What is he best known for?
The fields of study he is best known for:
- Electrical engineering
- Integrated circuit
- Semiconductor
Tetsu Tanaka mainly focuses on Optoelectronics, Electrical engineering, MOSFET, Wafer and Wafer bonding.
Tetsu Tanaka works in the field of Optoelectronics, focusing on Through-silicon via in particular.
His Electrical engineering study integrates concerns from other disciplines, such as Dram and Microelectromechanical systems.
Tetsu Tanaka works mostly in the field of MOSFET, limiting it down to topics relating to Silicon on insulator and, in certain cases, Field-effect transistor, Transconductance, Subthreshold slope and Subthreshold conduction.
Tetsu Tanaka works mostly in the field of Wafer, limiting it down to topics relating to Silicon and, in certain cases, Composite material, Chip and Polycrystalline silicon, as a part of the same area of interest.
His research links Electronic engineering with Wafer bonding.
His most cited work include:
- Scaling theory for double-gate SOI MOSFET's (453 citations)
- High-Density Through Silicon Vias for 3-D LSIs (249 citations)
- Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections (207 citations)
What are the main themes of his work throughout his whole career to date?
His scientific interests lie mostly in Optoelectronics, Wafer, Chip, Electronic engineering and Nanotechnology.
His biological study deals with issues like Electrical engineering, which deal with fields such as Silicon on insulator.
His research in the fields of Wafer bonding, Direct bonding and Anodic bonding overlaps with other disciplines such as Surface tension.
His studies examine the connections between Chip and genetics, as well as such issues in Retinal Prosthesis, with regards to Biomedical engineering.
His Electronic engineering research is multidisciplinary, relying on both Dram, Image sensor and Annealing.
His Nanotechnology research is mostly focused on the topic Nanodot.
He most often published in these fields:
- Optoelectronics (41.74%)
- Wafer (22.25%)
- Chip (20.87%)
What were the highlights of his more recent work (between 2016-2021)?
- Optoelectronics (41.74%)
- Composite material (12.61%)
- Wafer (22.25%)
In recent papers he was focusing on the following fields of study:
Optoelectronics, Composite material, Wafer, Nanotechnology and Chip are his primary areas of study.
Tetsu Tanaka frequently studies issues relating to Square wave and Optoelectronics.
His studies deal with areas such as Daisy chain and Dielectric as well as Composite material.
The Wafer study combines topics in areas such as Adhesive and Annealing.
His Chip study incorporates themes from Electronic engineering and Retinal Prosthesis.
His work in the fields of Electronic engineering, such as Circuit design, intersects with other areas such as Sensing system.
Between 2016 and 2021, his most popular works were:
- Remarkable Suppression of Local Stress in 3D IC by Manganese Nitride-Based Filler with Large Negative CTE (8 citations)
- Self-Assembly and Electrostatic Carrier Technology for Via-Last TSV Formation Using Transfer Stacking-Based Chip-to-Wafer 3-D Integration (7 citations)
- Charge-Trap-Free Polymer-Liner Through-Silicon Vias for Reliability Improvement of 3D ICs (4 citations)
In his most recent research, the most cited papers focused on:
- Electrical engineering
- Semiconductor
- Integrated circuit
Tetsu Tanaka focuses on Optoelectronics, Composite material, Wafer, Three-dimensional integrated circuit and Chip.
His work on Mixed-signal integrated circuit as part of general Optoelectronics study is frequently connected to Electric field, therefore bridging the gap between diverse disciplines of science and establishing a new relationship between them.
His Wafer study frequently draws connections between related disciplines such as Layer.
His work deals with themes such as Capacitance, Noise and Dielectric, which intersect with Three-dimensional integrated circuit.
The concepts of his Chip study are interwoven with issues in Electronic engineering, Retinal Prosthesis, Cracking and Reliability.
His research on Electronic engineering often connects related areas such as Electrical engineering.
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