World's Best Scientists 2026 revealed!

D-Index & Metrics

Engineering and Technology

D-Index
33
Citations
5263
World Ranking
9376
National Ranking
594

Overview

Kevin S. Donnelly is affiliated with Rambus in the United Kingdom. Their research primarily focuses on engineering, with specific contributions to electrical and electronic engineering as well as automotive engineering.

The scientist's recent publication record includes a paper titled Cleaning and Particle Challenges in the Temporary Bonding and Debonding Process, published in 2024 in the IMAPSource Proceedings. This work reflects a continued engagement with technical challenges in manufacturing and electronic packaging processes.

Areas of research specialization encompass topics such as:

  • 3D IC and TSV technologies
  • Electronic Packaging and Soldering Technologies
  • Additive Manufacturing and 3D Printing Technologies

Kevin S. Donnelly has collaborated with several coauthors over multiple projects, including:

  • Joel A. Bahena
  • Hunter Jones
  • John Taddei
  • Phillip Tyler
  • Amit Kumar

The scientist's work has been published primarily in the IMAPSource Proceedings, which is currently the main venue for recorded contributions.

Best Publications

  • Memory controller that calibrates a transmit timing offset

    Jared LeVan Zerbe;Kevin S. Donnelly;Stefanos Sidiropoulos;Donald C. Stark

  • Multi-PAM Output Driver with Distortion Compensation

    Jared L. Zerbe;Bruno W. Garlepp;Pak S. Chau;Kevin S. Donnelly

  • Equalization and clock recovery for a 2.5-10-Gb/s 2-PAM/4-PAM backplane transceiver cell

    J. Zerbe;C. Werner;V. Stojanovic;F. Chen

  • A 2.5 V CMOS delay-locked loop for 18 Mbit, 500 megabyte/s DRAM

    T.H. Lee;K.S. Donnelly;J.T.C. Ho;J. Zerbe

  • A portable digital DLL for high-speed CMOS interface circuits

    B.W. Garlepp;K.S. Donnelly;Jun Kim;P.S. Chau

  • Chip having port to receive value that represents adjustment to output driver parameter

    Mark A. Horowitz;Craig E. Hampel;Alfredo Moncayo;Kevin S. Donnelly

  • High-speed signaling systems with adaptable pre-emphasis and equalization

    Jared L. Zerbe;Fred F. Chen;Andrew Ho;Ramin Farjad-Rad

  • Voltage controlled phase shifter with unlimited range

    Thomas H. Lee;Kevin S. Donnelly;Tsyr-Chyang Ho

  • A 0.4-4-Gb/s CMOS quad transceiver cell using on-chip regulated dual-loop PLLs

    K.-Y.K. Chang;J. Wei;C. Huang;S. Li

  • Chip-to-chip communication system using an ac-coupled bus and devices employed in same

    Donald V. Perino;Haw-Jyh Liaw;Alfredo Moncayo;Kevin Donnelly

  • Output driver circuit with well-controlled output impedance

    Bruno Werner Garlepp;Kevin S. Donnelly;Jared LeVan Zerbe

  • Transceiver with latency alignment circuitry

    Kevin Donnelly;Mark Johnson;Chanh Tran;John B. Dillon

  • Amplifier with active duty cycle correction

    Thomas H. Lee;Kevin S. Donnelly;Tsyr-Chyang Ho

  • Circuitry for the delay adjustment of a clock signal

    Kevin S. Donnelly;Jun Kim;Bruno W. Garleep;Mark A. Horowitz

  • Variable delay element

    Bruno Werner Garlepp;Pak Shing Chau;Kevin S. Donnelly;Clemenz Portmann

  • Differential comparator for amplifying small swing signals to a full swing output

    Thomas H. Lee;Kevin S. Donnelly

  • Equalization and clock recovery for a 2.5-10Gb/s 2-PAM/4-PAM backplane transceiver cell

    Unknown

  • Apparatus and method for generating a distributed clock signal

    Frederick A. Ware;Kevin S. Donnelly;Ely K. Tsern;Srinivas Nimmagadda

  • A 2 Gb/s/pin 4-PAM parallel bus interface with transmit crosstalk cancellation, equalization, and integrating receivers

    J.L. Zerbe;P.S. Chau;C.W. Werner;W.F. Stonecypher

  • 1.6 Gb/s/pin 4-PAM signaling and circuits for a multidrop bus

    J.L. Zerbe;P.S. Chau;C.W. Werner;T.P. Thrush

  • Bus driver circuit including a slew rate indicator circuit having a one shot circuit

    Kevin S. Donnelly;Chanh Tran;Michael Ching;Bruno Garlepp

  • A 0.4-4 Gb/s CMOS quad transceiver cell using on-chip regulated dual-loop PLLs

    K.-Y.K. Chang;J. Wei;S. Li;Y. Li

Frequent Co-Authors

Jared L. Zerbe
Jared L. Zerbe Apple (United States)
Mark Horowitz
Mark Horowitz Stanford University
Craig E. Hampel
Craig E. Hampel Rambus (United Kingdom)
Frederick A. Ware
Frederick A. Ware Rambus (United Kingdom)
Ely K. Tsern
Ely K. Tsern Rambus (United Kingdom)
Thomas H. Lee
Thomas H. Lee Stanford University
Vladimir Stojanovic
Vladimir Stojanovic University of California, Berkeley
John S. Ho
John S. Ho National University of Singapore

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