The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where David R. Smith sits on this spectrum.
This scientist: 748 publications — 95th percentile
95% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 1,065 publications or more.
The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where David R. Smith sits on this spectrum.
This scientist: 127 D-Index — 99th percentile
99% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 111 D-Index or more.
David R. Smith is affiliated with Duke University in the United States, focusing primarily on the field of Engineering. Their research spans multiple subfields, including Aerospace Engineering, Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Biomedical Engineering, and Atomic and Molecular Physics, and Optics.
Their scientific contributions cover a range of topics, notably:
David R. Smith has published in various esteemed venues, with a significant number of their works appearing in:
Frequent collaborators include Mohammadreza F. Imani, Insang Yoo, Aaron V. Diebold, Michael Boyarsky, and Zhongzhu Liang, reflecting ongoing research partnerships.
Some recent publications exemplify the scope of their research:
David R. Smith has been recognized with awards including the designation as a Fellow of the National Academy of Inventors in 2016 and as an OSA Fellow in 2013 for work related to negative refractive index demonstration, transformation optics, electromagnetic cloaking, and contributions to metamaterials and plasmonic media design and analysis.
R. A. Shelby;D. R. Smith;S. Schultz
D. R. Smith;Willie J. Padilla;D. C. Vier;S. C. Nemat-Nasser
J. B. Pendry;D. Schurig;D. R. Smith
D. Schurig;J. J. Mock;B. J. Justice;S. A. Cummer
N. I. Landy;S. Sajuyigbe;J. J. Mock;D. R. Smith
D. R. Smith;J. B. Pendry;M. C. K. Wiltshire
D. R. Smith;S. Schultz;P. Markoš;C. M. Soukoulis
D. R. Smith;D. R. Smith;D. C. Vier;Th. Koschny;Th. Koschny;C. M. Soukoulis;C. M. Soukoulis
C. L. Holloway;E. F. Kuester;J. A. Gordon;J. O'Hara
J. J. Mock;M. Barbic;D. R. Smith;D. A. Schultz
T. J. Yen;T. J. Yen;T. J. Yen;W. J. Padilla;W. J. Padilla;W. J. Padilla;N. Fang;N. Fang;N. Fang;D. C. Vier;D. C. Vier;D. C. Vier
K.-H. Su;Q.-H. Wei;X. Zhang;J. J. Mock
R. Liu;C. Ji;J. J. Mock;J. Y. Chin
David R. Smith;Norman Kroll
D. R. Smith;D. Schurig
R. A. Shelby;D. R. Smith;S. C. Nemat-Nasser;S. Schultz
Sheldon Schultz;David R. Smith;Jack J. Mock;David A. Schultz
C. Ciracì;R. T. Hill;J. J. Mock;Y. Urzhumov
Jack J. Mock;David R. Smith;Sheldon Schultz
Gleb M. Akselrod;Christos Argyropoulos;Thang B. Hoang;Cristian Ciracì;Cristian Ciracì
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