2026 Mircea R. Stan: Electronics and Electrical Engineering Researcher – H-Index, Publications & Awards

Discipline name	D-Index	World Ranking	Current World Ranking	National Ranking	Current National Ranking	Publications	Citations
Electronics and Electrical Engineering	58	1823	1747	723	675	322	16698

Overview

Mircea R. Stan is affiliated with the University of Virginia in the United States. Their research primarily spans the field of engineering, with a significant focus on electrical and electronic engineering. Additional subfields of interest include atomic and molecular physics, optics, computer networks and communications, mechanical engineering, and artificial intelligence.

The scientist's work addresses several key topics within their field. These include:

Advanced Memory and Neural Computing
Semiconductor materials and devices
Advancements in Semiconductor Devices and Circuit Design
3D IC and Through-Silicon Via (TSV) technologies
Ferroelectric and Negative Capacitance Devices
Magnetic properties of thin films
Heat Transfer and Optimization

Mircea R. Stan has contributed to a range of publications over recent years. Some selected papers include:

IEEE Transactions on Nanotechnology, published in 2021, in the IEEE Transactions on Nanotechnology journal
PiMulator: a Fast and Flexible Processing-in-Memory Emulation Platform, 2022, presented at the 2022 Design, Automation & Test in Europe Conference & Exhibition (DATE)
From 2.5D to 3D Chiplet Systems: Investigation of Thermal Implications with HotSpot 7.0, 2022, presented at the 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
AI-PiM-Extending the RISC-V processor with Processing-in-Memory functional units for AI inference at the edge of IoT, 2022, published in Frontiers in Electronics
EXTREM-EDGE-EXtensions To RISC-V for Energy-efficient ML inference at the EDGE of IoT, 2022, published in Sustainable Computing Informatics and Systems

Frequent coauthors collaborating with Mircea R. Stan include:

Xinfei Guo
Rajiv Joshi
Kevin Skadron
Manuel Delgado-Restituto
Zaman Fakhrul

Mircea R. Stan's research contributions are frequently published in specific venues such as:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems
IEEE Transactions on Circuits and Systems I Regular Papers
IEEE Transactions on Nanotechnology
arXiv (Cornell University)
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

Best Publications

Temperature-aware microarchitecture

Kevin Skadron;Mircea R. Stan;Wei Huang;Sivakumar Velusamy

1654
Citations
Bus-invert coding for low-power I/O

M.R. Stan;W.P. Burleson

1476
Citations
HotSpot: a compact thermal modeling methodology for early-stage VLSI design

Wei Huang;S. Ghosh;S. Velusamy;K. Sankaranarayanan

1320
Citations
Temperature-aware microarchitecture: Modeling and implementation

Kevin Skadron;Mircea R. Stan;Karthik Sankaranarayanan;Wei Huang

977
Citations
Control-theoretic techniques and thermal-RC modeling for accurate and localized dynamic thermal management

K. Skadron;T. Abdelzaher;M.R. Stan

558
Citations
Relaxing non-volatility for fast and energy-efficient STT-RAM caches

Clinton W. Smullen;Vidyabhushan Mohan;Anurag Nigam;Sudhanva Gurumurthi

520
Citations
Advances and Future Prospects of Spin-Transfer Torque Random Access Memory

E Chen;D Apalkov;Z Diao;A Driskill-Smith

480
Citations
Compact thermal modeling for temperature-aware design

Wei Huang;M.R. Stan;K. Skadron;K. Sankaranarayanan

445
Citations
The Promise of Nanomagnetics and Spintronics for Future Logic and Universal Memory

S A Wolf;Jiwei Lu;M R Stan;E Chen

414
Citations
HotLeakage: A Temperature-Aware Model of Subthreshold and Gate Leakage for Architects

Yan Zhang;Dharmesh Parikh;Karthik Sankaranarayanan;Kevin Skadron

373
Citations
Molecular electronics: from devices and interconnect to circuits and architecture

M.R. Stan;P.D. Franzon;S.C. Goldstein;J.C. Lach

373
Citations
A Case for Thermal-Aware Floorplanning at the Microarchitectural Level

Karthik Sankaranarayanan;Sivakumar Velusamy;Mircea R. Stan;Kevin Skadron

261
Citations
CMOS/nano co-design for crossbar-based molecular electronic systems

M.M. Ziegler;M.R. Stan

250
Citations
Low-power encodings for global communication in CMOS VLSI

M. R. Stan;W. P. Burleson

233
Citations
Circuit-level techniques to control gate leakage for sub-100 nm CMOS

Fatih Hamzaoglu;Mircea R. Stan

189
Citations
Odd/Even bus invert with two-phase transfer for buses with coupling

Yan Zhang;John Lach;Kevin Skadron;Mircea R. Stan

177
Citations
Power issues related to branch prediction

D. Parikh;K. Skadron;Yan Zhang;M. Barcella

172
Citations
Scaling with Design Constraints: Predicting the Future of Big Chips

Wei Huang;Karthick Rajamani;Mircea R. Stan;Kevin Skadron

167
Citations
Accurate, Pre-RTL Temperature-Aware Design Using a Parameterized, Geometric Thermal Model

Wei Huang;K. Sankaranarayanan;K. Skadron;R.J. Ribando

159
Citations
HotSpot: a Dynamic Compact Thermal Model at the Processor-Architecture Level

Mircea R. Stan;Kevin Skadron;Marco Barcella;Wei Huang

154
Citations
Control-theoretic dynamic frequency and voltage scaling for multimedia workloads

Zhijian Lu;Jason Hein;Marty Humphrey;Mircea Stan

149
Citations

Frequent Co-Authors

Kevin Skadron University of Virginia

John Lach George Washington University

Garrett S. Rose University of Tennessee at Knoxville

Wayne Burleson University of Massachusetts Amherst

Pradip Bose IBM (United States)

Vivek De Intel (United States)

Siva G. Narendra Tyfone, Inc.

Jacob A. Abraham The University of Texas at Austin

Alper Buyuktosunoglu IBM (United States)

Benton H. Calhoun University of Virginia

External Links

Personal website of Mircea R. Stan Google Scholar page

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