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D-Index & Metrics

Electronics and Electrical Engineering

D-Index
35
Citations
5694
World Ranking
5520
National Ranking
1892

Overview

Janusz Grzyb is affiliated with Indie Semiconductor in the United States and has contributed to the fields of engineering and physics and astronomy through a variety of research focused primarily on electrical and electronic engineering.

Their research concentrates on topics including:

  • Radio Frequency Integrated Circuit Design
  • Microwave Engineering and Waveguides
  • Superconducting and THz Device Technology
  • Terahertz Technology and Applications
  • Photonic and Optical Devices
  • Millimeter-Wave Propagation and Modeling
  • Advanced Power Amplifier Design

Frequent collaborators in their research have been:

  • Ullrich R. Pfeiffer
  • Pedro Rodríguez-Vázquez
  • B. Heinemann
  • Ritesh Jain
  • Marcel Andree

They have published works primarily in the following venues:

  • IEEE Transactions on Microwave Theory and Techniques
  • IEEE Transactions on Terahertz Science and Technology
  • IEEE Journal of Solid-State Circuits
  • Journal of Infrared Millimeter and Terahertz Waves
  • 2022 47th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz)

Notable recent papers authored or co-authored by Janusz Grzyb include:

  • A QPSK 110-Gb/s Polarization-Diversity MIMO Wireless Link With a 220-255 GHz Tunable LO in a SiGe HBT Technology, 2020, IEEE Transactions on Microwave Theory and Techniques
  • A Broadband 300 GHz Power Amplifier in a 130 nm SiGe BiCMOS Technology for Communication Applications, 2022, IEEE Journal of Solid-State Circuits
  • A 64-Pixel 0.42-THz Source SoC With Spatial Modulation Diversity for Computational Imaging, 2020, IEEE Journal of Solid-State Circuits
  • A SiGe HBT 215-240 GHz DCA IQ TX/RX Chipset With Built-In Test of USB/LSB RF Asymmetry for 100+ Gb/s Data Rates, 2021, IEEE Transactions on Microwave Theory and Techniques
  • Broadband Modeling, Analysis, and Characterization of SiGe HBT Terahertz Direct Detectors, 2021, IEEE Transactions on Microwave Theory and Techniques

Best Publications

  • A 1 k-Pixel Video Camera for 0.7–1.1 Terahertz Imaging Applications in 65-nm CMOS

    R. Al Hadi;H. Sherry;J. Grzyb;Yan Zhao

  • Electronic textiles: a platform for pervasive computing

    D. Marculescu;R. Marculescu;N.H. Zamora;P. Stanley-Marbell

  • A Silicon 60-GHz Receiver and Transmitter Chipset for Broadband Communications

    S.K. Reynolds;B.A. Floyd;U.R. Pfeiffer;T. Beukema

  • Terahertz Imaging and Sensing Applications With Silicon-Based Technologies

    Philipp Hillger;Janusz Grzyb;Ritesh Jain;Ullrich R. Pfeiffer

  • Advanced Millimeter-Wave Technologies

    Duixian Liu;Brian Gaucher;Ulrich Pfeiffer;Janusz Grzyb

  • Electrical characterization of textile transmission lines

    D. Cottet;J. Grzyb;T. Kirstein;G. Troster

  • A silicon 60GHz receiver and transmitter chipset for broadband communications

    B. Floyd;S. Reynolds;U. Pfeifer;T. Beukema

  • A chip-scale packaging technology for 60-GHz wireless chipsets

    U.R. Pfeiffer;J. Grzyb;Duixian Liu;B. Gaucher

  • A 16-QAM 100-Gb/s 1-M Wireless Link With an EVM of 17% at 230 GHz in an SiGe Technology

    Pedro Rodriguez-Vazquez;Janusz Grzyb;Bernd Heinemann;Ullrich R. Pfeiffer

  • A Fully Integrated 240-GHz Direct-Conversion Quadrature Transmitter and Receiver Chipset in SiGe Technology

    Neelanjan Sarmah;Janusz Grzyb;Konstantin Statnikov;Stefan Malz

  • A 288-GHz Lens-Integrated Balanced Triple-Push Source in a 65-nm CMOS Technology

    Janusz Grzyb;Yan Zhao;U. R. Pfeiffer

  • A 820GHz SiGe chipset for terahertz active imaging applications

    Erik Ojefors;Janus Grzyb;Yan Zhao;Bernd Heinemann

  • A 1kpixel CMOS camera chip for 25fps real-time terahertz imaging applications

    Hani Sherry;Janusz Grzyb;Yan Zhao;Richard Al Hadi

  • A 210–270-GHz Circularly Polarized FMCW Radar With a Single-Lens-Coupled SiGe HBT Chip

    Janusz Grzyb;Konstantin Statnikov;Neelanjan Sarmah;Bernd Heinemann

  • Si-based packaging with integrated passive components

    Michael Cotte John;Paul Gaucher Brian;Janusz Grzyb;Deneke Hoivik Nils

  • A 0.53 THz Reconfigurable Source Module With Up to 1 mW Radiated Power for Diffuse Illumination in Terahertz Imaging Applications

    Ullrich R. Pfeiffer;Yan Zhao;Janusz Grzyb;Richard Al Hadi

  • 160-GHz to 1-THz Multi-Color Active Imaging With a Lens-Coupled SiGe HBT Chip-Set

    Konstantin Statnikov;Janusz Grzyb;Bernd Heinemann;Ullrich R. Pfeiffer

  • Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas

    Brian P. Gaucher;Janusz Grzyb;Duixian Liu;Ullrich R. Pfeiffer

  • A Terahertz Detector Array in a SiGe HBT Technology

    Richard Al Hadi;Janusz Grzyb;Bernd Heinemann;Ullrich R. Pfeiffer

  • A broadband 0.6 to 1 THz CMOS imaging detector with an integrated lens

    R. Al-Hadi;H. Sherry;J. Grzyb;N. Baktash

  • A QPSK 110-Gb/s Polarization-Diversity MIMO Wireless Link With a 220-255 GHz Tunable LO in a SiGe HBT Technology

    Pedro Rodriguez-Vazquez;Janusz Grzyb;Bernd Heinemann;Ullrich R. Pfeiffer

  • A 65 Gbps QPSK one meter wireless link operating at a 225–255 GHz tunable carrier in a SiGe HBT technology

    Pedro Rodriguez-Vazquez;Janusz Grzyb;Neelanjan Sarmah;Bernd Heinemann

  • 14.5 A 0.53THz reconfigurable source array with up to 1mW radiated power for terahertz imaging applications in 0.13μm SiGe BiCMOS

    Ullrich R. Pfeiffer;Yan Zhao;Janusz Grzyb;Richard Al Hadi

  • Wideband Cavity-backed Folded Dipole Superstrate Antenna for 60 GHz Applications

    J. Grzyb;Duxian Liu;U. Pfeiffer;B. Gaucher

Frequent Co-Authors

Ullrich R. Pfeiffer
Ullrich R. Pfeiffer University of Wuppertal
Bernd Heinemann
Bernd Heinemann Innovations for High Performance Microelectronics
Brian P. Gaucher
Brian P. Gaucher IBM (United States)
Duixian Liu
Duixian Liu IBM (United States)
Patrick Mounaix
Patrick Mounaix University of Bordeaux
Brian Floyd
Brian Floyd North Carolina State University
Scott K. Reynolds
Scott K. Reynolds IBM (United States)
Andreia Cathelin
Andreia Cathelin STMicroelectronics (Switzerland)
Christopher V. Jahnes
Christopher V. Jahnes IBM (United States)

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