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D-Index & Metrics

Electronics and Electrical Engineering

D-Index
38
Citations
6968
World Ranking
4858
National Ranking
1699

Overview

Donald S. Gardner is affiliated with Intel in the United States. Their professional work is primarily situated within this organization, reflecting a connection to the technology and semiconductor industry.

While detailed records of Gardner's recent papers or collaborations are not available, the absence of listed frequent co-authors and publication venues suggests a profile focused perhaps more on industry-related research or internal development rather than extensive academic publishing.

There are no specific details on Gardner's main fields or subfields of study, nor on particular research topics. Similarly, no book publications or awards have been documented in the provided data.

This lack of publicly accessible detailed bibliographic or research topic information indicates that Gardner's contributions might be more oriented toward applied research or development projects within Intel, rather than widely published academic research.

The neutral perspective on Gardner's career highlights affiliation and institutional context without extrapolation beyond the given data.

Best Publications

  • Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history

    P.A. Flinn;D.S. Gardner;W.D. Nix

  • A 233-MHz 80%-87% efficient four-phase DC-DC converter utilizing air-core inductors on package

    P. Hazucha;G. Schrom;Jaehong Hahn;B.A. Bloechel

  • Review of On-Chip Inductor Structures With Magnetic Films

    D.S. Gardner;G. Schrom;F. Paillet;B. Jamieson

  • METHOD OF FORMING INTERCONNECT CHANNEL ON SEMICONDUCTOR SUBSTRATE

    Mu Xiao-Chun;Sivaram Srinivasan;Gardner Donald S;Fraser David B

  • Mechanical stress as a function of temperature in aluminum films

    D.S. Gardner;P.A. Flinn

  • Embedded ground plane and shielding structures using sidewall insulators in high frequency circuits having vias

    Donald S. Gardner

  • Integrated on-chip inductors using magnetic material (invited)

    Donald S. Gardner;Gerhard Schrom;Peter Hazucha;Fabrice Paillet

  • Integrated On-Chip Inductors with Magnetic Films

    D.S. Gardner;G. Schrom;P. Hazucha;F. Paillet

  • A 480-MHz, multi-phase interleaved buck DC-DC converter with hysteretic control

    G. Schrom;P. Hazucha;J. Hahn;D.S. Gardner

  • Layered and homogeneous films of aluminum and aluminum/silicon with titanium and tungsten for multilevel interconnects

    D.S. Gardner;T.L. Michalka;K.C. Saraswat;T.W. Barbee

  • Integrated On-Chip Inductors With Magnetic Films

    D.S. Gardner;G. Schrom;P. Hazucha;F. Paillet

  • Interconnection and electromigration scaling theory

    D.S. Gardner;J.D. Meindl;K.C. Saraswat

  • A 100MHz Eight-Phase Buck Converter Delivering 12A in 25mm2 Using Air-Core Inductors

    G. Schrom;P. Hazucha;F. Paillet;D. J. Rennie

  • QED: Quick Error Detection tests for effective post-silicon validation

    Ted Hong;Yanjing Li;Sung-Boem Park;Diana Mui

  • High-frequency microinductors with amorphous magnetic ground planes

    A.M. Crawford;D. Gardner;S.X. Wang

  • Observations of electromigration induced void nucleation and growth in polycrystalline and near-bamboo passivated Al lines

    T. Marieb;P. Flinn;J. C. Bravman;D. Gardner

  • Barrier against metal diffusion

    Donald S. Gardner

  • Overcoming Early-Life Failure and Aging for Robust Systems

    Yanjing Li;Young Moon Kim;E. Mintarno;D.S. Gardner

  • Feasibility of monolithic and 3D-stacked DC-DC converters for microprocessors in 90nm technology generation

    Gerhard Schrom;Peter Hazucha;Jae-Hong Hahn;Volkan Kursun

  • Design techniques for cross-layer resilience

    Nicholas P. Carter;Helia Naeimi;Donald S. Gardner

Frequent Co-Authors

Tanay Karnik
Tanay Karnik Intel (United States)
Cary L. Pint
Cary L. Pint Iowa State University
Siva G. Narendra
Siva G. Narendra Tyfone, Inc.
Vivek De
Vivek De Intel (United States)
Terence O'Donnell
Terence O'Donnell University College Dublin
Shekhar Borkar
Shekhar Borkar Qualcomm (United States)
Krishna C. Saraswat
Krishna C. Saraswat Stanford University
James D. Meindl
James D. Meindl Georgia Institute of Technology
Volkan Kursun
Volkan Kursun Bilkent University
Chunlei Wang
Chunlei Wang Florida International University

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