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Wei Huang publication distribution in Engineering and Technology in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Engineering and Technology in 2026. The highlighted bar marks where Wei Huang sits on this spectrum.

38–47 publications: 20 scientists 48–57 publications: 35 scientists 58–67 publications: 96 scientists 68–77 publications: 135 scientists 78–87 publications: 190 scientists 88–97 publications: 259 scientists 98–107 publications: 283 scientists 108–117 publications: 369 scientists 118–127 publications: 341 scientists 128–137 publications: 386 scientists 138–147 publications: 372 scientists 148–157 publications: 457 scientists 158–167 publications: 415 scientists 168–177 publications: 407 scientists 178–187 publications: 421 scientists 188–197 publications: 378 scientists 198–207 publications: 403 scientists 208–217 publications: 317 scientists 218–227 publications: 346 scientists 228–237 publications: 321 scientists 238–247 publications: 260 scientists 248–257 publications: 280 scientists 258–267 publications: 240 scientists 268–277 publications: 214 scientists 278–287 publications: 242 scientists 288–297 publications: 203 scientists 298–307 publications: 166 scientists 308–317 publications: 154 scientists 318–327 publications: 175 scientists 328–337 publications: 159 scientists 338–347 publications: 99 scientists 348–357 publications: 131 scientists 358–367 publications: 106 scientists 368–377 publications: 118 scientists 378–387 publications: 97 scientists 388–397 publications: 108 scientists 398–407 publications: 82 scientists 408–417 publications: 71 scientists 418–427 publications: 64 scientists 428–437 publications: 55 scientists 438–447 publications: 54 scientists 448–457 publications: 60 scientists 458–467 publications: 47 scientists 468–477 publications: 40 scientists 478–487 publications: 30 scientists 488–497 publications: 29 scientists 498–507 publications: 38 scientists 508–517 publications: 40 scientists 518–527 publications: 32 scientists 528–537 publications: 23 scientists 538–547 publications: 28 scientists 548–557 publications: 23 scientists 558–567 publications: 19 scientists 568–577 publications: 16 scientists 578–587 publications: 17 scientists 588–597 publications: 18 scientists 598–607 publications: 22 scientists 608–617 publications: 15 scientists 618–627 publications: 9 scientists 628–637 publications: 11 scientists 638–647 publications: 21 scientists 648–657 publications: 12 scientists 658–667 publications: 9 scientists 668–677 publications: 11 scientists 678–687 publications: 9 scientists 688–697 publications: 6 scientists 698–707 publications: 14 scientists 708–717 publications: 7 scientists 718–727 publications: 8 scientists 728–737 publications: 10 scientists 738–747 publications: 9 scientists 748–757 publications: 5 scientists 758–767 publications: 5 scientists 768–777 publications: 11 scientists 778–787 publications: 7 scientists 788–797 publications: 2 scientists 798–803 publications: 4 scientists 804+ publications: 100 scientists
38 publications 804+

The last bar groups every scientist with 804 publications or more.

Wei Huang D-index placement in Engineering and Technology in 2026

The chart shows the D-index (discipline H-index) distribution of Engineering and Technology scientists ranked by Research.com in 2026. The highlighted bar marks where Wei Huang sits on this spectrum.

30 D-Index: 59 scientists 31 D-Index: 114 scientists 32 D-Index: 129 scientists 33 D-Index: 189 scientists 34 D-Index: 200 scientists 35 D-Index: 262 scientists 36 D-Index: 311 scientists 37 D-Index: 312 scientists 38 D-Index: 350 scientists 39 D-Index: 385 scientists 40 D-Index: 348 scientists 41 D-Index: 362 scientists 42 D-Index: 426 scientists 43 D-Index: 380 scientists 44 D-Index: 310 scientists 45 D-Index: 341 scientists 46 D-Index: 301 scientists 47 D-Index: 306 scientists 48 D-Index: 271 scientists 49 D-Index: 246 scientists 50 D-Index: 210 scientists 51 D-Index: 253 scientists 52 D-Index: 213 scientists 53 D-Index: 221 scientists 54 D-Index: 195 scientists 55 D-Index: 186 scientists 56 D-Index: 170 scientists 57 D-Index: 167 scientists 58 D-Index: 166 scientists 59 D-Index: 144 scientists 60 D-Index: 152 scientists 61 D-Index: 141 scientists 62 D-Index: 138 scientists 63 D-Index: 131 scientists 64 D-Index: 118 scientists 65 D-Index: 114 scientists 66 D-Index: 119 scientists 67 D-Index: 95 scientists 68 D-Index: 87 scientists 69 D-Index: 77 scientists 70 D-Index: 89 scientists 71 D-Index: 69 scientists 72 D-Index: 54 scientists 73 D-Index: 46 scientists 74 D-Index: 55 scientists 75 D-Index: 54 scientists 76 D-Index: 49 scientists 77 D-Index: 53 scientists 78 D-Index: 46 scientists 79 D-Index: 28 scientists 80 D-Index: 39 scientists 81 D-Index: 36 scientists 82 D-Index: 24 scientists 83 D-Index: 26 scientists 84 D-Index: 36 scientists 85 D-Index: 18 scientists 86 D-Index: 25 scientists 87 D-Index: 19 scientists 88 D-Index: 26 scientists 89 D-Index: 27 scientists 90 D-Index: 23 scientists 91 D-Index: 15 scientists 92 D-Index: 12 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 13 scientists 97 D-Index: 13 scientists 98 D-Index: 9 scientists 99 D-Index: 7 scientists 100 D-Index: 7 scientists 101 D-Index: 8 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 9 scientists 105 D-Index: 6 scientists 106 D-Index: 9 scientists 107+ D-Index: 99 scientists
30 D-Index 107+

The last bar groups every scientist with 107 D-Index or more.

Overview

Wei Huang is affiliated with Advanced Micro Devices (Canada) and has contributed to research primarily in the field of Engineering, with a focus on Electrical and Electronic Engineering, Transportation, Materials Chemistry, Global and Planetary Change, and Building and Construction.

The main topics of Wei Huang's research include:

  • Perovskite Materials and Applications
  • Land Use and Ecosystem Services
  • Urban Transport and Accessibility
  • MXene and MAX Phase Materials
  • Wildlife-Road Interactions and Conservation
  • Conservation, Biodiversity, and Resource Management
  • E-commerce and Technology Innovations

Recent papers by Wei Huang cover diverse subjects and publication venues, illustrating a multidisciplinary approach:

  • "Tetrabutylammonium Hydroxide-Functionalized Ti3C2Tx MXene for Significantly Improving the Photovoltaic Performance of Perovskite Solar Cells," 2024, ACS Applied Materials & Interfaces
  • "Construction and optimization of ecological security patterns based on social equity perspective: A case study in Wuhan, China," 2022, Ecological Indicators
  • "Spatial Pattern and Mechanism of the Life Service Industry in Polycentric Cities: Experience from Wuhan, China," 2023, Journal of Urban Planning and Development
  • "Exploring the spatiotemporal evolution mechanism of rural e-commerce: insights from the experience of Taobao towns in China," 2024, Humanities and Social Sciences Communications
  • "Investigating spatial patterns and determinants of tourist attractions utilizing POI data: A case study of Hubei Province, China," 2024, Heliyon

Wei Huang's frequent coauthors include:

  • Xufeng Cui
  • Jixin Yang
  • Jing Zhang
  • Yuehua Jiang
  • Ping Cai

Their work has been published in several journals, with multiple contributions to the International Journal of Wireless and Mobile Computing, alongside publications in Ecological Indicators, Humanities and Social Sciences Communications, Heliyon, and ACS Applied Materials & Interfaces.

Best Publications

  • Temperature-aware microarchitecture

    Kevin Skadron;Mircea R. Stan;Wei Huang;Sivakumar Velusamy

  • HotSpot: a compact thermal modeling methodology for early-stage VLSI design

    Wei Huang;S. Ghosh;S. Velusamy;K. Sankaranarayanan

  • Temperature-aware microarchitecture: Modeling and implementation

    Kevin Skadron;Mircea R. Stan;Karthik Sankaranarayanan;Wei Huang

  • A case for high performance computing with virtual machines

    Wei Huang;Jiuxing Liu;Bulent Abali;Dhabaleswar K. Panda

  • Compact thermal modeling for temperature-aware design

    Wei Huang;M.R. Stan;K. Skadron;K. Sankaranarayanan

  • High performance virtual machine migration with RDMA over modern interconnects

    Wei Huang;Qi Gao;Jiuxing Liu;D.K. Panda

  • Virtual machine aware communication libraries for high performance computing

    Wei Huang;Matthew J. Koop;Qi Gao;Dhabaleswar K. Panda

  • Scaling with Design Constraints: Predicting the Future of Big Chips

    Wei Huang;Karthick Rajamani;Mircea R. Stan;Kevin Skadron

  • Accurate, Pre-RTL Temperature-Aware Design Using a Parameterized, Geometric Thermal Model

    Wei Huang;K. Sankaranarayanan;K. Skadron;R.J. Ribando

  • Temperature-aware computer systems: Opportunities and challenges

    K. Skadron;M.R. Stan;Wei Huang;S. Velusamy

  • HotSpot: a Dynamic Compact Thermal Model at the Processor-Architecture Level

    Mircea R. Stan;Kevin Skadron;Marco Barcella;Wei Huang

  • Monitoring temperature in FPGA based SoCs

    S. Velusamy;Wei Huang;J. Lach;M. Stan

  • Many-core design from a thermal perspective

    Wei Huang;Mircea R. Stant;Karthik Sankaranarayanan;Robert J. Ribando

  • PPEP: Online Performance, Power, and Energy Prediction Framework and DVFS Space Exploration

    Bo Su;Junli Gu;Li Shen;Wei Huang

  • TAPO: Thermal-aware power optimization techniques for servers and data centers

    Wei Huang;Malcolm Allen-Ware;John B. Carter;Elmootazbellah Elnozahy

  • Temperature-Aware Microarchitecture: Extended Discussion and Results

    Kevin Skadron;Mircea R. Stan;Wei Huang;Sivakumar Velusamy

  • Differentiating the roles of IR measurement and simulation for power and temperature-aware design

    Wei Huang;Kevin Skadron;Sudhanva Gurumurthi;Robert J. Ribando

  • Interconnect lifetime prediction under dynamic stress for reliability-aware design

    Zhijian Lu;Wei Huang;J. Lach;M. Stan

  • Design and Analysis of an APU for Exascale Computing

    Thiruvengadam Vijayaraghavany;Yasuko Eckert;Gabriel H. Loh;Michael J. Schulte

  • Analytical model for sensor placement on microprocessors

    Kyeong-Jae Lee;K. Skadron;W. Huang

Frequent Co-Authors

Kevin Skadron
Kevin Skadron University of Virginia
Mircea R. Stan
Mircea R. Stan University of Virginia
John Lach
John Lach George Washington University
Sudhanva Gurumurthi
Sudhanva Gurumurthi Advanced Micro Devices (United States)
Wayne Burleson
Wayne Burleson University of Massachusetts Amherst
Hendrik F. Hamann
Hendrik F. Hamann IBM (United States)
Alper Buyuktosunoglu
Alper Buyuktosunoglu IBM (United States)
David H. Albonesi
David H. Albonesi Cornell University
Lixin Zhang
Lixin Zhang East China University of Science and Technology

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