World's Best Scientists 2026 revealed!

D-Index & Metrics

Computer Science

D-Index
73
Citations
29937
World Ranking
1551
National Ranking
807

Electronics and Electrical Engineering

D-Index
66
Citations
24609
World Ranking
1116
National Ranking
467

Research.com Recognitions

  • 2015 - ACM Fellow For contributions in power- and thermal-aware modeling, design and benchmarking of microprocessors, including GPUs.
  • 2013 - IEEE Fellow For contributions to thermal modeling in microprocessors
  • 2010 - ACM Distinguished Member
  • 2007 - ACM Senior Member

Overview

Kevin Skadron is affiliated with the University of Virginia in the United States. Their research primarily focuses on computer science and engineering, with a strong emphasis on electrical and electronic engineering, computer networks and communications, artificial intelligence, hardware and architecture, and molecular biology.

The scientist's recent publications cover topics aligned with memory technology, thermal modeling, and advanced computing systems. Notable papers include:

  • ROCKY: A Robust Hybrid On-chip Memory Kit For The Processors With STT-MRAM Cache Technology, 2020, published in IEEE Transactions on Computers
  • PiMulator: a Fast and Flexible Processing-in-Memory Emulation Platform, 2022, presented at the 2022 Design, Automation & Test in Europe Conference & Exhibition (DATE)
  • From 2.5D to 3D Chiplet Systems: Investigation of Thermal Implications with HotSpot 7.0, 2022, featured in the 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
  • Agile-AES: Implementation of configurable AES primitive with agile design approach, 2022, published in Integration
  • NOSTalgy: Near-Optimum Run-Time STT-MRAM Quality-Energy Knob Management for Approximate Computing Applications, 2020, appearing in IEEE Transactions on Computers

Frequent coauthors collaborating with Kevin Skadron include:

  • Mircea R. Stan
  • Tommy Tracy
  • Xinfei Guo
  • Alif Ahmed
  • Ashish Venkat

The scientist's work appears regularly in publication venues such as:

  • arXiv (Cornell University)
  • IEEE Computer Architecture Letters
  • IEEE Transactions on Computers
  • IEEE Micro
  • 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

Research topics often addressed in their work include:

  • Parallel Computing and Optimization Techniques
  • Advanced Memory and Neural Computing
  • Ferroelectric and Negative Capacitance Devices
  • Advanced Data Storage Technologies
  • Graph Theory and Algorithms
  • Semiconductor materials and devices
  • Network Packet Processing and Optimization

Kevin Skadron has been recognized with several awards, including:

  • ACM Fellow in 2015 for contributions in power- and thermal-aware modeling, design and benchmarking of microprocessors, including GPUs
  • IEEE Fellow in 2013 for contributions to thermal modeling in microprocessors
  • ACM Distinguished Member in 2010
  • ACM Senior Member in 2007

Best Publications

  • Rodinia: A benchmark suite for heterogeneous computing

    Shuai Che;Michael Boyer;Jiayuan Meng;David Tarjan

  • Scalable Parallel Programming with CUDA: Is CUDA the parallel programming model that application developers have been waiting for?

    John Nickolls;Ian Buck;Michael Garland;Kevin Skadron

  • Scalable parallel programming with CUDA

    John Nickolls;Ian Buck;Michael Garland;Kevin Skadron

  • Temperature-aware microarchitecture

    Kevin Skadron;Mircea R. Stan;Wei Huang;Sivakumar Velusamy

  • HotSpot: a compact thermal modeling methodology for early-stage VLSI design

    Wei Huang;S. Ghosh;S. Velusamy;K. Sankaranarayanan

  • Temperature-aware microarchitecture: Modeling and implementation

    Kevin Skadron;Mircea R. Stan;Karthik Sankaranarayanan;Wei Huang

  • A performance study of general-purpose applications on graphics processors using CUDA

    Shuai Che;Michael Boyer;Jiayuan Meng;David Tarjan

  • Bubble-Up: increasing utilization in modern warehouse scale computers via sensible co-locations

    Jason Mars;Lingjia Tang;Robert Hundt;Kevin Skadron

  • Control-theoretic techniques and thermal-RC modeling for accurate and localized dynamic thermal management

    K. Skadron;T. Abdelzaher;M.R. Stan

  • Accelerating Compute-Intensive Applications with GPUs and FPGAs

    Shuai Che;Jie Li;J.W. Sheaffer;K. Skadron

  • Compact thermal modeling for temperature-aware design

    Wei Huang;M.R. Stan;K. Skadron;K. Sankaranarayanan

  • A characterization of the Rodinia benchmark suite with comparison to contemporary CMP workloads

    Shuai Che;Jeremy W. Sheaffer;Michael Boyer;Lukasz G. Szafaryn

  • Accelerating SQL database operations on a GPU with CUDA

    Peter Bakkum;Kevin Skadron

  • HotLeakage: A Temperature-Aware Model of Subthreshold and Gate Leakage for Architects

    Yan Zhang;Dharmesh Parikh;Karthik Sankaranarayanan;Kevin Skadron

  • Dynamic Voltage Scaling in Multitier Web Servers with End-to-End Delay Control

    T. Horvath;T. Abdelzaher;K. Skadron;Xue Liu

  • Dynamic warp subdivision for integrated branch and memory divergence tolerance

    Jiayuan Meng;David Tarjan;Kevin Skadron

  • Energy-efficient mechanisms for managing thread context in throughput processors

    Mark Gebhart;Daniel R. Johnson;David Tarjan;Stephen W. Keckler

  • Power-aware QoS management in Web servers

    V. Sharma;A. Thomas;T. Abdelzaher;K. Skadron

  • Recent thermal management techniques for microprocessors

    Joonho Kong;Sung Woo Chung;Kevin Skadron

  • A Case for Thermal-Aware Floorplanning at the Microarchitectural Level

    Karthik Sankaranarayanan;Sivakumar Velusamy;Mircea R. Stan;Kevin Skadron

  • Dynamic Warp Subdivision for Integrated Branch and Memory Divergence Tolerance: Extended Tradeoff Analysis

    Jiayuan Meng;David Tarjan;Kevin Skadron

Frequent Co-Authors

Mircea R. Stan
Mircea R. Stan University of Virginia
Wei Huang
Wei Huang Advanced Micro Devices (Canada)
John Lach
John Lach George Washington University
Margaret Martonosi
Margaret Martonosi Princeton University
Pradip Bose
Pradip Bose IBM (United States)
Douglas W. Clark
Douglas W. Clark Princeton University
David Luebke
David Luebke Nvidia (United States)
David Brooks
David Brooks Harvard University
Scott T. Acton
Scott T. Acton University of Virginia
Alper Buyuktosunoglu
Alper Buyuktosunoglu IBM (United States)

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