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D-Index & Metrics

Mechanical and Aerospace Engineering

D-Index
61
Citations
14362
World Ranking
643
National Ranking
282

Materials Science

D-Index
61
Citations
14268
World Ranking
6741
National Ranking
1699

Overview

M. D. Thouless is affiliated with the University of Michigan-Ann Arbor in the United States. Their work primarily spans the field of engineering, with a significant focus on electrical and electronic engineering, mechanics of materials, materials chemistry, molecular biology, and automotive engineering.

The main topics of their research include advanced battery materials and technologies, advancements in battery materials, advanced battery technologies research, numerical methods in engineering, fatigue and fracture mechanics, cryospheric studies and observations, and landslides and related hazards.

Among their recent research contributions are the following papers:

  • Understanding the electro-chemo-mechanics of Li plating in anode-free solid-state batteries with operando 3D microscopy (2022, Matter)
  • Roughness of Ice Shelves Is Correlated With Basal Melt Rates (2021, Geophysical Research Letters)
  • Mixed-mode cohesive laws and the use of linear-elastic fracture mechanics (2021, Engineering Fracture Mechanics)
  • The use of visco-elastic materials for the design of helmets and packaging (2020, Journal of the Mechanics and Physics of Solids)
  • Effect of Surface Roughness on Adhesive Instabilities for the Elastic Layer (2020, Frontiers in Mechanical Engineering)

The frequent co-authors collaborating with M. D. Thouless include:

  • Neil P. Dasgupta
  • Shuichi Takayama
  • Mengyao Zhang
  • William S. LePage
  • Ali Madanchi

Important venues where Thouless has published multiple works include:

  • Journal of the Mechanics and Physics of Solids
  • ACS Applied Materials & Interfaces
  • ECS Meeting Abstracts
  • Matter
  • Geophysical Research Letters

Best Publications

  • Dispersions of Aramid Nanofibers: A New Nanoscale Building Block

    Ming Yang;Keqin Cao;Lang Sui;Ying Qi

  • Effects of pull-out on the mechanical properties of ceramic-matrix composites

    M.D. Thouless;A.G. Evans

  • Low-interfacial toughness materials for effective large-scale deicing.

    Kevin Golovin;Abhishek Dhyani;M. D. Thouless;Anish Tuteja

  • Mixed-mode fracture analyses of plastically-deforming adhesive joints

    Q. D. Yang;Michael D. Thouless

  • Tunable elastomeric nanochannels for nanofluidic manipulation

    Shuichi Takayama;Michael David Thouless;Dongeun Huh;Kristen L. Mills

  • Growth and configurational stability of circular, buckling-driven film delaminations

    J.W. Hutchinson;M.D. Thouless;E.G. Liniger

  • The edge cracking and spalling of brittle plates

    M.D. Thouless;A.G. Evans;M.F. Ashby;J.W. Hutchinson

  • Crack Deflection and Propagation in Layered Silicon Nitride/Boron Nitride Ceramics

    Desiderio Kovar;M. D. Thouless;John W. Halloran

  • Numerical simulations of adhesively-bonded beams failing with extensive plastic deformation

    Q.D. Yang;M.D. Thouless;S.M. Ward

  • The effects of geometry and material properties on the fracture of single lap-shear joints

    M.S. Kafkalidis;M.D. Thouless

  • Mixed-mode cohesive-zone models for fracture of an adhesively bonded polymer–matrix composite

    S. Li;M.D. Thouless;A.M. Waas;J.A. Schroeder

  • Lithium Mechanics: Roles of Strain Rate and Temperature and Implications for Lithium Metal Batteries

    William S. LePage;Yuxin Chen;Eric Kazyak;Kuan-Hung Chen

  • Use of a cohesive-zone model to analyze the fracture of a fiber-reinforced polymer-matrix composite

    S. Li;M.D. Thouless;A.M. Waas;J.A. Schroeder

  • Stress development and relaxation in copper films during thermal cycling

    M.D. Thouless;J. Gupta;J.M.E. Harper

  • The decohesion of thin films from brittle substrates

    M.S. Hu;M.D. Thouless;A.G. Evans

  • Use of mode-I cohesive-zone models to describe the fracture of an adhesively-bonded polymer-matrix composite

    S. Li;M.D. Thouless;A.M. Waas;J.A. Schroeder

  • Crack Spacing in Brittle Films on Elastic Substrates

    M. D. Thouless

  • On the decohesion of residually stressed thin films

    M.D Drory;M.D Thouless;A.G Evans

  • The effects of shear on delamination in layered materials

    S. Li;J. Wang;M.D. Thouless

  • The roles of toughness and cohesive strength on crack deflection at interfaces

    J.P. Parmigiani;M.D. Thouless

Frequent Co-Authors

Shuichi Takayama
Shuichi Takayama Georgia Institute of Technology
Anthony M. Waas
Anthony M. Waas Arizona State University
Anthony G. Evans
Anthony G. Evans University of California, Santa Barbara
Qingda Yang
Qingda Yang University of Miami
Pablo D. Zavattieri
Pablo D. Zavattieri Purdue University West Lafayette
Nicholas A. Kotov
Nicholas A. Kotov University of Michigan–Ann Arbor
John W. Hutchinson
John W. Hutchinson Harvard University
Gary S. Was
Gary S. Was University of Michigan–Ann Arbor
Neil P. Dasgupta
Neil P. Dasgupta University of Michigan–Ann Arbor
Albert F. Yee
Albert F. Yee University of California, Irvine

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