World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
37
Citations
8107
World Ranking
5044
National Ranking
82

Best Publications

  • Recommended Methods to Study Resistive Switching Devices

    Mario Lanza;H.-S. Philip Wong;Eric Pop;Daniele Ielmini

  • Dielectric breakdown mechanisms in gate oxides

    Salvatore Lombardo;James H. Stathis;Barry P. Linder;Kin Leong Pey

  • Standards for the Characterization of Endurance in Resistive Switching Devices.

    Mario Lanza;Rainer Waser;Rainer Waser;Daniele Ielmini;J. Joshua Yang

  • Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication

    A. Heryanto;A. Heryanto;W. N. Putra;W. N. Putra;Alastair David Trigg;S. Gao

  • Excimer laser-annealed dopant segregated Schottky (ELA-DSS) Si nanowire gate-all-around (GAA) pFET with near zero effective Schottky barrier height (SBH)

    Y. K. Chin;K. L. Pey;N. Singh;G. Q. Lo

  • The nature of dielectric breakdown

    Unknown

  • Vertically arrayed Si nanowire/nanorod-based core-shell p-n junction solar cells

    X. Wang;K. L. Pey;C. H. Yip;E. A. Fitzgerald

  • Two-dimensional analytical Mott-Gurney law for a trap-filled solid

    Unknown

  • Percolation path and dielectric-breakdown-induced-epitaxy evolution during ultrathin gate dielectric breakdown transient

    Unknown

  • Annealing of ultrashallow p+/n junction by 248 nm excimer laser and rapid thermal processing with different preamorphization depths

    Y. F. Chong;K. L. Pey;A. T. S. Wee;A. See

  • Polarity-dependent dielectric breakdown-induced epitaxy (DBIE) in Si MOSFETs

    Unknown

  • Influence of Bosch Etch Process on Electrical Isolation of TSV Structures

    N. Ranganathan;Da Yong Lee;Liu Youhe;Guo-Qiang Lo

  • Intrinsic nanofilamentation in resistive switching

    Xing Wu;Dongkyu Cha;Michel Bosman;Nagarajan Raghavan

  • Interfacial reactions of Ni on Si1−xGex (x=0.2, 0.3) at low temperature by rapid thermal annealing

    H. B. Zhao;Kin Leong Pey;W. K. Choi;Sujay Chattopadhyay

  • Thermal reaction of nickel and Si0.75Ge0.25 alloy

    K. L. Pey;W. K. Choi;S. Chattopadhyay;H. B. Zhao

  • A High-Yield $\hbox{HfO}_{x}$ -Based Unipolar Resistive RAM Employing Ni Electrode Compatible With Si-Diode Selector for Crossbar Integration

    X A Tran;H Y Yu;Y C Yeo;L Wu

  • A Compact Model for Undoped Silicon-Nanowire MOSFETs With Schottky-Barrier Source/Drain

    Guojun Zhu;Xing Zhou;Teck Seng Lee;Lay Kee Ang

  • Femtosecond laser induced surface nanostructuring and simultaneous crystallization of amorphous thin silicon film

    X. C. Wang;H. Y. Zheng;C. W. Tan;F. Wang

  • Conductive Atomic Force Microscope Study of Bipolar and Threshold Resistive Switching in 2D Hexagonal Boron Nitride Films.

    A Ranjan;N Raghavan;S J O'Shea;S Mei;S Mei

  • On the Ni-Si phase transformation with/without native oxide

    P. S. Lee;D. Mangelinck;K. L. Pey;J. Ding

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