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Overview

Qing Ma is a researcher affiliated with Intel in the United States, specializing in fields related to engineering. Their work primarily spans Mechanical Engineering, Aerospace Engineering, Materials Chemistry, and Mechanics of Materials. Qing Ma's research focus includes the study of high entropy alloys, high-temperature coating behaviors, advanced materials and composites, titanium alloys microstructure and properties, microstructure and mechanical properties, metallurgy and material forming, as well as additive manufacturing materials and processes.

The scientist has contributed research to several prominent publication venues including:

  • Materials Letters
  • Journal of Materials Research and Technology
  • Journal of Laser Applications
  • Journal of Physics Conference Series

Among their recent papers are:

  • "Crack-free 60 wt% WC reinforced FeCoNiCr high-entropy alloy composite coating fabricated by laser cladding" (2022) published in Materials Letters
  • "Exploration of the static softening behavior and dislocation density evolution of TA15 titanium alloy during double-pass hot compression deformation" (2022) published in Journal of Materials Research and Technology
  • "Wear resistance of laser cladding Fe50Cr40Si10 coating on AISI 1045 steel in elevated temperature" (2021) published in Journal of Laser Applications
  • "Structural design and analysis of underwater survival capsule for pumped-storage power station" (2025) published in Journal of Physics Conference Series

Qing Ma frequently collaborates with other researchers in the field, including Bingwen Lu, Yanmei Zhang, Yueliang Wang, Xingchen Yan, and Min Liu. These frequent coauthors indicate a collaborative research environment and shared interests across related topics in materials science and engineering.

Best Publications

  • Size dependent hardness of silver single crystals

    Qing Ma;David R. Clarke

  • Adhesion and debonding of multi-layer thin film structures

    R.H. Dauskardt;M. Lane;Q. Ma;N. Krishna

  • Stress Measurement in Single-Crystal and Polycrystalline Ceramics Using Their Optical Fluorescence

    Qing Ma;David R. Clarke

  • Structures and processes for fabricating moisture resistant chip-on-flex packages

    Qing Ma;Chun Mu;Harry Fujimoto;John Carruthers

  • Piezospectroscopic Determination of Residual Stresses in Polycrystalline Alumina

    Qing Ma;David R. Clarke

  • Packaging microelectromechanical structures

    Qing Ma;Valluri Rao;Li-Peng Wang;John Heck

  • MEMS device integrated chip package, and method of making same

    Qing Ma;Peng Cheng;Valluri Rao

  • Microelectromechanical (MEMS) switching apparatus

    Qing Ma;Valluri Rao;John Heck;Li-Peng Wang

  • Residual stresses in Al2O3ZrO2 composites: A test of stochastic stress models

    Qing Ma;W. Pompe;J.D. French;D.R. Clarke

  • Apparatus for adjusting the resonance frequency of a microelectromechanical (MEMS) resonator using tensile/compressive strain and applications thereof

    Qing Ma;Andy Berlin

  • Adjusting the frequency of film bulk acoustic resonators

    Li-Peng Wang;Michael DiBattista;Seth Fortuna;Qing Ma

  • Plastic ratcheting induced cracks in thin film structures

    M. Huang;Z. Suo;Q. Ma

  • Thin Film Cracking and Ratcheting Caused by Temperature Cycling

    M. Huang;Z. Suo;Q. Ma;H. Fujimoto

  • Multiplex data collection and analysis in bioanalyte detection

    Xing Su;Lei Sun;Mineo Yamakawa;Jingwu Zhang

  • Measurement of residual stresses in sapphire fiber composites using optical fluorescence

    Qing Ma;D.R. Clarke

  • Low inductance via structures

    John Heck;Qing Ma

  • Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips

    Qing Ma;Johanna M. Swan;Min Tao;Charles A. Gealer

  • Metal contact reliability of RF MEMS switches

    Qing Ma;Quan Tran;Tsung-Kuan A. Chou;John Heck

  • Micro-electromechanical structure resonator frequency adjustment using radient energy trimming and laser/focused ion beam assisted deposition

    Qing Ma;Peng Cheng;Valluri Rao

  • Tunable inductor using microelectromechanical switches

    Qing Ma;Peng Cheng;Valluri Rao

Frequent Co-Authors

David R. Clarke
David R. Clarke Harvard University
Zhigang Suo
Zhigang Suo Harvard University
Reinhold H. Dauskardt
Reinhold H. Dauskardt Stanford University
William D. Nix
William D. Nix Stanford University
John W. Hutchinson
John W. Hutchinson Harvard University
Huajian Gao
Huajian Gao Tsinghua University
Oliver Kraft
Oliver Kraft Karlsruhe Institute of Technology
Yuegang Zhang
Yuegang Zhang Tsinghua University
Anthony G. Evans
Anthony G. Evans University of California, Santa Barbara

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