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Seiichi Nakatani

Seiichi Nakatani

D-Index & Metrics

Materials Science

D-Index
50
Citations
8702
World Ranking
10259
National Ranking
633

Overview

Seiichi Nakatani is a researcher affiliated with Panasonic in Japan. Their work is situated within a corporate research environment, indicating engagement with applied research and development activities within the technology sector.

There are no recent papers publicly listed for Seiichi Nakatani, nor specific details about frequent co-authors or regular publication venues.

Similarly, no particular fields, subfields of study, or main research topics have been documented in available records. Likewise, there is no information on book publications or awards received.

Given the lack of detailed publication or research output data, it can be inferred that Seiichi Nakatani's contributions may primarily reside within internal corporate research and development, or that public documentation is limited.

Best Publications

  • Component built-in module and method for producing the same

    Seiichi Nakatani;Yasuhiro Sugaya;Toshiyuki Asahi;Shingo Komatsu

  • Manufacturing method of module incorporating circuit component therein

    Koichi Hirano;Seiichi Nakatani;誠一 中谷;浩一 平野

  • Circuit component built-in module with embedded semiconductor chip and method of manufacturing

    Yasuhiro Sugaya;Toshiyuki Asahi;Shingo Komatsu;Yoshiyuki Yamamoto

  • Circuit component built-in module, radio device having the same, and method for producing the same

    Yasuhiro Sugaya;Koichi Hirano;Seiichi Nakatani;Yasuyuki Matsuoka

  • Module with embedded electric elements and the manufacturing method thereof

    Nakatani Seiichi;Bessho Yoshihiro;Sugaya Yasuhiro;Onishi Keiji

  • Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same

    Seiichi Nakatani;Akihito Hatakeyama;Kouji Kawakita;Hiroshii Sogou

  • Electronic component built-in module and method of manufacturing the same

    Yoshihisa Yamashita;Koichi Hirano;Yasuhiro Sugaya;Toshiyuki Asahi

  • Transfer material used for producing a wiring substrate

    Yasuhiro Sugaya;Shingo Komatsu;Koichi Hirano;Seiichi Nakatani

  • Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same

    Kouji Kawakita;Seiichi Nakatani;Tatsuo Ogawa;Masatoshi Suehiro

  • Module with a built-in semiconductor and method for producing the same

    Toshiyuki Kojima;Seiichi Nakatani;Yasuhiro Sugaya;Yoshiyuki Yamamoto

  • Multi-level semiconductor module and method for fabricating the same

    Takeshi Kawabata;Motoaki Satou;Toshiyuki Fukuda;Toshio Tsuda

  • Connection member and mount assembly and production method of the same

    Toshiyuki Asahi;Seiji Karashima;Takashi Ichiryu;Seiichi Nakatani

  • Printed circuit board and method for the manufacture of same

    Seiichi Nakatani

  • Magnetic element and method of manufacturing the same

    Junichi Kato;Osamu Inoue;Seiichi Nakatani;Koichi Hirano

  • Method of manufacturing two-sided and multi-layered printed circuit boards

    Kouji Kawakita;Masahide Tsukamoto;Yasukiho Horio;Seiichi Nakatani

  • Circuit part built-in module and manufacture thereof

    Koichi Hirano;Seiichi Nakatani;誠一 中谷;浩一 平野

  • Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same

    Seiichi Nakatani;Yoshihisa Yamashita;Takashi Ichiryu;Koichi Hirano

  • Electronic component packaging structure and method for producing the same

    Seiichi Nakatani

  • Semiconductor encapsulation and its manufacture method

    Koichi Hirano;Seiichi Nakatani

  • Light transmission path substrate, light transmission path built-in substrate and their manufacture

    Seiji Karashima;Seiichi Nakatani;Yasuhiro Sugatani

Frequent Co-Authors

Toru Ishida
Toru Ishida Hong Kong Baptist University

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