;Lincoln J. Lauhon;Tobin J. Marks
Andrew J. Mannix;Andrew J. Mannix;Xiang Feng Zhou;Xiang Feng Zhou;Brian Kiraly;Brian Kiraly;Joshua D. Wood
Joshua D. Wood;Spencer A. Wells;Deep Jariwala;Kan Sheng Chen
Deep Jariwala;Tobin J. Marks;Mark C. Hersam
Deep Jariwala;Vinod K. Sangwan;Lincoln J. Lauhon;Tobin J. Marks
Beatriz Pelaz;Christoph Alexiou;Ramon A. Alvarez-Puebla;Frauke Alves;Frauke Alves
Mark C. Hersam
Vinod K. Sangwan;Hong Sub Lee;Hadallia Bergeron;Itamar Balla
Alexander A. Green;Mark C. Hersam
Andrew J. Mannix;Andrew J. Mannix;Brian Kiraly;Brian Kiraly;Mark C. Hersam;Nathan P. Guisinger
Christopher R. Ryder;Joshua D. Wood;Spencer A. Wells;Yang Yang
Vinod K. Sangwan;Mark C. Hersam
Philip G. Collins;M. Hersam;M. Arnold;R. Martel
Ethan B. Secor;Pradyumna L. Prabhumirashi;Kanan Puntambekar;Michael L. Geier
Joohoon Kang;Joshua D. Wood;Spencer A. Wells;Jae Hyeok Lee
Shumao Cui;Haihui Pu;Spencer A. Wells;Zhenhai Wen
Vinod K. Sangwan;Deep Jariwala;In Soo Kim;Kan Sheng Chen
Adam E. Jakus;Ethan B. Secor;Alexandra L. Rutz;Sumanas W. Jordan
Deep Jariwala;Vinod K. Sangwan;Lincoln J. Lauhon;Tobin J. Marks
Michael S. Arnold;Samuel I. Stupp;Mark C. Hersam
Yu Teng Liang;Baiju K. Vijayan;Kimberly A. Gray;Mark C. Hersam
Indranil Chowdhury;Matthew C. Duch;Nikhita D. Mansukhani;Mark C. Hersam
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