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IEEE

International Conference on Electronics Packaging (ICEP)

Location: Kyushu , Japan

Conference dates: 4/19/2023 - 4/22/2023

Research H-index
4

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Materials Science 57 21 81 4
Electronics and Electrical Engineering 657 9 16 3
Engineering and Technology 575 6 7 1

Call for Papers

Major Topics
Advanced Packaging
  -2.5/3D, TSV/TGV
  -Substrates/interposers
  -Fan-out/in packaging
  -Wafer/panel level packaging
  -Automotive and IoT applications
  -High performance computing
  -Heterogeneous integration technologies
  -Chiplet packaging
  -Other related technologies
Design, Modeling, and Reliability
  -2.5/3D, TSV/TGV, WCSP, Fan-out/in
  -Advanced reliability evaluation (PDfR etc.)
  -High performance board design
  -Novel test methods and life models (LCA, TCAD etc.)
  -Other related technologies
Emerging Technologies
  -Health/medical care and cosmetics devices
  -Stretchable/flexible electronics
  -Sensor and MEMS/NEMS/MOEMS packaging
  -Batteries and eco-friendly devices
  -Advanced MEMS/NEMS/MOEMS technologies
  -Packaging for quantum computing
  -Other related technologies
High-Speed, Wireless & Components
  -3D-printed components
  -Antennas, RFs, and sensor modules
  -Highspeed applications (5G, LTE etc.)
  -Automotive and IoT applications
  -Other related technologies
Thermal Management
  -Advanced cooling technologies
  -Thermal management structures (heat sinks, pipes etc.)
  -Simulation, measurement, and evaluation methods
  -Other related technologies
Interconnections
  -Interconnection methods (flip-chip, wire-bonding etc.)
  -2.5/3D, TSV/TGV, fan-out/in interconnections
  -Embedded systems
  -Power electronics interconnections
  -Bio/medical and eco-friendly devices
  -Other related technologies
Materials and Processes
  -Homo/heterogeneous bonding/assembly
  -Substrates, interposers and panels
  -Metallic materials & processes (plating, soldering etc.)
  -Organic semiconductors (OLED, OFET, OPV etc.)
  -Power electronic/battery materials & processes
  -Optoelectronic materials & processes
  -Additive manufacturing (compound, paste, 3D printing etc.)
  -Other related technologies
Optoelectronics
  -3D/silicon photonics technologies
  -Optical connectors, waveguides, & transceivers
  -Device fabrication (LED, laser, sensor etc.)
  -Mid/on- board module fabrication
  -Optical wafer/chip-scale packaging
  -Other related technologies
Power Electronics
  -Power device and module fabrication (HEMT,diode, IPM etc.)
  -Advanced Inverter & converter
  -Super capacitor
  -Harsh environment tolerant device & module
  -Si-based MOSFET, BJT, IGBT
  -Other relating technologies
Other Upcoming Technologies
  -New system concept & design
  -Any other topics related to ICEP scope

Overview

The ranking presented on this page offers a comprehensive evaluation of scientific conferences in the field of Engineering and Technology, meticulously prepared to assist the academic community in identifying events of the highest scientific relevance. This effort is the result of in-depth research conducted by Research.com, one of the leading websites dedicated to science research across all major fields, including Engineering and Technology. Since 2014, Research.com has been a trusted source of accurate and authoritative data on scientific contributions worldwide.

Conference positions in the ranking are determined by a unique bibliometric score developed by Research.com. This score is calculated using a combination of the estimated h-index and the number of leading scientists who have participated in each conference over the past three years. Such an approach ensures a balanced assessment of both the prominence of scientific contributions and the regular participation of top-tier researchers.

The Impact Score values utilized in this ranking were systematically gathered as of 2024-11-27. The comprehensive process involved in developing the ranking commenced with the careful review of more than 2,262 conferences. These conferences were selected following a rigorous inspection and examination of over 26,934 scientific documents published within the last three years by 9,385 distinguished and well-respected scientists specializing in Engineering and Technology.

This ranking reflects the dedication of our expert team to maintaining a high standard of methodological rigor, drawing on extensive bibliometric analysis and a multi-faceted approach to conference evaluation. For those interested in learning more about the methodology employed in calculating the ranking scores, we invite you to visit our Methodology Page, where detailed information is provided regarding the analytical framework and procedures that underpin this authoritative ranking.

Papers citation over time

A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

The top authors publishing at International Conference on Electronics Packaging (based on the number of publications) are:

  • Tadatomo Suga (21 papers) published 2 papers at the last edition, 1 less than at the previous edition,
  • Jenn-Ming Song (17 papers) published 2 papers at the last edition, 2 less than at the previous edition,
  • Masaru Ishizuka (16 papers) absent at the last edition,
  • Tomoyuki Hatakeyama (16 papers) absent at the last edition,
  • Katsuaki Suganuma (15 papers) published 2 papers at the last edition, 1 less than at the previous edition.

The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.

Only papers with recognized affiliations are considered

The top affiliations publishing at International Conference on Electronics Packaging (based on the number of publications) are:

  • Osaka University (43 papers) published 11 papers at the last edition, 4 more than at the previous edition,
  • National Institute of Advanced Industrial Science and Technology (34 papers) published 7 papers at the last edition, 3 more than at the previous edition,
  • University of Tokyo (28 papers) published 1 paper at the last edition, 3 less than at the previous edition,
  • I-Shou University (25 papers) published 2 papers at the last edition, 1 less than at the previous edition,
  • National Chung Hsing University (22 papers) published 4 papers at the last edition, 1 more than at the previous edition.

The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

During the most recent 2021 edition, 13.68% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 40.24% were posted by at least one author from the top 10 institutions publishing at the conference. Another 13.41% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 24.39% of all publications and 21.95% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

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