World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
58
Citations
16698
World Ranking
1823
National Ranking
724

Mircea R. Stan publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Mircea R. Stan sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 322 publications — 62nd percentile

62% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Mircea R. Stan D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Mircea R. Stan sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 58 D-Index — 74th percentile

74% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

Mircea R. Stan is affiliated with the University of Virginia in the United States. Their research primarily spans the field of engineering, with a significant focus on electrical and electronic engineering. Additional subfields of interest include atomic and molecular physics, optics, computer networks and communications, mechanical engineering, and artificial intelligence.

The scientist's work addresses several key topics within their field. These include:

  • Advanced Memory and Neural Computing
  • Semiconductor materials and devices
  • Advancements in Semiconductor Devices and Circuit Design
  • 3D IC and Through-Silicon Via (TSV) technologies
  • Ferroelectric and Negative Capacitance Devices
  • Magnetic properties of thin films
  • Heat Transfer and Optimization

Mircea R. Stan has contributed to a range of publications over recent years. Some selected papers include:

  • IEEE Transactions on Nanotechnology, published in 2021, in the IEEE Transactions on Nanotechnology journal
  • PiMulator: a Fast and Flexible Processing-in-Memory Emulation Platform, 2022, presented at the 2022 Design, Automation & Test in Europe Conference & Exhibition (DATE)
  • From 2.5D to 3D Chiplet Systems: Investigation of Thermal Implications with HotSpot 7.0, 2022, presented at the 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
  • AI-PiM-Extending the RISC-V processor with Processing-in-Memory functional units for AI inference at the edge of IoT, 2022, published in Frontiers in Electronics
  • EXTREM-EDGE-EXtensions To RISC-V for Energy-efficient ML inference at the EDGE of IoT, 2022, published in Sustainable Computing Informatics and Systems

Frequent coauthors collaborating with Mircea R. Stan include:

  • Xinfei Guo
  • Rajiv Joshi
  • Kevin Skadron
  • Manuel Delgado-Restituto
  • Zaman Fakhrul

Mircea R. Stan's research contributions are frequently published in specific venues such as:

  • IEEE Transactions on Very Large Scale Integration (VLSI) Systems
  • IEEE Transactions on Circuits and Systems I Regular Papers
  • IEEE Transactions on Nanotechnology
  • arXiv (Cornell University)
  • 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

Best Publications

  • Temperature-aware microarchitecture

    Kevin Skadron;Mircea R. Stan;Wei Huang;Sivakumar Velusamy

  • Bus-invert coding for low-power I/O

    M.R. Stan;W.P. Burleson

  • HotSpot: a compact thermal modeling methodology for early-stage VLSI design

    Wei Huang;S. Ghosh;S. Velusamy;K. Sankaranarayanan

  • Temperature-aware microarchitecture: Modeling and implementation

    Kevin Skadron;Mircea R. Stan;Karthik Sankaranarayanan;Wei Huang

  • Control-theoretic techniques and thermal-RC modeling for accurate and localized dynamic thermal management

    K. Skadron;T. Abdelzaher;M.R. Stan

  • Relaxing non-volatility for fast and energy-efficient STT-RAM caches

    Clinton W. Smullen;Vidyabhushan Mohan;Anurag Nigam;Sudhanva Gurumurthi

  • Advances and Future Prospects of Spin-Transfer Torque Random Access Memory

    E Chen;D Apalkov;Z Diao;A Driskill-Smith

  • Compact thermal modeling for temperature-aware design

    Wei Huang;M.R. Stan;K. Skadron;K. Sankaranarayanan

  • The Promise of Nanomagnetics and Spintronics for Future Logic and Universal Memory

    S A Wolf;Jiwei Lu;M R Stan;E Chen

  • HotLeakage: A Temperature-Aware Model of Subthreshold and Gate Leakage for Architects

    Yan Zhang;Dharmesh Parikh;Karthik Sankaranarayanan;Kevin Skadron

  • Molecular electronics: from devices and interconnect to circuits and architecture

    M.R. Stan;P.D. Franzon;S.C. Goldstein;J.C. Lach

  • A Case for Thermal-Aware Floorplanning at the Microarchitectural Level

    Karthik Sankaranarayanan;Sivakumar Velusamy;Mircea R. Stan;Kevin Skadron

  • CMOS/nano co-design for crossbar-based molecular electronic systems

    M.M. Ziegler;M.R. Stan

  • Low-power encodings for global communication in CMOS VLSI

    M. R. Stan;W. P. Burleson

  • Circuit-level techniques to control gate leakage for sub-100 nm CMOS

    Fatih Hamzaoglu;Mircea R. Stan

  • Odd/Even bus invert with two-phase transfer for buses with coupling

    Yan Zhang;John Lach;Kevin Skadron;Mircea R. Stan

  • Power issues related to branch prediction

    D. Parikh;K. Skadron;Yan Zhang;M. Barcella

  • Scaling with Design Constraints: Predicting the Future of Big Chips

    Wei Huang;Karthick Rajamani;Mircea R. Stan;Kevin Skadron

  • Accurate, Pre-RTL Temperature-Aware Design Using a Parameterized, Geometric Thermal Model

    Wei Huang;K. Sankaranarayanan;K. Skadron;R.J. Ribando

  • HotSpot: a Dynamic Compact Thermal Model at the Processor-Architecture Level

    Mircea R. Stan;Kevin Skadron;Marco Barcella;Wei Huang

  • Control-theoretic dynamic frequency and voltage scaling for multimedia workloads

    Zhijian Lu;Jason Hein;Marty Humphrey;Mircea Stan

Frequent Co-Authors

Kevin Skadron
Kevin Skadron University of Virginia
Wei Huang
Wei Huang Advanced Micro Devices (Canada)
John Lach
John Lach George Washington University
Sudhanva Gurumurthi
Sudhanva Gurumurthi Advanced Micro Devices (United States)
Garrett S. Rose
Garrett S. Rose University of Tennessee at Knoxville
Wayne Burleson
Wayne Burleson University of Massachusetts Amherst
Pradip Bose
Pradip Bose IBM (United States)
Vivek De
Vivek De Intel (United States)
Siva G. Narendra
Siva G. Narendra Tyfone, Inc.
Jacob A. Abraham
Jacob A. Abraham The University of Texas at Austin

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Related Online Degrees & Career Pathways

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For introverted professionals or students, it's encouraging to know that there are many high paying jobs for introverts within engineering and project management fields, enabling success in roles that match their personality and skills.

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