2026 Wei Huang: Engineering and Technology Researcher – H-Index, Publications & Awards

Overview

Wei Huang is affiliated with Advanced Micro Devices (Canada) and has contributed to research primarily in the field of Engineering, with a focus on Electrical and Electronic Engineering, Transportation, Materials Chemistry, Global and Planetary Change, and Building and Construction.

The main topics of Wei Huang's research include:

Perovskite Materials and Applications
Land Use and Ecosystem Services
Urban Transport and Accessibility
MXene and MAX Phase Materials
Wildlife-Road Interactions and Conservation
Conservation, Biodiversity, and Resource Management
E-commerce and Technology Innovations

Recent papers by Wei Huang cover diverse subjects and publication venues, illustrating a multidisciplinary approach:

"Tetrabutylammonium Hydroxide-Functionalized Ti₃C₂T_x MXene for Significantly Improving the Photovoltaic Performance of Perovskite Solar Cells," 2024, ACS Applied Materials & Interfaces
"Construction and optimization of ecological security patterns based on social equity perspective: A case study in Wuhan, China," 2022, Ecological Indicators
"Spatial Pattern and Mechanism of the Life Service Industry in Polycentric Cities: Experience from Wuhan, China," 2023, Journal of Urban Planning and Development
"Exploring the spatiotemporal evolution mechanism of rural e-commerce: insights from the experience of Taobao towns in China," 2024, Humanities and Social Sciences Communications
"Investigating spatial patterns and determinants of tourist attractions utilizing POI data: A case study of Hubei Province, China," 2024, Heliyon

Wei Huang's frequent coauthors include:

Xufeng Cui
Jixin Yang
Jing Zhang
Yuehua Jiang
Ping Cai

Their work has been published in several journals, with multiple contributions to the International Journal of Wireless and Mobile Computing, alongside publications in Ecological Indicators, Humanities and Social Sciences Communications, Heliyon, and ACS Applied Materials & Interfaces.

Best Publications

Temperature-aware microarchitecture

Kevin Skadron;Mircea R. Stan;Wei Huang;Sivakumar Velusamy

1654
Citations
HotSpot: a compact thermal modeling methodology for early-stage VLSI design

Wei Huang;S. Ghosh;S. Velusamy;K. Sankaranarayanan

1320
Citations
Temperature-aware microarchitecture: Modeling and implementation

Kevin Skadron;Mircea R. Stan;Karthik Sankaranarayanan;Wei Huang

977
Citations
A case for high performance computing with virtual machines

Wei Huang;Jiuxing Liu;Bulent Abali;Dhabaleswar K. Panda

458
Citations
Compact thermal modeling for temperature-aware design

Wei Huang;M.R. Stan;K. Skadron;K. Sankaranarayanan

445
Citations
High performance virtual machine migration with RDMA over modern interconnects

Wei Huang;Qi Gao;Jiuxing Liu;D.K. Panda

186
Citations
Virtual machine aware communication libraries for high performance computing

Wei Huang;Matthew J. Koop;Qi Gao;Dhabaleswar K. Panda

178
Citations
Scaling with Design Constraints: Predicting the Future of Big Chips

Wei Huang;Karthick Rajamani;Mircea R. Stan;Kevin Skadron

167
Citations
Accurate, Pre-RTL Temperature-Aware Design Using a Parameterized, Geometric Thermal Model

Wei Huang;K. Sankaranarayanan;K. Skadron;R.J. Ribando

159
Citations
Temperature-aware computer systems: Opportunities and challenges

K. Skadron;M.R. Stan;Wei Huang;S. Velusamy

155
Citations
HotSpot: a Dynamic Compact Thermal Model at the Processor-Architecture Level

Mircea R. Stan;Kevin Skadron;Marco Barcella;Wei Huang

154
Citations
Monitoring temperature in FPGA based SoCs

S. Velusamy;Wei Huang;J. Lach;M. Stan

153
Citations
Many-core design from a thermal perspective

Wei Huang;Mircea R. Stant;Karthik Sankaranarayanan;Robert J. Ribando

143
Citations
PPEP: Online Performance, Power, and Energy Prediction Framework and DVFS Space Exploration

Bo Su;Junli Gu;Li Shen;Wei Huang

108
Citations
TAPO: Thermal-aware power optimization techniques for servers and data centers

Wei Huang;Malcolm Allen-Ware;John B. Carter;Elmootazbellah Elnozahy

107
Citations
Temperature-Aware Microarchitecture: Extended Discussion and Results

Kevin Skadron;Mircea R. Stan;Wei Huang;Sivakumar Velusamy

107
Citations
Differentiating the roles of IR measurement and simulation for power and temperature-aware design

Wei Huang;Kevin Skadron;Sudhanva Gurumurthi;Robert J. Ribando

105
Citations
Interconnect lifetime prediction under dynamic stress for reliability-aware design

Zhijian Lu;Wei Huang;J. Lach;M. Stan

96
Citations
Design and Analysis of an APU for Exascale Computing

Thiruvengadam Vijayaraghavany;Yasuko Eckert;Gabriel H. Loh;Michael J. Schulte

86
Citations
Analytical model for sensor placement on microprocessors

Kyeong-Jae Lee;K. Skadron;W. Huang

73
Citations

Frequent Co-Authors

Kevin Skadron University of Virginia

Mircea R. Stan University of Virginia

John Lach George Washington University

Sudhanva Gurumurthi Advanced Micro Devices (United States)

Wayne Burleson University of Massachusetts Amherst

Hendrik F. Hamann IBM (United States)

Alper Buyuktosunoglu IBM (United States)

David H. Albonesi Cornell University

Lixin Zhang East China University of Science and Technology

External Links

Personal website of Wei Huang

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Wei Huang

Overview

Best Publications

Temperature-aware microarchitecture

HotSpot: a compact thermal modeling methodology for early-stage VLSI design

Temperature-aware microarchitecture: Modeling and implementation

A case for high performance computing with virtual machines

Compact thermal modeling for temperature-aware design

High performance virtual machine migration with RDMA over modern interconnects

Virtual machine aware communication libraries for high performance computing

Scaling with Design Constraints: Predicting the Future of Big Chips

Accurate, Pre-RTL Temperature-Aware Design Using a Parameterized, Geometric Thermal Model

Temperature-aware computer systems: Opportunities and challenges

HotSpot: a Dynamic Compact Thermal Model at the Processor-Architecture Level

Monitoring temperature in FPGA based SoCs

Many-core design from a thermal perspective

PPEP: Online Performance, Power, and Energy Prediction Framework and DVFS Space Exploration

TAPO: Thermal-aware power optimization techniques for servers and data centers

Temperature-Aware Microarchitecture: Extended Discussion and Results

Differentiating the roles of IR measurement and simulation for power and temperature-aware design

Interconnect lifetime prediction under dynamic stress for reliability-aware design

Design and Analysis of an APU for Exascale Computing

Analytical model for sensor placement on microprocessors

Frequent Co-Authors

External Links

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