Jipeng Cheng is affiliated with Zhejiang University in China and has a significant body of work in the fields of engineering and materials science. Their research primarily focuses on electrical and electronic engineering, electronic, optical and magnetic materials, renewable energy, sustainability and the environment, materials chemistry, and automotive engineering.
The main topics of their research include advancements in battery materials, supercapacitor materials and fabrication, advanced battery technologies, electrocatalysts for energy conversion, and electrochemical sensors and biosensors.
Jipeng Cheng has contributed to numerous publications with a focus on supercapacitor materials and related technologies. Examples of their recent papers include:
In addition to these, other related works that appear in the collection include papers published in venues such as the Journal of Colloid and Interface Science, ACS Omega, and Journal of Electroanalytical Chemistry, highlighting the ongoing engagement with materials for energy storage and conversion.
Jipeng Cheng frequently collaborates with a range of co-authors, including:
Their publication record shows contributions to several scientific journals and platforms, notably:
This diverse set of publication venues reflects a research profile centered on materials science and engineering applications, particularly in energy technologies.
M. Li;J.P. Cheng;J. Wang;F. Liu
J. Zhang;F. Liu;J. P. Cheng;X. B. Zhang
Yabin Zhang;Ben Wang;Fu Liu;Jipeng Cheng
J.M. Xu;J.P. Cheng
WenQiang Chen;Jiao Wang;K.Y. Ma;M. Li
Jihong Fang;Min Li;Qianqian Li;Weifeng Zhang
Fu Liu;Xiaobin Zhang;Jipeng Cheng;Jiangpin Tu
Yu Li;Xiaobin Zhang;Junhang Luo;Wanzhen Huang
Qianqian Li;Heguang Liu;Zhenpeng Yao;Jipeng Cheng
J. P. Cheng;J. Zhang;F. Liu
Chuhan Sha;Bin Lu;Hongying Mao;Jipeng Cheng
J.P. Cheng;B.B. Wang;M.G. Zhao;F. Liu
Min Li;K.Y. Ma;J.P. Cheng;Danhui Lv
Weifeng Zhang;Chao Ma;Jihong Fang;Jipeng Cheng
Qingliang Shou;Jipeng Cheng;Li Zhang;Bradley J. Nelson
Sai Bai;Motao Cao;Yizheng Jin;Xinliang Dai
J.P. Cheng;Jiao Wang;Q.Q. Li;H.G. Liu
X.Y. Tao;X.B. Zhang;L. Zhang;J.P. Cheng
J.P. Cheng;L. Liu;J. Zhang;F. Liu
Min Li;Fu Liu;J.P. Cheng;J. Ying
J. P. Cheng;J. P. Cheng;X. Chen;Jin Song Wu;F. Liu
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University of Helsinki
Nanyang Technological University
University of California, Los Angeles
University of Washington
University of Kansas
Sapienza University of Rome
University of Milan
Georgia Institute of Technology
Heidelberg University
Institut de Physique du Globe de Paris
University of Illinois at Urbana-Champaign
Microsoft Research Asia (China)
Carnegie Mellon University
University of Gothenburg
Harvard University
Rutgers, The State University of New Jersey
