World's Best Scientists 2026 revealed!

D-Index & Metrics

Engineering and Technology

D-Index
38
Citations
5970
World Ranking
8039
National Ranking
2220

Best Publications

  • Probe card assembly and kit, and methods of making same

    Benjamin Niles Eldridge;Gary William Grube;Igor Yan Khandros;Gaetan L. Mathieu

  • Lithographic contact elements

    Gaetan L. Mathieu;Benjamin N. Eldridge;Gary W. Grube

  • Method of planarizing tips of probe elements of a probe card assembly

    Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros;Gaetan L. Mathieu

  • Semiconductor connection components and methods with releasable lead support

    Thomas H. DiStefano;Gary W. Grube;Igor Y. Khandros;Gaetan Mathiew

  • Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures

    Benjamin N. Eldridge;Gary W. Grube;Igor Y Khandros;Gaetan L. Mathieu

  • Microelectronic contact structures, and methods of making same

    Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros;Gaetan L. Mathieu

  • Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods

    II Thomas H. Dozier;Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros

  • Spring interconnect structures

    Gaetan L. Mathieu;Benjamin N. Eldridge;Gary W. Grube;Richard A. Larder

  • Compliant semiconductor chip assemblies and methods of making same

    Kenneth B. Gilleo;Gary W. Grube;Gaetan Mathieu

  • Making discrete power connections to a space transformer of a probe card assembly

    Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros;Gaetan L. Mathieu

  • Connection components with frangible leads and bus

    Thomas H. DiStefano;Gary W. Grube;Igor Y. Khandros;Gaetan Mathieu

  • Semiconductor chip assemblies and components with pressure contact

    Gary Grube;Igor Khandros;Gaetan Mathieu

  • Planarizer for a semiconductor contactor

    Gaetan L. Mathieu;Benjamin N. Eldridge;Gary W. Grube

  • Semiconductor inner lead bonding tool

    Thomas H. DiStefano;Igor Y. Khandros;Gaetan Mathiew;Jason Sweis

  • Method and apparatus for shaping spring elements

    Igor Y. Khandros;Thomas H. Dozier;Gary W. Grube;Gaetan L. Mathieu

  • Microelectronic contact structure, and method of making same.

    Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros;Gaetan L. Mathieu

  • Microelectronic contact structure

    Gary W. Grube;Gaetan L. Mathieu;Alec Madsen

  • Method of burning-in semiconductor devices

    Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros;Gaetan L. Mathieu

  • Method of temporarily, then permanently, connecting to a semiconductor device

    Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros;Gaetan L. Mathieu

  • Methods for making spring interconnect structures

    Gaetan L. Mathieu;Benjamin N. Eldridge;Gary W. Grube

Frequent Co-Authors

benjamin n eldridge
benjamin n eldridge Nutcracker Therapeutics
Igor Y. Khandros
Igor Y. Khandros Nutcracker Therapeutics
Jason K. Resch
Jason K. Resch IBM (United States)
Timothy W. Markison
Timothy W. Markison IBM (United States)
Wesley Leggette
Wesley Leggette IBM (United States)
Andrew Baptist
Andrew Baptist IBM (United States)
Thomas H. DiStefano
Thomas H. DiStefano Centipede Systems
Charles A. Miller
Charles A. Miller University of Iowa
Fuad E. Doany
Fuad E. Doany IBM (United States)

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