Joseph H. Hotchkiss is affiliated with Cornell University in the United States. Their research primarily spans the field of Engineering, with a particular focus on Electrical and Electronic Engineering and Mechanical Engineering. The scientist's work covers several key topics, including Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, and Intermetallics and Advanced Alloy Properties.
Their publication record includes papers in notable venues such as the Journal of Electronic Materials. One highlighted recent paper is titled "Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures", published in 2020 in the Journal of Electronic Materials. This publication has accumulated citations reflecting its engagement within the research community.
Joseph H. Hotchkiss collaborates regularly with several co-authors. Frequent collaborators include:
Their research contributions are visible primarily within the context of interdisciplinary engineering, bridging elements of electrical and mechanical engineering to address challenges in microstructure evolution, advanced alloy properties, and packaging technologies in electronics.
Paola Appendini;Joseph H. Hotchkiss
Julie M. Goddard;J.H. Hotchkiss
Rui Hai Liu;Joseph H. Hotchkiss
Paola Appendini;Joseph H. Hotchkiss
Joseph H. Hotchkiss
Yen-Jen Sung;Joseph H. Hotchkiss;Richard E. Austic;Rodney R. Dietert
Everett D. Dudley;Joseph H. Hotchkiss
N.F.F. Soares;J.H. Hotchkiss
Joseph H. Hotchkiss;Brenda G. Werner;Edmund Y.C. Lee
Yih-Ming Weng;Joseph H. Hotchkiss
P. Appendini;J. H. Hotchkiss
Joseph H. Hotchkiss
J H Hotchkiss
Linda Wimpfheimer;Naomi S. Altman;Joseph H. Hotchkiss
Yih-Ming Weng;Joseph H. Hotchkiss
O. Y. Kwapong;J. H. Hotchkiss
Gurbuz Gunes;Lisa K Blum;Joseph H Hotchkiss
K.B. Shapiro;J.H. Hotchkiss;D.A. Roe
Carolyn B. Hintlian;Joseph H. Hotchkiss
Rui Hai Liu;James R. Jacob;Bud C. Tennant;Joseph H. Hotchkiss
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