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D-Index & Metrics

Mechanical and Aerospace Engineering

D-Index
62
Citations
19127
World Ranking
592
National Ranking
266

Research.com Recognitions

  • 1999 - Mayo D. Hersey Award, The American Society of Mechanical Engineers
  • 1994 - Member of the National Academy of Engineering For research and professional leadership in the mechanics of computer technology.
  • 1992 - Fellow of the American Society of Mechanical Engineers

Overview

David B. Bogy is affiliated with the University of California, Berkeley in the United States. Their research spans multiple areas within engineering and materials science, focusing on topics related to thermal management, surface interactions, and micro- and nanoscale phenomena.

Their primary fields of study include Engineering and Materials Science, with specialization in subfields such as Materials Chemistry, Mechanical Engineering, Mechanics of Materials, Civil and Structural Engineering, and Biomedical Engineering. This interdisciplinary approach supports investigations across various scientific and technological challenges at the interface of materials and mechanical systems.

Key topics covered in their work are:

  • Thermal Radiation and Cooling Technologies
  • Adhesion, Friction, and Surface Interactions
  • Thermal properties of materials
  • Phase-change materials and chalcogenides
  • Heat Transfer and Optimization
  • Surface Roughness and Optical Measurements
  • Quantum Electrodynamics and Casimir Effect

Frequent publication venues for their research include:

  • Journal of Applied Physics
  • Applied Physics Letters
  • Tribology Letters
  • Scientific Reports
  • IEEE Transactions on Magnetics

Selected recent publications by David B. Bogy are:

  • "A low voltage-powered soft electromechanical stimulation patch for haptics feedback in human-machine interfaces," 2021, Biosensors and Bioelectronics
  • "Investigation of heat transfer across a nanoscale air gap between a flying head and a rotating disk," 2020, Journal of Applied Physics
  • "Precise nanoscale temperature mapping in operational microelectronic devices by use of a phase change material," 2020, Scientific Reports
  • "Experimental study of smear formation and removal in heat-assisted magnetic recording," 2021, Tribology International
  • "A Study of the Nanoscale Heat Transfer in the HDD Head-Disk Interface Based on a Static Touchdown Experiment," 2020, IEEE Transactions on Magnetics

Frequent coauthors with whom they have collaborated include Qilong Cheng, Robert L. Smith, Siddhesh V. Sakhalkar, Roshan Mathew Tom, and Sukumar Rajauria.

David B. Bogy has received several recognitions, including:

  • Mayo D. Hersey Award, The American Society of Mechanical Engineers, 1999
  • Member of the National Academy of Engineering, 1994, for research and professional leadership in the mechanics of computer technology
  • Fellow of the American Society of Mechanical Engineers, 1992

Best Publications

  • An Elastic-Plastic Model for the Contact of Rough Surfaces

    W. R. Chang;I. Etsion;D. B. Bogy

  • Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loading

    David B. Bogy

  • Two Edge-Bonded Elastic Wedges of Different Materials and Wedge Angles Under Surface Tractions

    D. B. Bogy

  • Characterization of diamondlike carbon films and their application as overcoats on thin‐film media for magnetic recording

    Hsiao‐chu Tsai;D. B. Bogy

  • Static Friction Coefficient Model for Metallic Rough Surfaces

    W. R. Chang;I. Etsion;D. B. Bogy

  • Experimental and theoretical study of wave propagation phenomena in drop-on-demand ink jet devices

    D. B. Bogy;F. E. Talke

  • Flying plasmonic lens in the near field for high-speed nanolithography

    Werayut Srituravanich;Liang Pan;Yuan Wang;Cheng Sun

  • On the problem of edge-bonded elastic quarter-planes loaded at the boundary

    D.B. Bogy

  • Stress singularities at interface corners in bonded dissimilar isotropic elastic materials

    D.B. Bogy;K.C. Wang

  • On the Plane Elastostatic Problem of a Loaded Crack Terminating at a Material Interface

    D. B. Bogy

  • Adhesion Model for Metallic Rough Surfaces

    W. R. Chang;I. Etsion;D. B. Bogy

  • Chemical structure and physical properties of diamond-like amorphous carbon films prepared by magnetron sputtering

    N. H. Cho;K. M. Krishnan;D. K. Veirs;M. D. Rubin

  • Maskless plasmonic lithography at 22 nm resolution.

    Liang Pan;Yongshik Park;Yi Xiong;Erick Ulin-Avila

  • Elastic-Plastic Finite Element Analysis of Repeated Indentation of a Half-Space by a Rigid Sphere

    E. R. Kral;K. Komvopoulos;D. B. Bogy

  • A Flexible Piezoelectret Actuator/Sensor Patch for Mechanical Human-Machine Interfaces.

    Junwen Zhong;Yuan Ma;Yu Song;Yu Song;Qize Zhong

  • Drop formation by DOD ink-jet nozzles: a comparison of experiment and numerical simulation

    T. W. Shield;D. B. Bogy;F. E. Talke

  • The Plane Solution for Anisotropic Elastic Wedges Under Normal and Shear Loading

    D. B. Bogy

  • Effects of substrate temperature on chemical structure of amorphous carbon films

    N. H. Cho;D. K. Veirs;J. W. Ager;M. D. Rubin

  • Adhesion of Contacting Rough Surfaces in the Presence of Sub-Boundary Lubrication

    H. M. Stanley;I. Etsion;D. B. Bogy

  • The Stability of a Circular Rod Laterally Constrained to Be in Contact With an Inclined Circular Cylinder

    P. R. Paslay;D. B. Bogy

Frequent Co-Authors

Frank E. Talke
Frank E. Talke University of California, San Diego
Kyriakos Komvopoulos
Kyriakos Komvopoulos University of California, Berkeley
Xiang Zhang
Xiang Zhang University of Hong Kong
Bharat Bhushan
Bharat Bhushan The Ohio State University
Cheng Sun
Cheng Sun Northwestern University
Ian G. Brown
Ian G. Brown Lawrence Berkeley National Laboratory
Yonggang Meng
Yonggang Meng Tsinghua University
Guangyu Zhang
Guangyu Zhang Chinese Academy of Sciences
Takashi Maeno
Takashi Maeno Keio University
Joel W. Ager
Joel W. Ager Lawrence Berkeley National Laboratory

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