World's Best Scientists 2026 revealed!

D-Index & Metrics

Engineering and Technology

D-Index
34
Citations
6343
World Ranking
9146
National Ranking
2563

Overview

John W. Smith is affiliated with California Polytechnic State University in the United States. Their research primarily spans the field of Environmental Science with a particular focus on Global and Planetary Change, Environmental Engineering, Artificial Intelligence, Ecological Modeling, and Atmospheric Science.

The scientist's main topics of work include Soil Geostatistics and Mapping, Hydrological Forecasting Using AI, Climate variability and models, Data Analysis with R, Species Distribution and Climate Change, Atmospheric and Environmental Gas Dynamics, and Meteorological Phenomena and Simulations.

Frequent co-authors collaborating with John W. Smith include Leah R. Johnson, R. Quinn Thomas, Sean Sorek, Paul J. Huxley, and Abigail S. L. Lewis.

Publications by John W. Smith demonstrate involvement in both ecological and statistical methods applied to environmental data. Key papers include:

  • "Parameterizing Lognormal state space models using moment matching," 2023, Environmental and Ecological Statistics
  • "Assessing Ecosystem State Space Models: Identifiability and Estimation," 2023, Journal of Agricultural Biological and Environmental Statistics

Other notable papers within their research network, although authored by frequent collaborators, are:

  • "Increased adoption of best practices in ecological forecasting enables comparisons of forecastability," 2021, Ecological Applications
  • "bayesTPC: Bayesian inference for Thermal Performance Curves in R," 2024, bioRxiv (Cold Spring Harbor Laboratory)
  • "bayesTPC: Bayesian inference for thermal performance curves in R," 2025, Methods in Ecology and Evolution

John W. Smith has frequently published in venues such as Environmental and Ecological Statistics and arXiv (Cornell University), with additional publications appearing in Ecological Applications, bioRxiv (Cold Spring Harbor Laboratory), and Methods in Ecology and Evolution.

Best Publications

  • Microelectronic assemblies with multiple leads

    Thomas H. DiStefano;John W. Smith

  • Methods of making connections to a microelectronic unit

    Thomas H. DiStefano;John W. Smith

  • Method for forming compliant interface of semiconductor chip

    Thomas Distefano;Zlata Kovac;Craig Mitchell;コヴァック,ズラク

  • Method of making an electronic contact

    Joseph Fjelstad;John W. Smith;Thomas H. DiStefano;James Zaccardi

  • Microelectronic component with rigid interposer

    Pieter H. Bellaar;Thomas H. DiStefano;Joseph Fjelstad;Christopher M. Pickett

  • Socket for engaging bump leads on a microelectronic device and methods therefor

    Anthony B. Faraci;James B. Zaccardi;Thomas H. DiStefano;John W. Smith

  • Method of making a compliant integrated circuit package

    Thomas H. DiStefano;Konstantine Karavakis;Craig Mitchell;John W. Smith

  • Compliant microelectronic mounting device

    Thomas H. DiStefano;John W. Smith;Zlata Kovac;Konstantine Karavakis

  • Electrical connecting body equipped with changeable contact

    Thomas H Distefano;Joseph Fjelstad;Konstantine Karavakis;Zlata Kovak

  • SUBMINIATURE ELECTRONIC CONTACT AND INTEGRATED BODY

    Fjelstad Joseph;Smith John W;Distefano Thomas H;Walton A Christian

  • Semiconductor package with heat sink

    Thomas H. DiStefano;John W. Smith;Tony Faraci

  • Microelectronic lead structures with plural conductors

    John W. Smith;Joseph Fjelstad

  • Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures

    Thomas H. DiStefano;John W. Smith;Craig Mitchell

  • Microelectronic assembly fabrication with terminal formation from a conductive layer

    John W. Smith;Joseph Fjelstad

  • Chip with internal signal routing in external element

    Thomas H. DiStefano;John W. Smith

  • Methods and structures for electronic probing arrays

    Joseph Fjelstad;John W. Smith

  • Method of assembling a semiconductor chip package

    John W. Smith;Joseph Fjelstad

  • Method of encapsulating a semiconductor package

    Thomas H. Distefano;John W. Smith;Joseph Fjelstad;Craig S. Mitchell

  • Method of making chip mountings and assemblies

    John W. Smith;Thomas H. DiStefano

  • Connection component with peelable leads

    Thomas H. DiStefano;Joseph Fjelstad;Belgacem Haba;Owais Jamil

Frequent Co-Authors

Thomas H. DiStefano
Thomas H. DiStefano Centipede Systems
Joseph Fjelstad
Joseph Fjelstad Verdant Electronics
Belgacem Haba
Belgacem Haba Stanford University

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