Kevin S. Donnelly is affiliated with Rambus in the United Kingdom. Their research primarily focuses on engineering, with specific contributions to electrical and electronic engineering as well as automotive engineering.
The scientist's recent publication record includes a paper titled Cleaning and Particle Challenges in the Temporary Bonding and Debonding Process, published in 2024 in the IMAPSource Proceedings. This work reflects a continued engagement with technical challenges in manufacturing and electronic packaging processes.
Areas of research specialization encompass topics such as:
Kevin S. Donnelly has collaborated with several coauthors over multiple projects, including:
The scientist's work has been published primarily in the IMAPSource Proceedings, which is currently the main venue for recorded contributions.
Jared LeVan Zerbe;Kevin S. Donnelly;Stefanos Sidiropoulos;Donald C. Stark
Jared L. Zerbe;Bruno W. Garlepp;Pak S. Chau;Kevin S. Donnelly
J. Zerbe;C. Werner;V. Stojanovic;F. Chen
T.H. Lee;K.S. Donnelly;J.T.C. Ho;J. Zerbe
B.W. Garlepp;K.S. Donnelly;Jun Kim;P.S. Chau
Mark A. Horowitz;Craig E. Hampel;Alfredo Moncayo;Kevin S. Donnelly
Jared L. Zerbe;Fred F. Chen;Andrew Ho;Ramin Farjad-Rad
Thomas H. Lee;Kevin S. Donnelly;Tsyr-Chyang Ho
K.-Y.K. Chang;J. Wei;C. Huang;S. Li
Donald V. Perino;Haw-Jyh Liaw;Alfredo Moncayo;Kevin Donnelly
Bruno Werner Garlepp;Kevin S. Donnelly;Jared LeVan Zerbe
Kevin Donnelly;Mark Johnson;Chanh Tran;John B. Dillon
Thomas H. Lee;Kevin S. Donnelly;Tsyr-Chyang Ho
Kevin S. Donnelly;Jun Kim;Bruno W. Garleep;Mark A. Horowitz
Bruno Werner Garlepp;Pak Shing Chau;Kevin S. Donnelly;Clemenz Portmann
Thomas H. Lee;Kevin S. Donnelly
Unknown
Frederick A. Ware;Kevin S. Donnelly;Ely K. Tsern;Srinivas Nimmagadda
J.L. Zerbe;P.S. Chau;C.W. Werner;W.F. Stonecypher
J.L. Zerbe;P.S. Chau;C.W. Werner;T.P. Thrush
Kevin S. Donnelly;Chanh Tran;Michael Ching;Bruno Garlepp
K.-Y.K. Chang;J. Wei;S. Li;Y. Li
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