World's Best Scientists 2026 revealed!

D-Index & Metrics

Computer Science

D-Index
47
Citations
7752
World Ranking
6568
National Ranking
2904

Research.com Recognitions

  • 2017 - IEEE Fellow For contributions to 3D integrated circuits and computer architecture
  • 2009 - ACM Senior Member

Overview

Hsien-Hsin S. Lee is affiliated with Intel in the United States and has produced a significant volume of research primarily within the fields of Computer Science and Engineering.

Their work spans several focused subfields, including:

  • Electrical and Electronic Engineering
  • Artificial Intelligence
  • Computer Networks and Communications
  • Information Systems
  • Computer Vision and Pattern Recognition

Research topics frequently addressed by this scientist include:

  • Advanced Memory and Neural Computing
  • Green IT and Sustainability
  • Privacy-Preserving Technologies in Data
  • Ferroelectric and Negative Capacitance Devices
  • Caching and Content Delivery
  • Mobile Crowdsensing and Crowdsourcing
  • Stochastic Gradient Optimization Techniques

Hsien-Hsin S. Lee's scholarship has been published predominantly in IEEE Micro and arXiv (Cornell University), with additional contributions in Nano Energy and ACS Applied Electronic Materials. Specific papers from recent years include:

  • "Sustainable AI: Environmental Implications, Challenges and Opportunities," 2021, arXiv (Cornell University)
  • "Near-Memory Processing in Action: Accelerating Personalized Recommendation With AxDIMM," 2021, IEEE Micro
  • "Chasing Carbon: The Elusive Environmental Footprint of Computing," 2022, IEEE Micro
  • "DeepRecSys: A System for Optimizing End-To-End At-scale Neural Recommendation Inference," 2020, arXiv (Cornell University)
  • "Exploring Memory-Oriented Design Optimization of Edge AI Hardware for Extended Reality Applications," 2023, IEEE Micro

Frequent collaborators include Udit Gupta, Carole-Jean Wu, Gu-Yeon Wei, David J. Brooks, and Kiwan Maeng.

Recognition in the professional community includes designation as an IEEE Fellow in 2017 for contributions to 3D integrated circuits and computer architecture and as an ACM Senior Member since 2009.

Best Publications

  • Test Challenges for 3D Integrated Circuits

    H.-H.S. Lee;K. Chakrabarty

  • An optimized 3D-stacked memory architecture by exploiting excessive, high-density TSV bandwidth

    Dong Hyuk Woo;Nak Hee Seong;Dean L. Lewis;Hsien-Hsin S. Lee

  • Sustainable AI: Environmental Implications, Challenges and Opportunities.

    Carole-Jean Wu;Ramya Raghavendra;Udit Gupta;Bilge Acun

  • Extending Amdahl's Law for Energy-Efficient Computing in the Many-Core Era

    Dong Hyuk Woo;H.-H.S. Lee

  • Security refresh: prevent malicious wear-out and increase durability for phase-change memory with dynamically randomized address mapping

    Nak Hee Seong;Dong Hyuk Woo;Hsien-Hsin S. Lee

  • Smart Refresh: An Enhanced Memory Controller Design for Reducing Energy in Conventional and 3D Die-Stacked DRAMs

    Mrinmoy Ghosh;Hsien-Hsin S. Lee

  • Adaptive transaction scheduling for transactional memory systems

    Richard M. Yoo;Hsien-Hsin S. Lee

  • Parasitic capacitance extraction for FinFETs

    Chia-Ming Ho;Ke-Ying Su;Hsiao-Shu Chao;Yi-Kan Cheng

  • Chasing Carbon: The Elusive Environmental Footprint of Computing

    Udit Gupta;Young Geun Kim;Sylvia Lee;Jordan Tse

  • The Architectural Implications of Facebook's DNN-Based Personalized Recommendation

    Udit Gupta;Carole-Jean Wu;Xiaodong Wang;Maxim Naumov

  • SAFER: Stuck-At-Fault Error Recovery for Memories

    Nak Hee Seong;Dong Hyuk Woo;Vijayalakshmi Srinivasan;Jude A. Rivers

  • 3D-MAPS: 3D Massively parallel processor with stacked memory

    Dae Hyun Kim;Krit Athikulwongse;Michael Healy;Mohammad Hossain

  • RecNMP: accelerating personalized recommendation with near-memory processing

    Liu Ke;Udit Gupta;Benjamin Youngjae Cho;David Brooks

  • Eager writeback - a technique for improving bandwidth utilization

    Hsien-Hsin S. Lee;Gary S. Tyson;Matthew K. Farrens

  • DeepRecSys: a system for optimizing end-to-end at-scale neural recommendation inference

    Udit Gupta;Samuel Hsia;Vikram Saraph;Xiaodong Wang

  • High Efficiency Counter Mode Security Architecture via Prediction and Precomputation

    Weidong Shi;Hsien-Hsin S. Lee;Mrinmoy Ghosh;Chenghuai Lu

  • A scanisland based design enabling prebond testability in die-stacked microprocessors

    D.L. Lewis;H.-H.S. Lee

  • Multiobjective Microarchitectural Floorplanning for 2-D and 3-D ICs

    M. Healy;M. Vittes;M. Ekpanyapong;C.S. Ballapuram

  • SODA: A High-Performance DSP Architecture for Software-Defined Radio

    Y. Lin;H. Lee;M. Woh;Y. Harel

  • Eager writeback-a technique for improving bandwidth utilization

    Unknown

  • Architectural evaluation of 3D stacked RRAM caches

    Dean L. Lewis;Hsien-Hsin S. Lee

  • The Architectural Implications of Facebook's DNN-based Personalized Recommendation

    Udit Gupta;Carole-Jean Wu;Xiaodong Wang;Maxim Naumov

Frequent Co-Authors

Sung Kyu Lim
Sung Kyu Lim Georgia Institute of Technology
Weidong Shi
Weidong Shi Jiangsu University
David Brooks
David Brooks Harvard University
Carole-Jean Wu
Carole-Jean Wu Meta Platforms, Inc.
Gu-Yeon Wei
Gu-Yeon Wei Harvard University
Mikhail Smelyanskiy
Mikhail Smelyanskiy Nvidia (United States)
Gabriel H. Loh
Gabriel H. Loh Advanced Micro Devices (United States)
Kim Hazelwood
Kim Hazelwood Facebook (United States)
Marek Chrobak
Marek Chrobak University of California, Riverside
Youtao Zhang
Youtao Zhang University of Pittsburgh

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